Bonded assembly including interconnect-level bonding pads and methods of forming the same

ABSTRACT

A bonded assembly includes a first semiconductor die that includes first metallic bonding structures embedded within a first bonding-level dielectric layer, and a second semiconductor die that includes second metallic bonding structures embedded within a second bonding-level dielectric layer and bonded to the first metallic bonding structures by metal-to-metal bonding. One of the first metallic bonding structures a pad portion, and a via portion located between the pad portion and the first semiconductor device, the via portion having second tapered sidewalls.

RELATED APPLICATIONS

This application is a continuation-in-part (CIP) application of U.S. patent application Ser. No. 17/542,963 filed on Dec. 6, 2021, which is a CIP application of U.S. patent application Ser. No. 17/118,036 filed on Dec. 10, 2020, which is a CIP application of U.S. patent application Ser. No. 16/825,304 filed on Mar. 20, 2020, the entire contents of which are incorporated herein by reference.

FIELD

The present disclosure relates generally to the field of semiconductor devices, and particularly to a semiconductor structure including interconnect-level bonding structures and methods for forming the same.

BACKGROUND

A semiconductor memory device may include a memory array and driver circuit located on the same substrate. However, the driver circuit takes up valuable space on the substrate, thus reducing the space available for the memory array. A bonded assembly of a memory die and a logic die including a driver circuit may alleviate this problem.

SUMMARY

According to an aspect of the present disclosure, a bonded assembly is provided, which comprises: a first semiconductor die that comprises first semiconductor devices, first interconnect-level dielectric material layers embedding first metal interconnect structures, and first metallic bonding structures embedded within a first bonding-level dielectric layer; and a second semiconductor die that comprises second semiconductor devices, second interconnect-level dielectric material layers embedding second metal interconnect structures, and second metallic bonding structures embedded within a second bonding-level dielectric layer and bonded to the first metallic bonding structures by metal-to-metal bonding, wherein one of the first metallic bonding structures comprises a pad portion; and a via portion located between the pad portion and the first semiconductor device, the via portion having second tapered sidewalls.

According to another aspect of the present disclosure, a method of forming a bonded assembly is provided, which comprises: forming a first semiconductor die, wherein the first semiconductor die comprises first semiconductor devices, first interconnect-level dielectric material layers embedding first metal interconnect structures, and first metallic bonding structures embedded within a first bonding-level dielectric layer, wherein one of the first metallic bonding structures comprises: first tapered sidewalls that are laterally spaced apart along a first horizontal direction, laterally extending along a second horizontal direction, and having a first taper angle with respective to a vertical direction; and second tapered sidewalls that are laterally spaced apart along the first horizontal direction, laterally extending along the second horizontal direction, having top edges located within a horizontal plane including bottom edges of the first tapered sidewalls, and having a second taper angle within respect to the vertical direction, and wherein the second taper angle is greater than the first taper angle by at least a factor of 3, and is in a range from 25 degrees to 55 degrees. The method further comprises providing a second semiconductor die, the second semiconductor die comprising second semiconductor devices, second interconnect-level dielectric material layers embedding second metal interconnect structures, and second metallic bonding structures embedded within a second; and bonding the second metallic bonding structures to the first metallic bonding structures.

According to an aspect of the present disclosure, a method of forming a bonded assembly includes providing a first semiconductor die containing first semiconductor devices, first interconnect-level dielectric material layers embedding first metal interconnect structures and first metallic bonding structures, and a first dielectric capping layer containing openings and contacting distal horizontal surfaces of the first metallic bonding structures, providing a second semiconductor die containing second semiconductor devices, second interconnect-level dielectric material layers embedding second metal interconnect structures, and second metallic bonding structures, disposing the second semiconductor die in contact with the first semiconductor die, and annealing the second semiconductor die in contact with the first semiconductor die such that a metallic material of at least one of the first metallic bonding structures and the second metallic bonding structures expands to fill the openings in the first dielectric capping layer to bond at least a first subset of the first metallic bonding structures to at least a first subset of the second metallic bonding structures.

According to another aspect of the present disclosure a bonded assembly includes a first semiconductor die that comprises first semiconductor devices, first interconnect-level dielectric material layers embedding first metal interconnect structures and first metallic bonding structures, and a first dielectric capping layer contacting distal horizontal surfaces of the first metallic bonding structures and distal horizontal surfaces of a subset of the first metal interconnect structures, and a second semiconductor die that comprises second semiconductor devices, second interconnect-level dielectric material layers embedding second metal interconnect structures, and second metallic bonding structures. A first subset of the second metallic bonding structures comprises a respective vertically protruding portion that protrudes through a respective opening in the first dielectric capping layer and contacting a bonding surface of a respective one of the first metallic bonding structures.

According to an aspect of the present disclosure, a bonded assembly is provided, which comprises: a first semiconductor die that comprises first semiconductor devices, and a first pad-level dielectric layer and embedding first bonding pads; and a second semiconductor die that comprises second semiconductor devices, and a second pad-level dielectric layer embedding second bonding pads that includes a respective second pad base portion, wherein each of the second bonding pads is bonded to a respective one of the first bonding pads. Each of the first bonding pads comprises a respective first pad base portion and a respective first material portion comprising a different material than the first pad base portion, such as a respective first metal alloy material portion having a higher coefficient of thermal expansion (CTE) than the respective first pad base portion.

According to another aspect of the present disclosure, a method of forming a bonded assembly is provided. The method comprises: providing a first semiconductor die that comprises first semiconductor devices located over a first substrate, and a first pad-level dielectric layer and embedding first bonding pads; providing a second semiconductor die that comprises second semiconductor devices located over a second substrate, and a second pad-level dielectric layer embedding second bonding pads that include a respective second pad base portion; and forming a bonded assembly by bonding the second bonding pads to a respective one of the first bonding pads, wherein each of the first bonding pads comprises a respective first pad base portion and a respective first metal alloy material portion having a higher coefficient of thermal expansion (CTE) than the respective first pad base portion.

According to an aspect of the present disclosure, a structure comprising a first semiconductor die is provided. The first semiconductor die comprises: first semiconductor devices located over a first substrate; first interconnect-level dielectric material layers embedding first metal interconnect structures and located on the first semiconductor devices; and a first pad-level dielectric layer located on the first interconnect-level dielectric material layers and embedding first bonding pads, wherein each of the first bonding pads comprises a first pad base portion and at least one first pad pillar portion that has a lesser area than the first pad base portion, and is more distal from the first substrate than the first pad base portion is from the first substrate.

According to another aspect of the present disclosure, a method of forming a structure is provided. The method comprises forming a first semiconductor die by performing processing steps of: forming first semiconductor devices over a first substrate; forming first interconnect-level dielectric material layers embedding first metal interconnect structures over the first semiconductor devices; and forming a pad-level dielectric layer embedding first bonding pads over the first interconnect-level dielectric material layers, wherein each of the first bonding pads comprises a first pad base portion and at least one first pad pillar portion that has a lesser area than the first pad base portion, and is more distal from the first substrate than the first pad base portion is from the first substrate.

According to yet another aspect of the present disclosure, a structure comprising a first semiconductor die is provided. The first semiconductor die comprises: first semiconductor devices located over a first substrate; first interconnect-level dielectric material layers embedding first metal interconnect structures and located on the first semiconductor devices; and a first pad-level dielectric layer located on the first interconnect-level dielectric material layers and embedding first bonding pads, wherein each of the first bonding pads comprises a first proximal horizontal surface and a first distal horizontal surface that is more distal from the first substrate than the first proximal horizontal surface is from the first substrate and has a lesser total area than a total area of the first proximal horizontal surface.

According to still another aspect of the present disclosure, a method of forming a structure is provided. The method comprising forming a first semiconductor die by performing processing steps of: forming first semiconductor devices over a first substrate; forming first interconnect-level dielectric material layers embedding first metal interconnect structures over the first semiconductor devices; forming a first pad-level dielectric layer over the first interconnect-level dielectric material layers; and forming first bonding pads in the first pad-level dielectric layer, wherein each of the first bonding pads comprises a first proximal horizontal surface and a first distal horizontal surface that is more distal from the first substrate than the first proximal horizontal surface is from the first substrate, and the first distal horizontal surface has a lesser total area than a total area of the first proximal horizontal surface.

According to an aspect of the present disclosure, a structure comprising a first semiconductor die is provided. The first semiconductor die comprises: first semiconductor devices located over a first substrate; first interconnect-level dielectric material layers embedding first metal interconnect structures and located on the first semiconductor devices; and a first pad-level dielectric layer located on the first interconnect-level dielectric material layers and embedding first bonding pads, wherein each of the first bonding pads comprises a first proximal horizontal surface and at least one first distal horizontal surface that is more distal from the first substrate than the first proximal horizontal surface is from the first substrate and has a lesser total area than a total area of the first proximal horizontal surface.

According to another aspect of the present disclosure, a method of forming a structure is provided. The method comprises forming a first semiconductor die by performing processing steps of: forming first semiconductor devices over a first substrate; forming first interconnect-level dielectric material layers embedding first metal interconnect structures over the first semiconductor devices; forming a first pad-level dielectric layer over the first interconnect-level dielectric material layers; and forming first bonding pads in the first pad-level dielectric layer such that the each of the first bonding pads comprises a first proximal horizontal surface and at least one first distal horizontal surface that is more distal from the first substrate than the first proximal horizontal surface is from the first substrate and has a lesser total area than a total area of the first proximal horizontal surface.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic vertical cross-sectional view of a first configuration of a first semiconductor die after formation of a first pad-connection-level dielectric layer and pad-connection via structures according to a first embodiment of the present disclosure.

FIG. 1B is a schematic vertical cross-sectional view of the first configuration of the first semiconductor die after formation of a first proximal pad-level dielectric layer and first pad base portions according to the first embodiment of the present disclosure.

FIG. 1C is a top-down view of the first configuration of the first semiconductor die of FIG. 1B.

FIG. 1D is a schematic vertical cross-sectional view of the first configuration of the first semiconductor die after formation of a first distal pad-level dielectric layer and first pillar cavities according to the first embodiment of the present disclosure.

FIG. 1E is a schematic vertical cross-sectional view of the first configuration of the first semiconductor die after formation of first pad pillar portions according to the first embodiment of the present disclosure.

FIG. 1F is a top-down view of the first semiconductor die of FIG. 1E.

FIG. 2A is a schematic vertical cross-sectional view of a variant of the first configuration of the first semiconductor die after formation of first pad pillar portions according to the first embodiment of the present disclosure.

FIG. 2B is a top-down view of the variant of the configuration of the first semiconductor die of FIG. 2A.

FIG. 3A is a schematic vertical cross-sectional view of a second configuration of the first semiconductor die after formation of a first distal pad-level dielectric layer and first pillar cavities according to the second embodiment of the present disclosure.

FIG. 3B is a top-down view of the second configuration of the first semiconductor die of FIG. 3A.

FIG. 3C is a schematic vertical cross-sectional view of the second configuration of the first semiconductor die after formation of first proximal pad cavities according to the second embodiment of the present disclosure.

FIG. 3D is a schematic vertical cross-sectional view of the second configuration of the first semiconductor die after selective growth of a metallic liner according to the second embodiment of the present disclosure.

FIG. 3E is a schematic vertical cross-sectional view of the second configuration of the first semiconductor die after formation of first pad base portions according to the second embodiment of the present disclosure.

FIG. 3F is a schematic vertical cross-sectional view of the second configuration of the first semiconductor die after formation of first pad pillar portions according to the second embodiment of the present disclosure.

FIG. 3G is a schematic vertical cross-sectional view of a variant of the second configuration of the first semiconductor die according to the second embodiment of the present disclosure.

FIG. 3H is a schematic vertical cross-sectional view of another variant of the second configuration of the first semiconductor die according to the second embodiment of the present disclosure.

FIG. 4A is a schematic vertical cross-sectional view of a third configuration of the first semiconductor die after formation of a sacrificial material layer according to a third embodiment of the present disclosure.

FIG. 4B is a schematic vertical cross-sectional view of the third configuration of the first semiconductor die after patterning the sacrificial material layer into sacrificial mesa structures according to the third embodiment of the present disclosure.

FIG. 4C is a schematic vertical cross-sectional view of the third configuration of the first semiconductor die after formation of a first pad-level dielectric layer according to the third embodiment of the present disclosure.

FIG. 4D is a top-down view of the third configuration of the first semiconductor die of FIG. 4C.

FIG. 4E is a schematic vertical cross-sectional view of the third configuration of the first semiconductor die after formation of a first cavities according to the third embodiment of the present disclosure.

FIG. 4F is a schematic vertical cross-sectional view of the third configuration of the first semiconductor die after formation of a first bonding pads according to the third embodiment of the present disclosure.

FIG. 4G is a top-down view of the third configuration of the first semiconductor die of FIG. 4F.

FIG. 5A is a schematic vertical cross-sectional view of a fourth configuration of the first semiconductor die after formation of a sacrificial material layer according to a fourth embodiment of the present disclosure.

FIG. 5B is a schematic vertical cross-sectional view of the fourth configuration of the first semiconductor die after patterning the sacrificial material layer into sacrificial mesa structures according to the fourth embodiment of the present disclosure.

FIG. 5C is a schematic vertical cross-sectional view of the fourth configuration of the first semiconductor die after formation of a first pad-level dielectric layer according to the fourth embodiment of the present disclosure.

FIG. 5D is a top-down view of the fourth configuration of the first semiconductor die of FIG. 5C.

FIG. 5E is a schematic vertical cross-sectional view of the fourth configuration of the first semiconductor die after formation of a first cavities according to the fourth embodiment of the present disclosure.

FIG. 5F is a schematic vertical cross-sectional view of the fourth configuration of the first semiconductor die after formation of a first bonding pads according to the fourth embodiment of the present disclosure.

FIG. 5G is a top-down view of the fourth configuration of the first semiconductor die of FIG. 5F.

FIG. 6A is a schematic vertical cross-sectional view of a fifth configuration of the first semiconductor die after formation of a metallic liner and a metallic pad material layer according to a fifth embodiment of the present disclosure.

FIG. 6B is a schematic vertical cross-sectional view of the fifth configuration of the first semiconductor die after patterning the bonding pads according to the fifth embodiment of the present disclosure.

FIG. 6C is a schematic vertical cross-sectional view of the fifth configuration of the first semiconductor die after formation of a first pad-level dielectric layer according to the fifth embodiment of the present disclosure.

FIG. 7A is a schematic vertical cross-sectional view of a sixth configuration of the first semiconductor die after formation of a metallic liner and a metallic pad material layer according to a sixth embodiment of the present disclosure.

FIG. 7B is a schematic vertical cross-sectional view of the sixth configuration of the first semiconductor die after patterning the bonding pads according to the sixth embodiment of the present disclosure.

FIG. 7C is a schematic vertical cross-sectional view of the sixth configuration of the first semiconductor die after formation of a first pad-level dielectric layer according to the sixth embodiment of the present disclosure.

FIG. 8A is a vertical cross-sectional view of a first configuration of a second semiconductor die according to an embodiment of the present disclosure.

FIG. 8B is a vertical cross-sectional view of a variant of the first configuration of a second semiconductor die according to an embodiment of the present disclosure.

FIG. 8C is a vertical cross-sectional view of a second configuration of a second semiconductor die according to an embodiment of the present disclosure.

FIG. 8D is a vertical cross-sectional view of a first variant of the second configuration of a second semiconductor die according to an embodiment of the present disclosure.

FIG. 8E is a vertical cross-sectional view of a second variant of the second configuration of a second semiconductor die according to an embodiment of the present disclosure.

FIG. 9 is a vertical cross-sectional view of a third configuration of a second semiconductor die according to an embodiment of the present disclosure.

FIG. 10 is a vertical cross-sectional view of a fourth configuration of a second semiconductor die according to an embodiment of the present disclosure.

FIG. 11A is a schematic vertical cross-sectional view of a first exemplary structure including a first configuration of the first semiconductor die and a first configuration of the second semiconductor die after bonding the first semiconductor die with the second semiconductor die according to an embodiment of the present disclosure.

FIG. 11B is a schematic vertical cross-sectional view of the first exemplary structure after thinning the first semiconductor die from the backside according to an embodiment of the present disclosure.

FIG. 11C is a schematic vertical cross-sectional view of the first exemplary structure after formation of a backside insulating layer, external bonding pads, and solder material portions according to an embodiment of the present disclosure.

FIGS. 11D and 11E are schematic vertical cross-sectional views of variants of the first exemplary structure of FIG. 11C in which only one semiconductor die has reentrant profile bonding pads.

FIG. 12 is a schematic vertical cross-sectional view of a variant of the first exemplary structure after formation of a backside insulating layer, external bonding pads, and solder material portions according to an embodiment of the present disclosure.

FIG. 13 is a schematic vertical cross-sectional view of a second exemplary structure after formation of a backside insulating layer, external bonding pads, and solder material portions according to an embodiment of the present disclosure.

FIG. 14 is a schematic vertical cross-sectional view of a third exemplary structure after formation of a backside insulating layer, external bonding pads, and solder material portions according to an embodiment of the present disclosure.

FIG. 15 is a schematic vertical cross-sectional view of a fourth exemplary structure after formation of a backside insulating layer, external bonding pads, and solder material portions according to an embodiment of the present disclosure.

FIGS. 16A-16D are sequential vertical cross-sectional views of a first configuration of a first bonding pad for a fifth exemplary structure according to an embodiment of the present disclosure.

FIGS. 17A-17C are sequential vertical cross-sectional views of a second configuration of a first bonding pad for the fifth exemplary structure according to an embodiment of the present disclosure.

FIG. 18 is a vertical cross-sectional view of the fifth exemplary structure after aligning two semiconductor dies and prior to bonding according to an embodiment of the present disclosure.

FIG. 19 is a vertical cross-sectional view of the fifth exemplary structure after formation of a bonded assembly according to an embodiment of the present disclosure.

FIGS. 20A and 20B are sequential vertical cross-sectional views of a third configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIGS. 21A and 21B are sequential vertical cross-sectional views of a fourth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIGS. 22A and 22B are sequential vertical cross-sectional views of a fifth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIGS. 23A-23D are sequential vertical cross-sectional views of a sixth configuration of a first bonding pad for the fifth exemplary structure according to an embodiment of the present disclosure.

FIGS. 24A-24C are sequential vertical cross-sectional views of an alternative to the sixth configuration of a first bonding pad for the fifth exemplary structure according to an embodiment of the present disclosure.

FIGS. 25A and 25B are sequential vertical cross-sectional views of the sixth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIGS. 26A and 26B are sequential vertical cross-sectional views of a seventh configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIGS. 27A and 27B are sequential vertical cross-sectional views of an eighth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIGS. 28A and 28B are sequential vertical cross-sectional views of a ninth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIGS. 29A and 29B are sequential vertical cross-sectional views of a tenth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIGS. 30A and 30B are sequential vertical cross-sectional views of an eleventh configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIGS. 31A and 31B are sequential vertical cross-sectional views of a twelfth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

FIG. 32A is a vertical cross-sectional view of a first semiconductor die for a sixth exemplary structure after formation of first interconnect-level dielectric material layers embedding first metal interconnect structures and first metallic bonding structures according to an embodiment of the present disclosure.

FIG. 32B is a vertical cross-sectional view of the first semiconductor die for the sixth exemplary structure after formation of a first dielectric capping layer according to an embodiment of the present disclosure.

FIG. 32C is a vertical cross-sectional view of a second semiconductor die for the sixth exemplary structure after formation of second bonding pads according to an embodiment of the present disclosure.

FIG. 32D is a vertical cross-sectional view of the sixth exemplary structure after disposing the first semiconductor die on the second semiconductor die according to an embodiment of the present disclosure.

FIG. 32E is a vertical cross-sectional view of the sixth exemplary structure after bonding the first semiconductor die to the second semiconductor die according to an embodiment of the present disclosure.

FIG. 32F is a vertical cross-sectional view of the sixth exemplary structure after thinning a first semiconductor substrate and forming backside bonding pads according to an embodiment of the present disclosure.

FIG. 32G is a vertical cross-sectional view of a first alternative configuration of the sixth exemplary structure according to an embodiment of the present disclosure.

FIG. 32H is a vertical cross-sectional view of a second alternative configuration of the sixth exemplary structure according to an embodiment of the present disclosure.

FIG. 33A is a vertical cross-sectional view of a first semiconductor die for a seventh exemplary structure after formation of first bonding pads according to an embodiment of the present disclosure.

FIG. 33B is a vertical cross-sectional view of a second semiconductor die for the seventh exemplary structure after formation of second interconnect-level dielectric material layers embedding second metal interconnect structures and second metallic bonding structures according to an embodiment of the present disclosure.

FIG. 33C is a vertical cross-sectional view of a second semiconductor die for the seventh exemplary structure after formation of a second dielectric capping layer according to an embodiment of the present disclosure.

FIG. 33D is a vertical cross-sectional view of the seventh exemplary structure after disposing the first semiconductor die on the second semiconductor die according to an embodiment of the present disclosure.

FIG. 33E is a vertical cross-sectional view of the seventh exemplary structure after bonding the first semiconductor die to the second semiconductor die according to an embodiment of the present disclosure.

FIG. 33F is a vertical cross-sectional view of the seventh exemplary structure after thinning a first semiconductor substrate and forming backside bonding pads according to an embodiment of the present disclosure.

FIG. 33G is a vertical cross-sectional view of an alternative configuration of the seventh exemplary structure according to an embodiment of the present disclosure.

FIG. 34A is a vertical cross-sectional view of a first semiconductor die for an eighth exemplary structure after formation of a first dielectric capping layer according to an embodiment of the present disclosure.

FIG. 34B is a vertical cross-sectional view of a second semiconductor die for the eighth exemplary structure after formation of a second dielectric capping layer according to an embodiment of the present disclosure.

FIG. 34C is a vertical cross-sectional view of the eighth exemplary structure after disposing the first semiconductor die on the second semiconductor die according to an embodiment of the present disclosure.

FIG. 34D is a vertical cross-sectional view of the eighth exemplary structure after bonding the first semiconductor die to the second semiconductor die according to an embodiment of the present disclosure.

FIG. 34E is a vertical cross-sectional view of the eighth exemplary structure after thinning a first semiconductor substrate and forming backside bonding pads according to an embodiment of the present disclosure.

FIG. 34F is a vertical cross-sectional view of a first alternative configuration of the eighth exemplary structure according to an embodiment of the present disclosure.

FIG. 34G is a vertical cross-sectional view of a second alternative configuration of the eighth exemplary structure according to an embodiment of the present disclosure.

FIG. 35 is a vertical cross-sectional view of a memory die for forming a ninth exemplary structure according to an embodiment of the present disclosure.

FIGS. 36A-36C are various views of a first configuration of a metallic bonding structure in the memory die of FIG. 35. FIGS. 36A and 36B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 36C, respectively. FIG. 36C is a top-down view.

FIG. 36D is a vertical cross-sectional view of the first configuration of the metallic bonding structure of FIGS. 36A-36C along a vertical plane that corresponds to the vertical plane A-A′ of FIG. 36C in case the memory die of FIG. 35 is subjected to an anneal process without any mating semiconductor die.

FIG. 36E is a vertical cross-sectional view of the first configuration of the metallic bonding structure of FIGS. 36A-36C along a vertical plane that corresponds to the vertical plane B-B′ of FIG. 36C in case the memory die of FIG. 35 is subjected to an anneal process without any mating semiconductor die.

FIGS. 37A-37C are various views of a second configuration of a metallic bonding structure in the memory die of FIG. 35. FIGS. 37A and 37B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 37C, respectively. FIG. 37C is a top-down view.

FIG. 37D is a vertical cross-sectional view of the second configuration of the metallic bonding structure of FIGS. 37A-37C along a vertical plane that corresponds to the vertical plane A-A′ of FIG. 37C in case the memory die of FIG. 35 is subjected to an anneal process without any mating semiconductor die.

FIG. 37E is a vertical cross-sectional view of the second configuration of the metallic bonding structure of FIGS. 37A-37C along a vertical plane that corresponds to the vertical plane B-B′ of FIG. 37C in case the memory die of FIG. 35 is subjected to an anneal process without any mating semiconductor die.

FIGS. 38A-38C are various views of a third configuration of a metallic bonding structure in the memory die of FIG. 35. FIGS. 38A and 38B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 38C, respectively. FIG. 38C is a top-down view.

FIG. 38D is a vertical cross-sectional view of the third configuration of the metallic bonding structure of FIGS. 38A-38C along a vertical plane that corresponds to the vertical plane A-A′ of FIG. 38C in case the memory die of FIG. 35 is subjected to an anneal process without any mating semiconductor die.

FIG. 38E is a vertical cross-sectional view of the third configuration of the metallic bonding structure of FIGS. 38A-38C along a vertical plane that corresponds to the vertical plane B-B′ of FIG. 38C in case the memory die of FIG. 35 is subjected to an anneal process without any mating semiconductor die.

FIG. 39 is a vertical cross-sectional view of a logic die for forming a ninth exemplary structure according to an embodiment of the present disclosure.

FIGS. 40A-40C are various views of a first configuration of a metallic bonding structure in the logic die of FIG. 39. FIGS. 40A and 40B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 40C, respectively. FIG. 40C is a top-down view.

FIG. 40D is a vertical cross-sectional view of the first configuration of the metallic bonding structure of FIGS. 40A-40C along a vertical plane that corresponds to the vertical plane A-A′ of FIG. 40C in case the logic die of FIG. 39 is subjected to an anneal process without any mating semiconductor die.

FIG. 40E is a vertical cross-sectional view of the first configuration of the metallic bonding structure of FIGS. 40A-40C along a vertical plane that corresponds to the vertical plane B-B′ of FIG. 40C in case the logic die of FIG. 39 is subjected to an anneal process without any mating semiconductor die.

FIGS. 41A-41C are various views of a second configuration of a metallic bonding structure in the logic die of FIG. 39. FIGS. 41A and 41B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 41C, respectively. FIG. 41C is a top-down view.

FIG. 41D is a vertical cross-sectional view of the second configuration of the metallic bonding structure of FIGS. 41A-41C along a vertical plane that corresponds to the vertical plane A-A′ of FIG. 41C in case the logic die of FIG. 39 is subjected to an anneal process without any mating semiconductor die.

FIG. 41E is a vertical cross-sectional view of the second configuration of the metallic bonding structure of FIGS. 41A-41C along a vertical plane that corresponds to the vertical plane B-B′ of FIG. 41C in case the logic die of FIG. 39 is subjected to an anneal process without any mating semiconductor die.

FIGS. 42A-42C are various views of a third configuration of a metallic bonding structure in the logic die of FIG. 39. FIGS. 42A and 42B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 42C, respectively. FIG. 42C is a top-down view.

FIG. 42D is a vertical cross-sectional view of the third configuration of the metallic bonding structure of FIGS. 42A-42C along a vertical plane that corresponds to the vertical plane A-A′ of FIG. 42C in case the logic die of FIG. 39 is subjected to an anneal process without any mating semiconductor die.

FIG. 42E is a vertical cross-sectional view of the third configuration of the metallic bonding structure of FIGS. 42A-42C along a vertical plane that corresponds to the vertical plane B-B′ of FIG. 42C in case the logic die of FIG. 39 is subjected to an anneal process without any mating semiconductor die.

FIG. 43 is a vertical cross-sectional view of a ninth exemplary structure after disposing a memory die on a logic die for bonding according to an embodiment of the present disclosure.

FIG. 44 is a vertical cross-sectional view of the ninth exemplary structure after bonding the memory die to the logic die according to an embodiment of the present disclosure.

FIG. 45 is a vertical cross-sectional view of an alternative embodiment of the ninth exemplary structure in case the memory die is bonded to the logic die with an overlay offset among the metallic bonding structures according to an embodiment of the present disclosure.

FIG. 46 is a vertical cross-sectional view of the ninth exemplary structure after formation of backside metallic bonding structures according to an embodiment of the present disclosure.

FIG. 47 is a vertical cross-sectional view of a memory die for forming a tenth exemplary structure according to an embodiment of the present disclosure.

FIGS. 48A-48C are various views of a first configuration of a metallic bonding structure in the memory die of FIG. 47. FIGS. 48A and 48B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 48C, respectively. FIG. 48C is a top-down view.

FIGS. 49A-49C are various views of a second configuration of a metallic bonding structure in the memory die of FIG. 47. FIGS. 49A and 49B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 49C, respectively. FIG. 49C is a top-down view.

FIGS. 50A-50C are various views of a third configuration of a metallic bonding structure in the memory die of FIG. 47. FIGS. 50A and 50B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 50C, respectively. FIG. 50C is a top-down view.

FIG. 51 is a vertical cross-sectional view of a logic die for forming a tenth exemplary structure according to an embodiment of the present disclosure.

FIGS. 52A-52C are various views of a first configuration of a metallic bonding structure in the logic die of FIG. 51. FIGS. 52A and 52B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 52C, respectively. FIG. 52C is a top-down view.

FIGS. 53A-53C are various views of a second configuration of a metallic bonding structure in the logic die of FIG. 51. FIGS. 53A and 53B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 53C, respectively. FIG. 53C is a top-down view.

FIGS. 54A-53C are various views of a third configuration of a metallic bonding structure in the logic die of FIG. 51. FIGS. 54A and 54B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 54C, respectively. FIG. 54C is a top-down view.

FIG. 55 is a vertical cross-sectional view of a tenth exemplary structure after disposing a memory die on a logic die for bonding according to an embodiment of the present disclosure.

FIG. 56 is a vertical cross-sectional view of the tenth exemplary structure after bonding the memory die to the logic die according to an embodiment of the present disclosure.

FIG. 57 is a vertical cross-sectional view of an alternative embodiment of the tenth exemplary structure in case the memory die is bonded to the logic die with an overlay offset among the metallic bonding structures according to an embodiment of the present disclosure.

FIG. 58 is a vertical cross-sectional view of an alternative configuration of the tenth exemplary structure after formation of backside metallic bonding structures according to an embodiment of the present disclosure.

FIGS. 59A-59C are various views of a comparative exemplary metallic bonding structure that may be employed in the memory die of FIG. 35. FIGS. 59A and 59B are vertical cross-sectional views along the vertical plane A-A′ or B-B′ in FIG. 59C, respectively. FIG. 59C is a top-down view.

FIG. 59D is a vertical cross-sectional view of the comparative exemplary metallic bonding structure of FIGS. 59A-59C along a vertical plane that corresponds to the vertical plane A-A′ of FIG. 59C in case the comparative exemplary metallic bonding structure is subjected to an anneal process without any mating semiconductor die.

FIG. 59E is a vertical cross-sectional view of the comparative exemplary metallic bonding structure of FIGS. 59A-59C along a vertical plane that corresponds to the vertical plane B-B′ of FIG. 59C in case the comparative exemplary metallic bonding structure is subjected to an anneal process without any mating semiconductor die.

FIG. 60A is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of comparative exemplary metallic bonding structures having the configuration of FIGS. 59A-59C during an anneal process in case the overlay error is zero.

FIG. 60B is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of comparative exemplary metallic bonding structures having the configuration of FIGS. 59A-59C during an anneal process in case the overlay error is 150 nm and the lateral dimension of each comparative exemplary metallic bonding structures is 165 nm.

FIG. 60C is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of exemplary metallic bonding structures in the ninth exemplary structure illustrated in FIG. 44 during an anneal process in case the overlay error is zero.

FIG. 60D is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of exemplary metallic bonding structures in the ninth exemplary structure illustrated in FIG. 45 during an anneal process in case the overlay error is 150 nm and the lateral dimension of each comparative exemplary metallic bonding structures is 165 nm.

FIG. 60E is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of exemplary metallic bonding structures in the tenth exemplary structure illustrated in FIG. 56 during an anneal process in case the overlay error is zero.

FIG. 60F is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of exemplary metallic bonding structures in the tenth exemplary structure illustrated in FIG. 57 during an anneal process in case the overlay error is 150 nm and the lateral dimension of each comparative exemplary metallic bonding structures is 165 nm.

DETAILED DESCRIPTION

A first semiconductor die can be bonded to a second semiconductor die via metal-to-metal bonding between opposing sets of metal bonding pads. Dielectric-to-dielectric bonding between facing pairs of pad-level dielectric layers is desired to enhance the bonding strength between the first semiconductor die and the second semiconductor die. The metallic surfaces of the bonding pads are vertically recessed prior to bonding because the bonding pads thermally expand during the bonding process. Precise recess depth control is desired to ensure that the thermally expanded metallic surfaces and the surfaces of the pad-level dielectric layers line up at a horizontal bonding interface. If the recess depth of the bonding pads is too great, bonding between the bonding pads is hampered because the facing pairs of bonding pads do not contact each other (i.e., a void is formed between the bonding pads) while the pad-level dielectric layers are bonded to each other. If the recess depth of the bonding pad is too small, facing pairs of bonding pads protrude above the physically exposed surfaces of the pad-level dielectric layers and degrade bonding between the pad-level dielectric layers (i.e., a void is formed between the dielectric layers). Thus, simultaneously providing metal-to-metal bonding and dielectric-to-dielectric bonding between a pair of semiconductor dies poses a challenge in semiconductor manufacturing. The embodiments of the present disclosure are directed to a semiconductor structure containing reentrant shaped bonding pads (e.g., bonding pads which “point” toward the bonding interface and have a smaller distal area at the bonding interface than a proximal area away from the bonding interface) and methods for forming the same. A semiconductor die including reduced contact area bonding pads may be employed to form a bonded assembly of at least two semiconductor dies. The area of the bonding surface can be reduced employing pillar portions or a mesa-shaped vertical profile in the bonding pads, and can be advantageously employed to more effectively accommodate height variations in the bonding surfaces of the bonding pads. The various aspects of embodiments of the present disclosure are described in detail herebelow.

The drawings are not drawn to scale. Multiple instances of an element may be duplicated where a single instance of the element is illustrated, unless absence of duplication of elements is expressly described or clearly indicated otherwise. Ordinals such as “first,” “second,” and “third” are used merely to identify similar elements, and different ordinals may be used across the specification and the claims of the instant disclosure. The term “at least one” element refers to all possibilities including the possibility of a single element and the possibility of multiple elements.

The same reference numerals refer to the same element or similar element. Unless otherwise indicated, elements having the same reference numerals are presumed to have the same composition and the same function. Unless otherwise indicated, a “contact” between elements refers to a direct contact between elements that provides an edge or a surface shared by the elements. If two or more elements are not in direct contact with each other or among one another, the two elements are “disjoined from” each other or “disjoined among” one another. As used herein, a first element located “on” a second element can be located on the exterior side of a surface of the second element or on the interior side of the second element. As used herein, a first element is located “directly on” a second element if there exist a physical contact between a surface of the first element and a surface of the second element. As used herein, a first element is “electrically connected to” a second element if there exists a conductive path consisting of at least one conductive material between the first element and the second element. As used herein, a “prototype” structure or an “in-process” structure refers to a transient structure that is subsequently modified in the shape or composition of at least one component therein.

As used herein, a “layer” refers to a material portion including a region having a thickness. A layer may extend over the entirety of an underlying or overlying structure, or may have an extent less than the extent of an underlying or overlying structure. Further, a layer may be a region of a homogeneous or inhomogeneous continuous structure that has a thickness less than the thickness of the continuous structure. For example, a layer may be located between any pair of horizontal planes between, or at, a top surface and a bottom surface of the continuous structure. A layer may extend horizontally, vertically, and/or along a tapered surface. A substrate may be a layer, may include one or more layers therein, or may have one or more layer thereupon, thereabove, and/or therebelow.

As used herein, a first surface and a second surface are “vertically coincident” with each other if the second surface overlies or underlies the first surface and there exists a vertical plane or a substantially vertical plane that includes the first surface and the second surface. A substantially vertical plane is a plane that extends straight along a direction that deviates from a vertical direction by an angle less than 5 degrees. A vertical plane or a substantially vertical plane is straight along a vertical direction or a substantially vertical direction, and may, or may not, include a curvature along a direction that is perpendicular to the vertical direction or the substantially vertical direction.

As used herein, a “memory level” or a “memory array level” refers to the level corresponding to a general region between a first horizontal plane (i.e., a plane parallel to the top surface of the substrate) including topmost surfaces of an array of memory elements and a second horizontal plane including bottommost surfaces of the array of memory elements. As used herein, a “through-stack” element refers to an element that vertically extends through a memory level.

As used herein, a “semiconducting material” refers to a material having electrical conductivity in the range from 1.0×10⁻⁵ S/m to 1.0×10⁵ S/m. As used herein, a “semiconductor material” refers to a material having electrical conductivity in the range from 1.0×10⁻⁵ S/m to 1.0 S/m in the absence of electrical dopants therein, and is capable of producing a doped material having electrical conductivity in a range from 1.0 S/m to 1.0×10⁵ S/m upon suitable doping with an electrical dopant. As used herein, an “electrical dopant” refers to a p-type dopant that adds a hole to a valence band within a band structure, or an n-type dopant that adds an electron to a conduction band within a band structure. As used herein, a “conductive material” refers to a material having electrical conductivity greater than 1.0×10⁵ S/m. As used herein, an “insulator material” or a “dielectric material” refers to a material having electrical conductivity less than 1.0×10⁻⁵ S/m. As used herein, a “heavily doped semiconductor material” refers to a semiconductor material that is doped with electrical dopant at a sufficiently high atomic concentration to become a conductive material either as formed as a crystalline material or if converted into a crystalline material through an anneal process (for example, from an initial amorphous state), i.e., to have electrical conductivity greater than 1.0×10⁵ S/m. A “doped semiconductor material” may be a heavily doped semiconductor material, or may be a semiconductor material that includes electrical dopants (i.e., p-type dopants and/or n-type dopants) at a concentration that provides electrical conductivity in the range from 1.0×10⁻⁵ S/m to 1.0×10⁵ S/m. An “intrinsic semiconductor material” refers to a semiconductor material that is not doped with electrical dopants. Thus, a semiconductor material may be semiconducting or conductive, and may be an intrinsic semiconductor material or a doped semiconductor material. A doped semiconductor material may be semiconducting or conductive depending on the atomic concentration of electrical dopants therein. As used herein, a “metallic material” refers to a conductive material including at least one metallic element therein. All measurements for electrical conductivities are made at the standard condition.

The various three-dimensional memory devices of the present disclosure include a monolithic three-dimensional NAND string memory device, and may be fabricated using the various embodiments described herein. The monolithic three-dimensional NAND string is located in a monolithic, three-dimensional array of NAND strings located over the substrate. At least one memory cell in the first device level of the three-dimensional array of NAND strings is located over another memory cell in the second device level of the three-dimensional array of NAND strings.

Generally, a semiconductor package (or a “package”) refers to a unit semiconductor device that may be attached to a circuit board through a set of pins or solder balls. A semiconductor package may include a semiconductor chip (or a “chip”) or a plurality of semiconductor chips that are bonded throughout, for example, by flip-chip bonding or another chip-to-chip bonding. A package or a chip may include a single semiconductor die (or a “die”) or a plurality of semiconductor dies. A die is the smallest unit that may independently execute external commands or report status. Typically, a package or a chip with multiple dies is capable of simultaneously executing as many external commands as the total number of planes therein. Each die includes one or more planes. Identical concurrent operations may be executed in each plane within a same die, although there may be some restrictions. In case a die is a memory die, i.e., a die including memory elements, concurrent read operations, concurrent write operations, or concurrent erase operations may be performed in each plane within a same memory die. In a memory die, each plane contains a number of memory blocks (or “blocks”), which are the smallest unit that may be erased by in a single erase operation. Each memory block contains a number of pages, which are the smallest units that may be selected for programming A page is also the smallest unit that may be selected to a read operation.

Referring to FIG. 1A, a first configuration of a first semiconductor die 900 is illustrated. The first semiconductor die 900 includes a first substrate 908, first semiconductor devices 920 overlying the first substrate 908, first interconnect-level dielectric material layers (290, 960) located on the first semiconductor devices, and first metal interconnect structures 980 embedded in the first interconnect-level dielectric material layers (290, 960). In one embodiment, the first substrate 908 may be a first substrate such as a commercially available silicon wafer having a thickness in a range from 500 microns to 1 mm.

Discrete substrate recess cavities can be formed in an upper portion of the first substrate 908 by applying a photoresist layer over the top surface of the first substrate 908, lithographically patterning the photoresist layer to form an array of discrete openings, and transferring the pattern of the array of discrete openings into the upper portion of the first substrate by performing an anisotropic etch process. The photoresist layer can be subsequently removed, for example, by ashing. The depth of each discrete substrate recess cavity can be in a range from 500 nm to 10,000, although lesser and greater depths can also be employed. A through-substrate liner 386 and a through-substrate via structure 388 can be formed within each discrete substrate recess cavity.

Generally, the first semiconductor devices 920 may comprise any semiconductor device known in the art. In one embodiment, the first semiconductor die 900 comprises a memory die, and may include memory devices, such as a three-dimensional NAND memory device. In an illustrative example, the first semiconductor devices 920 may include a vertically alternating stack of insulating layers 32 and electrically conductive layers 46, and a two-dimensional array of memory openings vertically extending through the vertically alternating stack (32, 46). The electrically conductive layers 46 may comprise word lines of the three-dimensional NAND memory device.

A memory opening fill structure 58 may be formed within each memory opening. A memory opening fill structure 58 may include a memory film and a vertical semiconductor channel contacting the memory film. The memory film may include a blocking dielectric, a tunneling dielectric and a charge storage material located between the blocking and tunneling dielectric. The charge storage material may comprise charge trapping layer, such as a silicon nitride layer, or a plurality of discrete charge trapping regions, such as floating gates or discrete portions of a charge trapping layer. In this case, each memory opening fill structure 58 and adjacent portions of the electrically conductive layers 46 constitute a vertical NAND string. Alternatively, the memory opening fill structures 58 may include any type of non-volatile memory elements such as resistive memory elements, ferroelectric memory elements, phase change memory elements, etc. The memory device may include an optional horizontal semiconductor channel layer 10 connected to the bottom end of each vertical semiconductor channel, and an optional dielectric spacer layer 910 that provides electrical isolation between the first substrate 908 and the horizontal semiconductor channel layer 10.

The electrically conductive layers 46 may be patterned to provide a terrace region in which each overlying electrically conductive layer 46 has a lesser lateral extent than any underlying electrically conductive layer 46. Contact via structures (not shown) may be formed on the electrically conductive layers 46 in the terrace region to provide electrical connection to the electrically conductive layers 46. Dielectric material portions 65 may be formed around each vertically alternating stack (32, 46) to provide electrical isolation between neighboring vertically alternating stacks (32, 46).

Through-memory-level via cavities can be formed through the dielectric material portions 65, the optional dielectric spacer layer 910, and the horizontal semiconductor channel layer 10. An optional through-memory-level dielectric liner 486 and a through-memory-level via structure 488 can be formed within each through-memory-level via cavity. Each through-memory-level dielectric liner 486 includes a dielectric material such as silicon oxide. Each through-memory-level via structure 488 can be formed directly on a respective one of the through-substrate via structure 388.

The first interconnect-level dielectric material layers (290, 960) may include first proximal interconnect-level dielectric material layers 290 embedding contact via structures and bit lines 982 and first distal interconnect-level dielectric material layers 960 that embed a subset of the first metal interconnect structures 980 located above the first proximal interconnect-level dielectric material layers 290. As used herein, a “proximal” surface refers to a surface that is close to a substrate, and a “distal” surface refers to a surface that is distal from the substrate. In the first semiconductor die 900, a proximal surface refers to a surface that is close to the first substrate 908, and a distal surface refers to a surface that is distal from the first substrate 908.

The bit lines 982 are a subset of the first metal interconnect structures 980 and may electrically contact drain regions located above the semiconductor channel at the top of the memory opening fill structures 58. The contact via structures contact various nodes of the first semiconductor devices. Generally, the first metal interconnect structures 980 can be electrically connected to the first semiconductor devices 920. A proximal subset of the first metal interconnect structures 980 can be located within the first distal interconnect-level dielectric material layers 960. Interconnect metal lines and interconnect metal via structures, which are subsets of the first metal interconnect structures 980, can be embedded in the first distal interconnect-level dielectric material layers 960. In an illustrative example, the first metal interconnect structures 980 may include a first memory-side metal level M1 including memory-side first-level metal lines, and a second memory-side metal level M2 including memory-side second-level metal lines.

Each of the first proximal interconnect-level dielectric material layers 290 and the first distal interconnect-level dielectric material layers 960 may include a dielectric material such as undoped silicate glass, a doped silicate glass, organosilicate glass, silicon nitride, a dielectric metal oxide, or a combination thereof. The first distal interconnect-level dielectric material layers 960 may include one or more dielectric diffusion barrier layers (not expressly shown). In this case, each dielectric diffusion barrier layer embedded in the first distal interconnect-level dielectric material layers 960 may include silicon carbon nitride (i.e., silicon carbonitride “SiCN”, which is also referred to silicon carbide nitride), silicon nitride (Si₃N₄), silicon oxynitride, or any other dielectric material that is effective in blocking diffusion of copper. In one embodiment, each dielectric diffusion barrier layer embedded in the first distal interconnect-level dielectric material layers 960 may include a dielectric material having a dielectric constant less than 5, such as SiCN having a dielectric constant of about 3.8, to reduce RC delay of the first metal interconnect structures 980. Each dielectric diffusion barrier layer may have a thickness in a range from 10 nm to 30 nm.

A layer stack including an optional first interconnect-capping dielectric diffusion barrier layer 962, a first pad-connection-level dielectric layer 964, and an optional first pad-level diffusion barrier layer 972 can be formed. The first interconnect-capping dielectric diffusion barrier layer 962 can include a dielectric material that blocks copper diffusion. In one embodiment, the first interconnect-capping dielectric diffusion barrier layer 962 can include silicon nitride, silicon carbon nitride, silicon oxynitride, or a stack thereof. The thickness of the first interconnect-capping dielectric diffusion barrier layer 962 can be in a range from 5 nm to 50 nm, although lesser and greater thicknesses can also be employed.

The first pad-connection-level dielectric layer 964 may include, and/or consist essentially of, undoped silicate glass (e.g., silicon oxide), a doped silicate glass, organosilicate glass, silicon nitride, or a dielectric metal oxide. The thickness of the first pad-connection-level dielectric layer 964 may be in a range from 100 nm to 3,000 nm, although lesser and greater thicknesses may also be employed. The first pad-connection-level dielectric layer 964 may have a planar top surface.

The optional first pad-level diffusion barrier layer 972 can include a dielectric material that blocks diffusion of moisture and impurities. In one embodiment, the first pad-level diffusion barrier layer 972 can include silicon nitride, silicon carbon nitride, silicon oxynitride, or a stack thereof. The thickness of the first pad-level diffusion barrier layer 972 can be in a range from 5 nm to 50 nm, although lesser and greater thicknesses can also be employed.

A photoresist layer can be applied over the first pad-level diffusion barrier layer 972, and can be lithographically patterned to form discrete openings in areas that overlie topmost metal interconnect structures of the first metal interconnect structures 980. An anisotropic etch process can be performed to transfer the pattern of the openings in the photoresist layer through first pad-level diffusion barrier layer 972, the first pad-connection-level dielectric layer 964, and first interconnect-capping dielectric diffusion barrier layer 962. First pad-connection via cavities are formed through first pad-level diffusion barrier layer 972, the first pad-connection-level dielectric layer 964, and the first interconnect-capping dielectric diffusion barrier layer 962 in areas that overlie metal interconnect structures 980. A top surface of a topmost metal interconnect structure 980 can be physically exposed at the bottom of each first pad-connection via cavity. In one embodiment, each first pad-connection via cavity can be formed within the area of a respective one of the topmost metal interconnect structures.

A pad-connection-level metallic barrier layer and a pad-connection-level metallic fill material can be sequentially deposited in the first pad-connection via cavities. The pad-connection-level metallic barrier layer includes a conductive metallic barrier material such as TiN, TaN, and/or WN. The conductive metallic barrier material can block diffusion of copper. The thickness of the pad-connection-level metallic barrier layer may be in a range from 4 nm to 80 nm, such as from 8 nm to 40 nm, although lesser and greater thicknesses can also be employed. The pad-connection-level metallic fill material can include copper, tungsten, molybdenum, ruthenium, cobalt, or a combination thereof. For example, if the pad-connection-level metallic fill material includes copper, copper may be deposited by a combination of a copper seed layer deposition process employing physical vapor deposition and a copper electroplating process that fills remaining volumes of the first pad-connection via cavities.

Excess portions of the pad-connection-level metallic fill material and the pad-connection-level metallic barrier layer overlying the horizontal plane including the top surface of first pad-connection-level dielectric layer 964 can be removed by a planarization process such as chemical mechanical planarization. Remaining portions of the pad-connection-level metallic fill material and the pad-connection-level metallic barrier layer that fill the first pad-connection via cavities constitute first pad-connection via structures 968. Each first pad-connection via structure 968 can include a pad-connection-level metallic barrier liner 968A and a pad-connection-level metallic fill material portion 968B. The pad-connection-level metallic barrier liner 968A is a patterned remaining portion of the pad-connection-level metallic barrier layer, and the pad-connection-level metallic fill material portion 968B is a patterned remaining portion of the pad-connection-level metallic fill material. Top surfaces of the first pad-connection via structures 968 can be within a same horizontal plane as the top surface of the first pad-connection-level dielectric layer 964 or the top surface of the first pad-level diffusion barrier layer 972 (if present).

Referring to FIGS. 1B and 1C, a first proximal pad-level dielectric layer 984P can be formed over the first pad-connection-level dielectric layer 964. The first proximal pad-level dielectric layer 984P may include, and/or consist essentially of, undoped silicate glass, a doped silicate glass, organosilicate glass, silicon nitride, or a dielectric metal oxide. The thickness of the first proximal pad-level dielectric layer 984P may be in a range from 300 nm to 3,000 nm, although lesser and greater thicknesses may also be employed. The first proximal pad-level dielectric layer 984P may have a planar top surface.

A photoresist layer (not shown) can be applied over the first proximal pad-level dielectric layer 984P, and can be lithographically patterned to form discrete openings in each area of the first pad-connection via structures 968. In other words, each discrete opening in the photoresist layer overlies a respective one of first pad-connection via structures 968. Each discrete opening in the photoresist layer can have a greater area than the area of an underlying first pad-connection via structure 968. Each discrete opening in the photoresist layer can have a shape of a bonding pad to be subsequently formed. For example, each discrete opening in the photoresist layer can have a rectangular shape or a rounded rectangular shape having sides that are parallel to a first horizontal direction hd1 and a second horizontal direction hd2. The dimension of each opening along the first horizontal direction hd1 and the dimension of each opening along the second horizontal direction hd2 are in a range from 2 microns to 60 microns.

An anisotropic etch process can be performed to transfer the pattern of the openings in the photoresist layer through the first proximal pad-level dielectric layer 984P. First pad base cavities are formed through the first proximal pad-level dielectric layer 984P underneath discrete openings in the photoresist layer. A top surfaces of a single pad-connection via structure 968 can be physically exposed at the bottom of each first pad base cavity. Each first pad base cavity can have a horizontal cross-sectional shape of a rectangle or a rounded rectangle such that the dimension of each first pad base cavity along the first horizontal direction hd1 is in a range from 2 micron to 60 microns and the dimension of each first pad base cavity along the second horizontal direction hd2 is in a range from 2 micron to 60 microns. In one embodiment, each first pad base cavity can have a horizontal cross-sectional shape of a square or a rounded square such that the dimension of the each first pad base cavity along the first horizontal direction hd1 and the dimension of each first pad base cavity along the second horizontal direction hd2 are the same. In this case, the dimension of each first pad base cavity along the first horizontal direction hd1 and along the second horizontal direction hd2 can be in a range from 2 microns to 60 microns, such as from 4 microns to 30 microns. Sidewalls of the first pad base cavities may be vertical, or may have a taper angle greater than 0 degree and less than 30 degrees (such as a taper angle in a range from 3 degrees to 10 degrees) with respect to the vertical direction.

A first metallic liner layer and a first metallic pad fill material can be sequentially deposited in the first pad base cavities. The first metallic liner layer includes a metallic barrier material. The metallic barrier material may include a metallic nitride material such as TiN, TaN, and/or WN, and/or may include an elemental metal or an intermetallic alloy that can function as a barrier for diffusion of a metallic material. The conductive metallic barrier material can block diffusion of copper. The first metallic liner layer is formed on top surfaces of the first pad-connection via structures 968. The thickness of the first metallic liner layer may be in a range from 4 nm to 80 nm, such as from 8 nm to 40 nm, although lesser and greater thicknesses can also be employed. The first metallic pad fill material can include copper, tungsten, molybdenum, cobalt, ruthenium, or a combination thereof. In an illustrative example, if the first metallic pad fill material includes copper, the first metallic pad fill material may be deposited by a combination of a copper seed layer deposition process employing physical vapor deposition and a copper electroplating process that fills remaining volumes of the first pad base cavities.

Excess portions of the first metallic pad fill material and the first metallic liner layer overlying the horizontal plane including the top surface of the first proximal pad-level dielectric layer 984P can be removed by a planarization process such as chemical mechanical planarization. Remaining portions of the first metallic pad fill material and the first metallic liner layer that fill the first pad base cavities constitute first pad base portions 978.

Each first pad base portion 978 can include a first metallic liner 978A and a first pad base plate portion 978B. The first metallic liner 978A is a patterned remaining portion of the first metallic liner layer, and the first pad base plate portion 978B is a patterned remaining portion of the first metallic pad fill material. Top surfaces of the first pad base portions 978 can be within a same horizontal plane as the top surface of the first proximal pad-level dielectric layer 984P.

Generally, the first pad base portions 978 are formed in the first pad base cavities directly on the top surfaces of the first pad-connection via structures 968. Each of the first pad base portions 978 comprises, and/or consists of, a first metallic liner 978A comprising a metallic barrier material, and a first metallic fill material portion 978B embedded in the metallic liner 978A. The first pad-connection-level dielectric layer 964 can be located between the first interconnect-level dielectric material layers (290, 960) and the first pad-level dielectric layer 984P, and can embed first pad-connection via structures 968 having a respective distal surface that is in contact with a respective one of the first pad base portions 978 and having a lesser area than an area of a proximal horizontal surface of the respective one of the first pad base portions 978.

Referring to FIG. 1D, a first distal pad-level dielectric layer 984D can be formed over the first proximal pad-level dielectric layer 984P. The first distal pad-level dielectric layer 984D may include, and/or consist essentially of, undoped silicate glass, a doped silicate glass, organosilicate glass, silicon nitride, or a dielectric metal oxide. The thickness of the first distal pad-level dielectric layer 984D may be in a range from 300 nm to 3,000 nm, although lesser and greater thicknesses may also be employed. The first distal pad-level dielectric layer 984D may have a planar top surface.

A photoresist layer (not shown) can be applied over the first distal pad-level dielectric layer 984D, and can be lithographically patterned to form discrete openings in each area of the first pad base portions 978. In other words, each discrete opening in the photoresist layer overlies a respective one of first pad base portions 978. Each discrete opening in the photoresist layer can have a lesser area than the area of an underlying first pad base portion 978. Each discrete opening can have a periphery that is located entirely within the area of an underlying pad base portion 978, and is laterally offset inward from the periphery of the underlying pad base portion 978. For example, each discrete opening in the photoresist layer can have a circular shape or an elliptical shape. The maximum lateral dimension of each opening in the photoresist layer may be in a range from 200 nm to 40 microns.

An anisotropic etch process can be performed to transfer the pattern of the openings in the photoresist layer through the first distal pad-level dielectric layer 984D. First pillar cavities 985 are formed through the first distal pad-level dielectric layer 984D underneath the discrete openings in the photoresist layer. A top surface of a first pad base portion 978 can be physically exposed at the bottom of each first pillar cavity 985. Each first pillar cavity 985 can have a horizontal cross-sectional shape of a polygon, a circle, an ellipse, or another curvilinear two-dimensional shape having a closed periphery. The maximum lateral dimension of each first pillar cavity 985 may be in a range from 200 nm to 40 microns.

Referring to FIGS. 1E and 1F, a first metallic pillar fill material can be deposited in the first pillar cavities 985. The first metallic pillar fill material may be the same as, or may be different from, the first metallic pad fill material of the first pad base plate portion 978B. The first metallic pillar fill material can include copper, tungsten, molybdenum, cobalt, ruthenium, or a combination thereof. In an illustrative example, if the first metallic pillar fill material includes copper, the first metallic pillar fill material may be deposited by a combination of a copper seed layer deposition process employing physical vapor deposition and a copper electroplating process that fills remaining volumes of the first pad base cavities.

Excess portions of the first metallic pillar fill material overlying the horizontal plane including the distal horizontal surface (i.e., the top surface) of the first distal pad-level dielectric layer 984D can be removed by a planarization process such as chemical mechanical planarization. Remaining portions of the first metallic pillar fill material that fill the first pillar cavities 985 constitute first pad pillar portions 988. Top surfaces of the first pad pillar portions 988 can be vertically recessed, for example, by overpolishing and/or a recess etch, to be located below the horizontal plane including the distal horizontal surface (i.e., the top surface) of the first distal pad-level dielectric layer 984D. The vertical recess distance is selected so that volume expansion of the materials of the first pad base portions 978 and the first pad pillar portions 988 causes the top surface of the first pad pillar portions 988 to be flush with the distal horizontal surface of the first distal pad-level dielectric layer 984D at the elevated temperature of a bonding process to be subsequently employed. For example, the vertical recess distance of the top surfaces of the first pad pillar portion 988 relative to the horizontal plane including the distal horizontal surface of the first distal pad-level dielectric layer 984D can be in a range from 10 nm to 100 nm, such as from 20 nm to 60 nm, although lesser and greater vertical recess distances may also be employed. Each first pad pillar portion 988 can be formed in a respective first pillar cavity directly on the top surface of a respective first pad base portion 978.

Each contiguous combination of a first pad base portion 978 and a first pad pillar portion 988 constitutes a first bonding pad (978, 988). The combination of the first proximal pad-level dielectric layer 984P and the first distal pad-level dielectric layer 984D constitutes a first pad-level dielectric layer 984 that laterally surrounds, and embeds, the first bonding pads (978, 988). The first pad-level dielectric layer 984 is a composite layer including a layer stack of the first proximal pad-level dielectric layer 984P and the first distal pad-level dielectric layer 984D.

Generally, the first bonding pads (978, 988) in the first pad-level dielectric layer 984 can be formed such that the each of the first bonding pads (978, 988) comprises a first proximal horizontal surface PHS1 and a first distal horizontal surface DHS1 that is more distal from the first substrate 908 than the first proximal horizontal surface PHS1 is from the first substrate 908 and has a lesser total area than a total area of the first proximal horizontal surface PHS1. The first pad-level dielectric layer 984 overlies the first interconnect-level dielectric material layers (290, 960) and embeds the first bonding pads (978, 988).

Each of the first bonding pads (978, 988) comprises a first pad base portion 978 embedded in the first proximal pad-level dielectric layer 984P and a first pad pillar portion 988 contacting the first distal pad-level dielectric layer 984D. The first pad base portions 978 are formed within the first proximal pad-level dielectric layer 984P prior to formation of the first distal pad-level dielectric layer 984D.

In one embodiment, planar distal surfaces of each first pad base portion 978 contact portions of a proximal horizontal surface of the first distal pad-level dielectric layer 984D. In one embodiment, each first pad base portion 978 comprises a stack of a first metallic liner 978A and a pad base plate portion 978B. Each first pad pillar portion 988 contacts a sidewall of the first distal pad-level dielectric layer 984D. In one embodiment, each of the first bonding pads (978, 988) consists of a first pad base portion 978 and a single first pad pillar portion 988. In one embodiment, each first pad base portion 978 comprises a straight sidewall that vertically extends from a proximal horizontal surface of the first proximal pad-level dielectric layer 984P to a distal horizontal surface of the first proximal pad-level dielectric layer 984P at a taper angle of zero to 20 degrees with respect to a line normal to the top surface of the first substrate 908.

Referring to FIGS. 2A and 2B, a variant of the first configuration of the first semiconductor die 900 is illustrated, which can be derived from the first semiconductor die 900 of FIGS. 1E and 1F by forming a plurality of first pad pillar portions 988 on each first pad base portion 978. At least two pad pillar portions 988 can be formed directly on each first pad base portion 978. In one embodiment, a one-dimensional array of pad pillar portions 988 or a two-dimensional array of pad pillar portions 988 can be formed directly on a top surface of each first pad base portion 978. Generally, a first bonding pad (978, 988) can include a first pad base portion 978 and at least one first pad pillar portion 988. The at least one first pad pillar portion 988 may include a single pad pillar portion 988, or a plurality of first pad pillar portions 988 that are laterally spaced apart from each other. In one embodiment, the plurality of first pad pillar portions 988 may include an M×N rectangular periodic array of first pad pillar portions 988, in which M and N are independent integers in a range from 2 to 10.

Referring to FIGS. 3A and 3B, a second configuration of the first semiconductor die 900 is illustrated, which can be derived from the first semiconductor die 900 of FIG. 1A by forming a first distal pad-level dielectric layer 984 and first pillar cavities 985 in an upper portion of the first pad-level dielectric layer 984. Specifically, the first pad-level dielectric layer 984 can be formed as a composite layer including a layer stack of a first proximal pad-level dielectric layer 984P and a first distal pad-level dielectric layer 984D. The first proximal pad-level dielectric layer 984P includes a first dielectric material and the first distal pad-level dielectric layer 984D includes a second dielectric material that is different from the first dielectric material. For example, the first dielectric material may include silicon nitride and the second dielectric material may include silicon oxide. Alternatively, the first dielectric material can include borosilicate glass or organosilicate glass, and the second dielectric material can include undoped silicate glass. In this case, the ratio of the etch rate of the first dielectric material in 100:1 dilute hydrofluoric acid to the etch rate of the second dielectric material in 100:1 dilute hydrofluoric acid may be in a range from 10 to 1,000. The thickness of the first proximal pad-level dielectric layer 984P may be in a range from 300 nm to 3,000 nm, although lesser and greater thicknesses may also be employed. The thickness of the first distal pad-level dielectric layer 984D may be in a range from 300 nm to 3,000 nm, although lesser and greater thicknesses may also be employed.

A photoresist layer (not shown) can be applied over the first distal pad-level dielectric layer 984D, and can be lithographically patterned to form discrete openings in areas that overlie the first pad-connection via structures 968. The discrete openings in the photoresist layer may overlie the first pad-connection via structures 968, or may be formed in the vicinity of the first pad-connection via structures 968. Each discrete opening in the photoresist layer can be formed within the areas of a first pad base portion to be subsequently formed in the first proximal pad-level dielectric layer 984P. For example, each discrete opening in the photoresist layer can have a circular shape or an elliptical shape. The maximum lateral dimension of each opening in the photoresist layer may be in a range from 200 nm to 40 microns.

An anisotropic etch process can be performed to transfer the pattern of the openings in the photoresist layer through the first distal pad-level dielectric layer 984D. First pillar cavities 985 are formed through the first distal pad-level dielectric layer 984D underneath the discrete openings in the photoresist layer. A top surface of the first proximal pad-level dielectric layer 984P can be used as an etch stop and is physically exposed at the bottom of each first pillar cavity 985. Each first pillar cavity 985 can have a horizontal cross-sectional shape of a polygon, a circle, an ellipse, or another curvilinear two-dimensional shape having a closed periphery. The maximum lateral dimension of each first pillar cavity 985 may be in a range from 200 nm to 40 microns.

Referring to FIG. 3C, an isotropic etch process that selectively etches the first dielectric material of the first proximal pad-level dielectric layer 984P relative to the first distal pad-level dielectric layer 984D can be performed to isotropically recess physically exposed portions of the first proximal pad-level dielectric layer 984P underneath the first pillar cavities 985. As used herein, a first material is removed “selective” to a second material if the removal rate (such as an etch rate) of the first material is at least three times the removal rate of the second material. The first dielectric material of the first proximal pad-level dielectric layer 984P is isotropically recessed by the isotropic etch process to form pad base cavities 975 underneath the pillar cavities 985. For example, if the first proximal pad-level dielectric layer 984P includes silicon nitride and if the first distal pad-level dielectric layer 984D includes silicon oxide, a wet etch process employing hot phosphoric acid can be performed to isotropically recess physically exposed portions of the first proximal pad-level dielectric layer 984P selective to the first distal pad-level dielectric layer 984D.

Each pad base cavity 975 can be formed underneath, and can be adjoined to, and overlying pillar cavity 985. A top surface of a first pad-connection via structure 968 can be physically exposed at the bottom of each pad base cavity 975. Each pad base cavity 975 can be laterally bounded by at least one concave sidewall of the first proximal pad-level dielectric layer 984P that vertically extends from the horizontal plane including the bottom surface of the first proximal pad-level dielectric layer 984P to the horizontal plane including the top surface of the first proximal pad-level dielectric layer 984P. Generally, the first pad base cavities 975 can be formed in the first proximal pad-level dielectric layer 984P after formation of the first distal pad-level dielectric layer 984D by isotropically etching portions of the first proximal pad-level dielectric layer 984P from underneath the pillar cavities 985. Each first pad base cavity 975 can have an upper outer periphery that is laterally offset outward from the bottom periphery of an overlying pillar cavity 985. Further, each first pad base cavity 975 may have a lower periphery at a horizontal plane including the top surfaces of the first pad-connection via structures 968. The lower periphery may be laterally offset outward from the bottom periphery of the overlying pillar cavity 985 in a plan view.

Referring to FIG. 3D, a metallic material is selectively deposited on the physically exposed surfaces of the first pad-level dielectric layer 984P and the first pad-connection via structures 968 without deposition on the surfaces of the second pad-level dielectric layer 984D. As used herein, a material is “selectively” deposited, or “selectively” nucleates, on a first surface relative to a second surface if the material is deposited on, or nucleates on, the first surface and is not deposited on, or does not nucleate on, the second surface. For example, if the first dielectric material of the first proximal pad-level dielectric layer 984P includes silicon nitride and if the second dielectric material of the first distal pad-level dielectric layer 984D includes silicon oxide, the metallic material can include a material that nucleates on silicon nitride surfaces and does not nucleate on silicon oxide surfaces. For example, the metallic material can include ruthenium or molybdenum. A first metallic liner 958A is formed on each contiguous set of a physically exposed surface of a first pad-connection via structure 968 and at least one sidewall of the first proximal pad-level dielectric layer 984P that laterally surrounds a first pad base cavity 975. The thickness of each first metallic liner 958A can be in a range from 1 nm to 30 nm, such as from 2 nm to 15 nm, although lesser and greater thicknesses can also be employed.

Referring to FIG. 3E, a metallic material that deposits selectively on metallic surfaces and does not deposit on dielectric surfaces can be deposited within volumes of the first pad base cavities 975 to form first pad base plate portions 958B. The first pad base plate portions 958B can include a metal such as copper, tungsten, molybdenum, ruthenium, cobalt, or a combination thereof. The first pad base plate portions 958B may include the same material as, or may include a different material from, the material of the first metallic liners 958A. The first pad base plate portions 958B can be deposited by electroplating, electroless plating or by chemical vapor deposition. In one embodiment, the first pad base cavities 975 may be completely filled with the first metallic liners 958A and the first pad base plate portions 958B. In another embodiment, the first pad base cavities 975 may be partially filled with the first metallic liners 958A and the first pad base plate portions 958B. Each contiguous combination of first metallic liner 958A and a first pad base plate portion 958B constitutes a first pad base portion (958A, 958B). Each first pad base portion (958A, 958B) is embedded in the first proximal pad-level dielectric layer 984P.

Referring to FIG. 3F, a first metallic pillar fill material can be deposited in the first pillar cavities 985. The first metallic pillar fill material may be the same as, or may be different from, the first metallic pad fill material of the first pad base plate portion 978B. The first metallic pillar fill material can include copper, tungsten, molybdenum, cobalt, ruthenium, or a combination thereof. In an illustrative example, if the first metallic pillar fill material includes copper, the first metallic pillar fill material may be deposited by a combination of a copper seed layer deposition process employing physical vapor deposition and a copper electroplating process that fills remaining volumes of the first pad base cavities.

Excess portions of the first metallic pillar fill material overlying the horizontal plane including the distal horizontal surface (i.e., the top surface) of the first distal pad-level dielectric layer 984D can be removed by a planarization process such as chemical mechanical planarization. Remaining portions of the first metallic pillar fill material that fill the first pillar cavities 985 constitute first pad pillar portions 958C. Top surfaces of the first pad pillar portions 958C can be vertically recessed, for example, by overpolishing and/or a recess etch, to be located below the horizontal plane including the distal horizontal surface (i.e., the top surface) of the first distal pad-level dielectric layer 984D. The vertical recess distance is selected so that volume expansion of the materials of the first pad base portions (958A, 958B) and the first pad pillar portions 958C causes the top surface of the first pad pillar portions 958C to be flush with the distal horizontal surface of the first distal pad-level dielectric layer 984D at the elevated temperature of a bonding process to be subsequently employed. For example, the vertical recess distance of the top surfaces of the first pad pillar portion 958C relative to the horizontal plane including the distal horizontal surface of the first distal pad-level dielectric layer 984D can be in a range from 10 nm to 100 nm, such as from 20 nm to 60 nm, although lesser and greater vertical recess distances may also be employed. Each first pad pillar portion 958C can be formed in a respective first pillar cavity 985 directly on the top surface of a respective first pad base portion (958A, 958B).

Each contiguous combination of a first pad base portion (958A, 958B) and a first pad pillar portion 958C constitutes a first bonding pad 958. The combination of the first proximal pad-level dielectric layer 984P and the first distal pad-level dielectric layer 984D constitutes a first pad-level dielectric layer 984 that laterally surrounds, and embeds, the first bonding pads 958. The first pad-level dielectric layer 984 is a composite layer including a layer stack of the first proximal pad-level dielectric layer 984P and the first distal pad-level dielectric layer 984D.

Generally, the first bonding pads 958 in the first pad-level dielectric layer 984 can be formed such that the each of the first bonding pads 958 comprises a first proximal horizontal surface PHS1 and a first distal horizontal surface DHS1 that is more distal from the first substrate 908 than the first proximal horizontal surface PHS1 is from the first substrate 908 and has a lesser total area than a total area of the first proximal horizontal surface PHS1. The first pad-level dielectric layer 984 overlies the first interconnect-level dielectric material layers (290, 960) and embeds the first bonding pads 958.

Each of the first bonding pads 958 comprises a first pad base portion (958A, 958B) embedded in the first proximal pad-level dielectric layer 984P and a first pad pillar portion 958C contacting the first distal pad-level dielectric layer 984D. The first pad base portions (958A, 958B) are formed within the first proximal pad-level dielectric layer 984P after formation of the first distal pad-level dielectric layer 984D.

In one embodiment, planar distal surfaces of each first pad base portion (958A, 958B) contacts portions of a proximal horizontal surface of the first distal pad-level dielectric layer 984D. In one embodiment, each first pad base portion (958A, 958B) comprises a stack of a first metallic liner 958A and a pad base plate portion 958B. Each first pad pillar portion 958C contacts a sidewall of the first distal pad-level dielectric layer 984D. In one embodiment, each of the first bonding pads 58 consists of a first pad base portion (958A, 958B) and a single first pad pillar portion 958C. In on embodiment, each first pad base portion (958A, 958B) comprises a convex sidewall that vertically extends from a proximal horizontal surface of the first proximal pad-level dielectric layer 984P to a distal horizontal surface of the first proximal pad-level dielectric layer 984P.

Referring to FIG. 3G, a variant of the second configuration of the first semiconductor die 900 can be derived from the second configuration of the first semiconductor die 900 illustrated in FIG. 3E by continuing the deposition process of the bonding pads 958 until the metallic material of the first pad base plate portions 958B fills the volumes of the first pillar cavities 585 to form the first pad pillar portions 958C described above. In this case, a first integrated pad base and pillar fill material portion 958D is formed in lieu of a combination of a first pad base plate portions 958B and a first pad pillar portion 958C. A planarization process and/or a recess etch process may be optionally performed to form top surfaces of the first integrated pad base and pillar fill material portions 958D. Each first bonding pad 958 can include a first metallic liner 958A and a first integrated pad base and pillar fill material portion 958D. A contiguous combination of a first metallic liner 958A and a lower portion of each first integrated pad base and pillar fill material portion 958D comprises a first pad base portion 958D1, and an upper portion of each first integrated pad base and pillar fill material portion 958D comprises a first pad pillar portion 958D2.

Referring to FIG. 3H, another variant of the second configuration of the first semiconductor die 900 can be derived from the second configuration of the first semiconductor die of FIG. 3F by omitting formation of the first metallic liners 958A. In this case, the first pad base plate portions 958B can include a metallic material that selectively nucleates on the first dielectric material of the first proximal pad-level dielectric layer 984P and on the surfaces of the first pad-connection via structures 968 without deposition on the physically exposed surfaces of the first distal pad-level dielectric layer 984D. For example, the first pad base plate portions 958B can include ruthenium or molybdenum.

Referring to variants of the second configuration shown in FIGS. 3F-3H, a first pad-level dielectric layer 984 can overlie the first interconnect-level dielectric material layers (290, 960), and can embed first bonding pads 958. Each of the first bonding pads 958 can comprise a first proximal horizontal surface PHS1 and a first distal horizontal surface DHS1, which is more distal from the first substrate 908 than the first proximal horizontal surface PHS1 is from the first substrate 908 and has a lesser total area than a total area of the first proximal horizontal surface PHS1. In one embodiment, each of the first bonding pads 958 consists of the first pad base portion {(958A, 958B), (958A, 958D1), 958B} and a single first pad pillar portion (958C, 958D2). In another embodiment, a plurality of first pad pillar portions (958C, 958D2) may be formed on a same first pad base portion {(958A, 958B), (958A, 958D1), 958B}. In this case, a plurality of first pillar cavities 985 can be formed in proximity to each other, and a first pad base cavity 975 can underlie, and can be connected to, the plurality of first pillar cavities 985. The first pad base cavity 975 and the plurality of first pillar cavities 985 can be filled with at least one conductive material to form the first bonding pads 958.

In one embodiment, the first pad-level dielectric layer 984 comprises a stack of a proximal pad-level dielectric layer 984P and a distal pad-level dielectric layer 984D, and each of the first bonding pads 958 comprises a first pad base portion {(958A, 958B), (958A, 958D1), 958B} embedded in the first proximal pad-level dielectric layer 984P and at least one first pad pillar portion (958C, 958D2) contacting the first distal pad-level dielectric layer 984D.

In one embodiment, a planar distal surface of the first pad base portion {(958A, 958B), (958A, 958D1), 958B} contacts portions of a proximal horizontal surface of the first distal pad-level dielectric layer 984D. In one embodiment, the first pad base portion {(958A, 958B), (958A, 958D1)} comprises a stack of a first metallic liner 958 and a pad base plate portion (958B or a lower portion of 958D), and each first pad pillar portion (958C, 958D2) contacts a sidewall of the first distal pad-level dielectric layer 984D.

In one embodiment, the first pad base portion {(958A, 958B), (958A, 958D1), 958B} comprises a convex sidewall that vertically extends from a proximal horizontal surface of the first proximal pad-level dielectric layer 984P to a distal horizontal surface of the first proximal pad-level dielectric layer 984P. In one embodiment, an interface between the first pad base portion {(958A, 958B), 958B} and the at least one first pad pillar portion 958C is located underneath a horizontal plane including a horizontal interface between the first proximal pad-level dielectric layer 984P and the first distal pad-level dielectric layer 984D. Generally, the growth rate of the material of the 958B from the concave sidewalls of the first proximal pad-level dielectric layer 984P can be isotropic. In this case, an interface between the first pad base portion {(958A, 958B), 958B} and the at least one first pad pillar portion 958C (i.e., an interface between a first pad base plate portion 958B and a first pad pillar portion 958C) may be located within a curved surface that is equidistant from the convex sidewall of a respective first bonding pad 958.

Referring to FIG. 4A, a third configuration of the first semiconductor die 900 can be derived from the first semiconductor die 900 of FIG. 1A by depositing a sacrificial material layer 941L on a top surface of the first pad-level diffusion barrier layer 972 and on the physically exposed top surfaces of first pad-connection via structures 968. The sacrificial material layer 941L includes a material that can be removed selective to the materials of the first pad-level diffusion barrier layer 972 (or selective to the material of the first pad-connection-level dielectric layer 964 in case the first pad-level diffusion barrier layer 972 is omitted). For example, the sacrificial material layer 941L can include amorphous silicon, silicon nitride, borosilicate glass, organosilicate glass, organic polymer, or inorganic polymer. The thickness of the sacrificial material layer 941L may be in a range from 600 nm to 6,000 nm, although lesser and greater thicknesses may also be employed.

Referring to FIG. 4B, discrete etch mask material portions 947 can be formed over the sacrificial material layer 941L such that each area of the first pad-connection via structures 968 is covered by a respective one of the discrete etch mask material portions 947. In one embodiment, the etch mask material portions 947 may include patterned discrete portions of a photoresist material formed by application and lithographic patterning of a photoresist material layer. Alternatively, a hard mask material layer can be deposited and lithographically patterned to form the discrete etch mask material portions 947. The discrete etch mask material portions 947 can have horizontal cross-sectional shapes of first bonding pads to be subsequently formed with an optional offset outward from a periphery of a respective first bonding pad in a plan view.

An isotropic etch process can be subsequently performed to isotropically etch unmasked portions of the sacrificial material layer 941L selective to the material of the first pad-level diffusion barrier layer 972 (or selective to the material of the first pad-connection-level dielectric layer 964 in case the first pad-level diffusion barrier layer 972 is omitted). Unmasked portions of the sacrificial material layer 941L are isotropically etched employing the discrete etch mask material portions 947 as an etch mask. Patterned remaining portions of the sacrificial material layer 941L comprise sacrificial mesa structures 941. Each sacrificial mesa structure 941 can be formed on a top surface of a respective one of the first pad-connection via structures 968. Each sacrificial mesa structure 941 has a proximal horizontal surface (a bottom surface) that is proximal to the first substrate 908, a distal horizontal surface (a top surface) that is distal from the first substrate 908, and a set of at least one concave sidewall that continuously extends from a periphery of the proximal horizontal surface to a periphery of the distal horizontal surface. The distal horizontal surface of each sacrificial mesa structure 941 has a lesser area than the proximal horizontal surface of the sacrificial mesa structure 941. The periphery of the distal horizontal surface of each sacrificial mesa structure 941 is laterally offset inward from the periphery of the proximal horizontal surface of the sacrificial mesa structure 941 by a uniform lateral offset distance in a plan view, i.e., a view along a direction perpendicular to the top surface of the first substrate 908. The discrete etch mask material portions 947 can be subsequently removed, for example, by ashing.

Referring to FIGS. 4C and 4D, a dielectric material that is different from the material of the sacrificial mesa structures 941 can be deposited in gaps in the array of sacrificial mesa structures 941 and over the array of sacrificial mesa structures 941. The deposited dielectric material can be subsequently planarized, for example, employing chemical mechanical planarization and/or a recess etch. Portions of the deposited dielectric material overlying the horizontal plane including the top surface of the sacrificial mesa structures 941 can be removed by the planarization process. A remaining continuous portions of the deposited dielectric material forms a first pad-level dielectric layer 944.

Referring to FIG. 4E, a selective etch process that etches the material of the sacrificial mesa structures 941 selective to the material of the first pad-level dielectric layer 944 can be performed. For example, if the sacrificial mesa structures 941 comprise amorphous silicon, a wet etch process using hot trimethyl-2 hydroxyethyl ammonium hydroxide (“hot TMY”) or tetramethyl ammonium hydroxide (TMAH) may be performed to remove the sacrificial mesa structures 941 selective to the first pad-level dielectric layer 944. If the sacrificial mesa structures 941 include silicon nitride, a wet etch process employing hot phosphoric acid can be performed to remove the sacrificial mesa structures 941 selective to the first pad-level dielectric layer 944. A pad cavity 945 can be formed in each volume from which a sacrificial mesa structure 941 is removed.

Referring to FIGS. 4F and 4G, at least one conductive material can be deposited in the first pad cavities 945. For example, a first metallic liner layer and a first metallic pad fill material can be sequentially deposited in the first pad cavities 945. The first metallic liner layer includes a metallic barrier material. The metallic barrier material may include a metallic nitride material such as TiN, TaN, and/or WN, and/or may include an elemental metal or an intermetallic alloy that can function as a barrier for diffusion of a metallic material. The conductive metallic barrier material can block diffusion of copper. The first metallic liner layer can be deposited by a conformal deposition process such as chemical vapor deposition. The first metallic liner may be deposited directly on physically exposed surfaces of the is formed on top surfaces of the first pad-connection via structures 968, and directly on physically exposed surfaces of the first pad-level dielectric layer 944 and on physically exposed surfaces of the optional first pad-level diffusion barrier layer 972 (or on physically exposed surfaces of the first pad-connection-level dielectric layer 964). The thickness of the first metallic liner layer may be in a range from 4 nm to 80 nm, such as from 8 nm to 40 nm, although lesser and greater thicknesses can also be employed. The first metallic pad fill material can include copper, tungsten, molybdenum, cobalt, ruthenium, or a combination thereof. In an illustrative example, if the first metallic pad fill material includes copper, the first metallic pad fill material may be deposited by electroplating process. In some embodiment, a combination of at least two deposition processes interlaced with at least one etch back process may be employed to fill the volumes of the pad cavities 945 with the first metallic pad fill material.

Excess portions of the at least one conductive material can be removed from above the horizontal plane including the top surface of the first pad-level dielectric layer 944 by a planarization process such as chemical mechanical planarization. Remaining portions of the first metallic pad fill material and the first metallic liner layer that fill the first pad cavities 945 constitute first bonding pads 948. Each first bonding pad 948 can include a first metallic liner 948A and a first metallic fill material portion 948B. The first metallic liner 948A is a patterned remaining portion of the first metallic liner layer, and the first metallic fill material portion 948B is a patterned remaining portion of the first metallic pad fill material.

Top surfaces of the first bonding pads 948 can be vertically recessed, for example, by overpolishing and/or a recess etch, to be located below the horizontal plane including the distal horizontal surface (i.e., the top surface) of the first pad-level dielectric layer 944. The vertical recess distance is selected so that volume expansion of the materials of the first bonding pads 948 causes the top surface of the first bonding pads 948 to be flush with the horizontal surface of the first pad-level dielectric layer 944 at the elevated temperature of a bonding process to be subsequently employed. For example, the vertical recess distance of the top surfaces of the first bonding pads 948 relative to the horizontal plane including the distal horizontal surface of the first pad-level dielectric layer 944 can be in a range from 10 nm to 100 nm, such as from 20 nm to 60 nm, although lesser and greater vertical recess distances may also be employed.

The first bonding pads 948 are formed in the first pad cavities 945 directly on the top surfaces of the first pad-connection via structures 968. Each of the first bonding pads 948 comprises, and/or consists of, a first metallic liner 948A comprising a metallic barrier material, and a first metallic fill material portion 948B embedded in the metallic liner 948A. The first pad-connection-level dielectric layer 964 can be located between the first interconnect-level dielectric material layers (290, 960) and the first pad-level dielectric layer 944, and can embed first pad-connection via structures 968 having a respective distal surface that is in contact with a respective one of the first bonding pads 948 and having a lesser area than an area of a horizontal surface of the respective one of the first bonding pads 948.

Generally, the sacrificial mesa structures 941 are replaced with the first bonding pads 948 by removing the sacrificial mesa structures 941 selective to the first pad-level dielectric layer 944. The first bonding pads 948 comprise concave sidewalls that contact convex sidewalls of the first pad-level dielectric layer 944.

Each of the first bonding pads 948 comprises a first proximal horizontal surface PHS1 and a first distal horizontal surface DHS1 that is more distal from the first substrate 908 than the first proximal horizontal surface PHS1 is from the first substrate 908. The first distal horizontal surface DHS1 has a lesser total area than a total area of the first proximal horizontal surface PHS1. In one embodiment, each of the first bonding pads 948 comprises: a first metallic liner 948A including a horizontally-extending portion and a sidewall portion that contacts the first pad-level dielectric layer 944, and a first metallic fill material portion 948B that is embedded in the first metallic liner 948A, is not in direct contact with the first pad-level dielectric layer 944, and is laterally spaced from the first pad-level dielectric layer 944. Each of the first metallic liners 948A extends from a first proximal horizontal surface PHS1 of a respective one of the first bonding pads 948 to a first distal horizontal surface DHS1 of the respective one of the first bonding pads 948.

The first distal horizontal surface DHS1 is connected to the first proximal horizontal surface PHS1 by a continuous sidewall that contacts the first pad-level dielectric layer 944. In one embodiment, the continuous sidewall comprises a concave sidewall that contacts a convex sidewall of the first pad-level dielectric layer 944, as shown in FIG. 4G. A periphery DP of the first distal horizontal surface DHS1 is located entirely within a periphery PP of the first proximal horizontal surface PHS1 in a plan view along a direction that is perpendicular to a top surface of the first substrate 908. In one embodiment, the periphery PP of the first proximal horizontal surface PHS1 is laterally offset outward from the periphery DP of the first distal horizontal surface DHS1 by a uniform lateral offset distance LOD.

Referring to FIG. 5A, a fourth configuration of the first semiconductor die 900 can be derived from the third configuration of the first semiconductor die 900 illustrated in FIG. 4A by forming discrete etch mask material portions 947 over the sacrificial material layer 941L. The sacrificial material layer 941L includes a material that can be anisotropically etched by a dry etch process such as a reactive ion etch process and/or a chemical dry etch (CDE) process. For example, the sacrificial material layer 941L in the structure of FIG. 5A may include any of the materials that can be employed for the sacrificial material layer 941L in the structure of FIG. 4A.

Each area of the first pad-connection via structures 968 is covered by a respective one of the discrete etch mask material portions 947. In one embodiment, the etch mask material portions 947 may include patterned discrete portions of a photoresist material formed by application and lithographic patterning of a photoresist material layer. Alternatively, a hard mask material layer can be deposited and lithographically patterned to form the discrete etch mask material portions 947. The discrete etch mask material portions 947 can have horizontal cross-sectional shapes of first bonding pads to be subsequently formed with an optional offset outward from a periphery of a respective first bonding pad in a plan view.

Referring to FIG. 5B, an anisotropic etch process can be subsequently performed to anisotropically etch unmasked portions of the sacrificial material layer 941L selective to the material of the first pad-level diffusion barrier layer 972 (or selective to the material of the first pad-connection-level dielectric layer 964 in case the first pad-level diffusion barrier layer 972 is omitted). In one embodiment, the anisotropic etch process has an isotropic etch component that causes an undercut around the periphery of each discrete etch mask material portion 947. In another embodiment, the anisotropic etch process collaterally trims the discrete etch mask material portions 947, and thereby widens the width of each etched region while the anisotropic etch process progresses. Patterned remaining portions of the sacrificial material layer 941L comprise sacrificial mesa structures 941 having tapered sidewalls. The tapered sidewalls of the sacrificial mesa structures 941 may be straight, and may have a taper angle (as measured between a two-dimensional plane including a sidewall of a sacrificial mesa structure 941 and a vertical line) in a range from 5 degrees to 45 degrees.

Each sacrificial mesa structure 941 can be formed on a top surface of a respective one of the first pad-connection via structures 968. Each sacrificial mesa structure 941 has a proximal horizontal surface (a bottom surface) that is proximal to the first substrate 908, a distal horizontal surface (a top surface) that is distal from the first substrate 908, and a set of at least one concave sidewall that continuously extends from a periphery of the proximal horizontal surface to a periphery of the distal horizontal surface. The distal horizontal surface of each sacrificial mesa structure 941 has a lesser area than the proximal horizontal surface of the sacrificial mesa structure 941. The periphery of the distal horizontal surface of each sacrificial mesa structure 941 is laterally offset inward from the periphery of the proximal horizontal surface of the sacrificial mesa structure 941 by a uniform lateral offset distance in a plan view, i.e., a view along a direction perpendicular to the top surface of the first substrate 908. The discrete etch mask material portions 947 can be subsequently removed, for example, by ashing.

Referring to FIGS. 5C and 5D, a dielectric material that is different from the material of the sacrificial mesa structures 941 can be deposited in gaps in the array of sacrificial mesa structures 941 and over the array of sacrificial mesa structures 941. The deposited dielectric material can be subsequently planarized, for example, employing chemical mechanical planarization and/or a recess etch. Portions of the deposited dielectric material overlying the horizontal plane including the top surface of the sacrificial mesa structures 941 can be removed by the planarization process. A remaining continuous portions of the deposited dielectric material forms a first pad-level dielectric layer 944.

Referring to FIG. 5E, a selective etch process that etches the material of the sacrificial mesa structures 941 selective to the material of the first pad-level dielectric layer 944 can be performed. For example, if the sacrificial mesa structures 941 comprise amorphous silicon, a wet etch process using hot trimethyl-2 hydroxyethyl ammonium hydroxide (“hot TMY”) or tetramethyl ammonium hydroxide (TMAH) may be performed to remove the sacrificial mesa structures 941 selective to the first pad-level dielectric layer 944. If the sacrificial mesa structures 941 include silicon nitride, a wet etch process employing hot phosphoric acid can be performed to remove the sacrificial mesa structures 941 selective to the first pad-level dielectric layer 944. A pad cavity 945 can be formed in each volume from which a sacrificial mesa structure 941 is removed.

Referring to FIGS. 5F and 5G, the processing steps of FIGS. 4A and 4G can be performed to form first bonding pads 948 in the first pad cavities 945. Each first bonding pad 948 can include a first metallic liner 948A and a first metallic fill material portion 948B. Top surfaces of the first bonding pads 948 can be vertically recessed, for example, by overpolishing and/or a recess etch, to be located below the horizontal plane including the distal horizontal surface (i.e., the top surface) of the first pad-level dielectric layer 944. The vertical recess distance is selected so that volume expansion of the materials of the first bonding pads 948 causes the top surface of the first bonding pads 948 to be flush with the horizontal surface of the first pad-level dielectric layer 944 at the elevated temperature of a bonding process to be subsequently employed. For example, the vertical recess distance of the top surfaces of the first bonding pads 948 relative to the horizontal plane including the distal horizontal surface of the first pad-level dielectric layer 944 can be in a range from 10 nm to 100 nm, such as from 20 nm to 60 nm, although lesser and greater vertical recess distances may also be employed.

The first bonding pads 948 are formed in the first pad cavities 945 directly on the top surfaces of the first pad-connection via structures 968. Each of the first bonding pads 948 comprises, and/or consists of, a first metallic liner 948A comprising a metallic barrier material, and a first metallic fill material portion 948B embedded in the metallic liner 948A. The first pad-connection-level dielectric layer 964 can be located between the first interconnect-level dielectric material layers (290, 960) and the first pad-level dielectric layer 944, and can embed first pad-connection via structures 968 having a respective distal surface that is in contact with a respective one of the first bonding pads 948 and having a lesser area than an area of a horizontal surface of the respective one of the first bonding pads 948.

Generally, the sacrificial mesa structures 941 are replaced with the first bonding pads 948 by removing the sacrificial mesa structures 941 selective to the first pad-level dielectric layer 944. The first bonding pads 948 comprise inward tapered sidewalls that contact outward tapered sidewalls of the first pad-level dielectric layer 944.

Each of the first bonding pads 948 comprises a first proximal horizontal surface PHS1 and a first distal horizontal surface DHS1 that is more distal from the first substrate 908 than the first proximal horizontal surface PHS1 is from the first substrate 908. The first distal horizontal surface DHS1 has a lesser total area than a total area of the first proximal horizontal surface PHS1. In one embodiment, each of the first bonding pads 948 comprises: a first metallic liner 948A including a horizontally-extending portion and a sidewall portion that contacts the first pad-level dielectric layer 944, and a first metallic fill material portion 948B that is embedded in the first metallic liner 948A, is not in direct contact with the first pad-level dielectric layer 944, and is laterally spaced from the first pad-level dielectric layer 944. Each of the first metallic liners 948A extends from a first proximal horizontal surface PHS1 of a respective one of the first bonding pads 948 to a first distal horizontal surface DHS1 of the respective one of the first bonding pads 948.

The first distal horizontal surface DHS1 is connected to the first proximal horizontal surface PHS1 by a continuous sidewall that contacts the first pad-level dielectric layer 944. In one embodiment, the continuous sidewall comprises a straight sidewall that contacts a straight sidewall of the first pad-level dielectric layer 944, as shown in FIG. 5G. A periphery DP of the first distal horizontal surface DHS1 is located entirely within a periphery PP of the first proximal horizontal surface PHS1 in a plan view along a direction that is perpendicular to a top surface of the first substrate 908. In one embodiment, the periphery PP of the first proximal horizontal surface PHS1 is laterally offset outward from the periphery DP of the first distal horizontal surface DHS1 by a uniform lateral offset distance LOD.

Referring to FIG. 6A, a fifth configuration of the first semiconductor die 900 can be derived from the first semiconductor die 900 of FIG. 1A by depositing an optional first metallic liner layer 992L and a metallic pad material layer 994L over the first interconnect-level dielectric material layers (290, 960).

The first metallic liner layer 992L includes a conductive metallic barrier material such as TiN, TaN, and/or WN. The conductive metallic barrier material can block diffusion of copper. The thickness of the first metallic liner layer 992L may be in a range from 4 nm to 80 nm, such as from 8 nm to 40 nm, although lesser and greater thicknesses can also be employed. The metallic pad material layer 994L can include copper, tungsten, molybdenum, cobalt, ruthenium, or a combination thereof. In an illustrative example, if the metallic pad material layer 994L includes copper, the metallic pad material layer 994L may be deposited by electroless or electroplating process.

Referring to FIG. 6B, discrete etch mask material portions 947 can be formed over the metallic pad material layer 994L such that each area of the first pad-connection via structures 968 is covered by a respective one of the discrete etch mask material portions 947. In one embodiment, the etch mask material portions 947 may include patterned discrete portions of a photoresist material formed by application and lithographic patterning of a photoresist material layer. Alternatively, a hard mask material layer can be deposited and lithographically patterned to form the discrete etch mask material portions 947. The discrete etch mask material portions 947 can have horizontal cross-sectional shapes of first bonding pads to be subsequently formed with an optional offset outward from a periphery of a respective first bonding pad in a plan view.

An isotropic etch process can be subsequently performed to isotropically etch unmasked portions of the metallic pad material layer 994L and the first metallic liner layer 992L selective to the material of the first pad-level diffusion barrier layer 972 (or selective to the material of the first pad-connection-level dielectric layer 964 in case the first pad-level diffusion barrier layer 972 is omitted). Unmasked portions of the metallic pad material layer 994L and the first metallic liner layer 992L are isotropically etched employing the discrete etch mask material portions 947 as an etch mask. Patterned remaining portions of the metallic pad material layer 994L and the first metallic liner layer 992L comprise first bonding pads 998. Each bonding pad 998 can be formed on a top surface of a respective one of the first pad-connection via structures 968. Each first bonding pad 998 can optionally comprise a first metallic liner 992, which is a patterned portion of the first metallic liner layer 992. Further, each first bonding pad 998 can comprise a first metallic pad material portion 994, which is a patterned portion of the metallic pad material layer 994L. Each first bonding pad 998 can have at least one concave sidewall, which may be a single sidewall having a circular or cylindrical horizontal cross-sectional shape or a set of multiple horizontally-straight sidewalls providing a polygonal horizontal cross-sectional shape. The discrete etch mask material portions 947 can be subsequently removed, for example, by ashing.

Referring to FIG. 6C, a dielectric material can be deposited in gaps in the array of first bonding pads 998 and over the array of the first bonding pads 998. The deposited dielectric material can be subsequently planarized, for example, employing chemical mechanical planarization and/or a recess etch. Portions of the deposited dielectric material overlying the horizontal plane including the top surface of the first bonding pads 998 can be removed by the planarization process. A remaining continuous portions of the deposited dielectric material forms a first pad-level dielectric layer 944.

Top surfaces of the first bonding pads 998 can be vertically recessed, for example, by overpolishing and/or a recess etch, to be located below the horizontal plane including the distal horizontal surface (i.e., the top surface) of the first pad-level dielectric layer 944. The vertical recess distance is selected so that volume expansion of the materials of the first bonding pads 948 causes the top surface of the first bonding pads 998 to be flush with the horizontal surface of the first pad-level dielectric layer 944 at the elevated temperature of a bonding process to be subsequently employed. For example, the vertical recess distance of the top surfaces of the first bonding pads 998 relative to the horizontal plane including the distal horizontal surface of the first pad-level dielectric layer 944 can be in a range from 10 nm to 100 nm, such as from 20 nm to 60 nm, although lesser and greater vertical recess distances may also be employed.

Each first bonding pad 998 can include a first metallic liner 992 and a first metallic pad material portion 994. The first metallic liner 992 includes, and/or consists of, a horizontally-extending portion. The first metallic fill material portion 994 contacts a top surface of the first metallic liner 992, and is in direct contact with the first pad-level dielectric layer 944. The first pad-level dielectric layer 944 overlies the first interconnect-level dielectric material layers (290. 960), and embeds the first bonding pads 998. Each of the first bonding pads 998 comprises a first proximal horizontal surface PHS1 and a first distal horizontal surface DHS1 that is more distal from the first substrate 908 than the first proximal horizontal surface PHS1 is from the first substrate 908, and has a lesser total area than a total area of the first proximal horizontal surface PHS1.

In one embodiment, the first distal horizontal surface DHS1 is connected to the first proximal horizontal surface PHS1 by a continuous sidewall that contacts the first pad-level dielectric layer 944. In one embodiment, continuous sidewall comprises a concave sidewall that contacts a convex sidewall of the first pad-level dielectric layer 944. In one embodiment, a periphery of the first distal horizontal surface DHS1 is located entirely within a periphery of the first proximal horizontal surface PHS1 in a plan view along a direction that is perpendicular to a top surface of the first substrate 908. In one embodiment, the periphery of the first proximal horizontal surface PHS1 is laterally offset outward from the periphery of the first distal horizontal surface DHS1 by a uniform lateral offset distance LOD in the same manner illustrated in FIGS. 4G and 5G.

Referring to FIG. 7A, a sixth configuration of the first semiconductor die 900 can be derived from the fifth configuration of the first semiconductor die 900 of FIG. 6A by forming discrete etch mask material portions 947 over the metallic pad material layer 994L. Each area of the first pad-connection via structures 968 is covered by a respective one of the discrete etch mask material portions 947. In one embodiment, the etch mask material portions 947 may include patterned discrete portions of a photoresist material formed by application and lithographic patterning of a photoresist material layer. Alternatively, a hard mask material layer can be deposited and lithographically patterned to form the discrete etch mask material portions 947. The discrete etch mask material portions 947 can have horizontal cross-sectional shapes of first bonding pads to be subsequently formed with an optional offset outward from a periphery of a respective first bonding pad in a plan view.

Referring to FIG. 7B, an anisotropic etch process can be subsequently performed to anisotropically etch unmasked portions of the metallic pad material layer 994L and the first metallic liner layer 992L selective to the material of the first pad-level diffusion barrier layer 972 (or selective to the material of the first pad-connection-level dielectric layer 964 in case the first pad-level diffusion barrier layer 972 is omitted). In one embodiment, the anisotropic etch process has an isotropic etch component that causes an undercut around the periphery of each discrete etch mask material portion 947. In another embodiment, the anisotropic etch process collaterally trims the discrete etch mask material portions 947, and thereby widens the width of each etched region while the anisotropic etch process progresses. Patterned remaining portions of the metallic pad material layer 994L and the first metallic liner layer 992L comprise first bonding pads 998 having tapered sidewalls. The tapered sidewalls of the first bonding pads 998 may be straight, and may have a taper angle (as measured between a two-dimensional plane including a sidewall of a sacrificial mesa structure 941 and a vertical line) in a range from 5 degrees to 45 degrees.

Each bonding pad 998 can be formed on a top surface of a respective one of the first pad-connection via structures 968. Each first bonding pad 998 can comprise a first metallic liner 992, which is a patterned portion of the first metallic liner layer 992. Further, each first bonding pad 998 can comprise a first metallic pad material portion 994, which is a patterned portion of the metallic pad material layer 994L. Each first bonding pad 998 can have at least one tapered straight sidewall, which may be a single sidewall having a circular or cylindrical horizontal cross-sectional shape or a set of multiple horizontally-straight sidewalls providing a polygonal horizontal cross-sectional shape. The discrete etch mask material portions 947 can be subsequently removed, for example, by ashing.

Referring to FIG. 7C, a dielectric material can be deposited in gaps in the array of first bonding pads 998 and over the array of the first bonding pads 998. The deposited dielectric material can be subsequently planarized, for example, employing chemical mechanical planarization and/or a recess etch. Portions of the deposited dielectric material overlying the horizontal plane including the top surface of the first bonding pads 998 can be removed by the planarization process. A remaining continuous portions of the deposited dielectric material forms a first pad-level dielectric layer 944.

Top surfaces of the first bonding pads 998 can be vertically recessed, for example, by overpolishing and/or a recess etch, to be located below the horizontal plane including the distal horizontal surface (i.e., the top surface) of the first pad-level dielectric layer 944. The vertical recess distance is selected so that volume expansion of the materials of the first bonding pads 948 causes the top surface of the first bonding pads 998 to be flush with the horizontal surface of the first pad-level dielectric layer 944 at the elevated temperature of a bonding process to be subsequently employed. For example, the vertical recess distance of the top surfaces of the first bonding pads 998 relative to the horizontal plane including the distal horizontal surface of the first pad-level dielectric layer 944 can be in a range from 10 nm to 100 nm, such as from 20 nm to 60 nm, although lesser and greater vertical recess distances may also be employed.

Each first bonding pad 998 can include a first metallic liner 992 and a first metallic pad material portion 994. The first metallic liner 992 includes, and/or consists of, a horizontally-extending portion. The first metallic fill material portion 994 contacts a top surface of the first metallic liner 992, and is in direct contact with the first pad-level dielectric layer 944. The first pad-level dielectric layer 944 overlies the first interconnect-level dielectric material layers (290. 960), and embeds the first bonding pads 998. Each of the first bonding pads 998 comprises a first proximal horizontal surface PHS1 and a first distal horizontal surface DHS1 that is more distal from the first substrate 908 than the first proximal horizontal surface PHS1 is from the first substrate 908, and has a lesser total area than a total area of the first proximal horizontal surface PHS1.

In one embodiment, the first distal horizontal surface DHS1 is connected to the first proximal horizontal surface PHS1 by a continuous sidewall that contacts the first pad-level dielectric layer 944. In one embodiment, continuous sidewall comprises a tapered straight sidewall that contacts a tapered straight sidewall of the first pad-level dielectric layer 944. Each tapered straight sidewall have a straight vertical cross-sectional profile, and is at a non-zero angle with respective to the vertical direction. In one embodiment, a periphery of the first distal horizontal surface DHS1 is located entirely within a periphery of the first proximal horizontal surface PHS1 in a plan view along a direction that is perpendicular to a top surface of the first substrate 908. In one embodiment, the periphery of the first proximal horizontal surface PHS1 is laterally offset outward from the periphery of the first distal horizontal surface DHS1 by a uniform lateral offset distance LOD in the same manner illustrated in FIGS. 4G and 5G.

Referring to FIG. 8A, a second semiconductor die 700 according to an embodiment of the present disclosure is illustrated. The second semiconductor die 700 includes a second substrate 708, second semiconductor devices 720 overlying the second substrate 708, second interconnect-level dielectric material layers 760 overlying the second semiconductor devices 720, and second metal interconnect structures 780 embedded in the second interconnect-level dielectric material layers 760. In one embodiment, the second semiconductor devices 720 may include at least one complementary metal oxide semiconductor (CMOS) circuitry including field effect transistors. In one embodiment, the second substrate 708 may be a second substrate such as a commercially available silicon substrate having a thickness in a range from 500 microns to 1 mm.

Generally, the second semiconductor devices may comprise any semiconductor device that may be operated in conjunction with the first semiconductor devices in the first semiconductor die 900 to provide enhanced functionality. In one embodiment, the first semiconductor die 900 comprises a memory die and the second semiconductor die 700 comprises a logic die that includes a support circuitry (i.e., a peripheral circuitry) for operation of memory devices (such as a three-dimensional array of memory elements) within the memory die. In one embodiment, the first semiconductor die 900 may include a three-dimensional memory device including a three-dimensional array of memory elements, word lines (that may comprise a subset of the electrically conductive layers 46), and bit lines 982, and the second semiconductor devices 720 of the second semiconductor die 700 may include a peripheral circuitry for operation of the three-dimensional array of memory elements. The peripheral circuitry may include one or more word line driver circuits that drive the word lines of the three-dimensional array of memory elements of the first semiconductor die 900, one or more bit line driver circuits that drive the bit lines 982 of the first semiconductor die 900, one or more word line decoder circuits that decode the addresses for the word lines, one or more bit line decoder circuits that decode the addresses for the bit lines 982, one or more sense amplifier circuits that sense the states of memory elements within the memory opening fill structures 58 of the first semiconductor die 900, a source power supply circuit that provides power to the horizontal semiconductor channel layer 10 in the first semiconductor die 900, a data buffer and/or latch, and/or any other semiconductor circuit that may be used to operate three-dimensional memory device of the first semiconductor die 900.

The second interconnect-level dielectric material layers 760 may include a dielectric material such as undoped silicate glass (e.g., silicon oxide), a doped silicate glass, organosilicate glass, silicon nitride, a dielectric metal oxide, or a combination thereof. In an illustrative example, the second metal interconnect structures 780 may include a first logic-side metal level D1 including logic-side first-level metal lines, and a second logic-side metal level D2 including logic-side second-level metal lines.

The second interconnect-level dielectric material layers 760 may include one or more dielectric diffusion barrier layers (not expressly shown). In this case, each dielectric diffusion barrier layer embedded in the second interconnect-level dielectric material layers 760 may include silicon carbon nitride (SiCN), silicon nitride (Si₃N₄), silicon oxynitride, or any other dielectric material that is effective in blocking diffusion of copper.

Subsequently, the processing steps of FIG. 1A can be performed with any needed modifications to form a layer stack including an optional second interconnect-capping dielectric diffusion barrier layer 762, a second pad-connection-level dielectric layer 764, and an optional second pad-level diffusion barrier layer 772, and second pad-connection via structure 768 embedded in the layer stack. Each second pad-connection via structure 768 can include a pad-connection-level metallic barrier liner 768A and a pad-connection-level metallic fill material portion 768B.

The processing steps of FIGS. 1B and 1C can be performed with any needed modifications to form a second proximal pad-level dielectric layer 784P over the second pad-connection-level dielectric layer 764, and second pad base portions 778 can be formed in the second proximal pad-level dielectric layer 784P. Each second pad base portion 778 include a second metallic liner 778A and a second pad base plate portion 778B. The second pad-connection-level dielectric layer 764 can be located between the second interconnect-level dielectric material layers 760 and the second pad-level dielectric layer 784P, and can embed second pad-connection via structures 768 having a respective distal surface that is in contact with a respective one of the second pad base portions 778 and having a lesser area than an area of a proximal horizontal surface of the respective one of the second pad base portions 778.

The processing steps of FIGS. 1D-1F can be performed to form a second distal pad-level dielectric layer 784D over the second proximal pad-level dielectric layer 784P. Second pad pillar portions 788 can be formed in the second distal pad-level dielectric layer 784D. Top surfaces of the second pad pillar portions 788 can be vertically recessed, for example, by overpolishing and/or a recess etch, to be located below the horizontal plane including the distal horizontal surface (i.e., the top surface) of the second distal pad-level dielectric layer 784D. The vertical recess distance is selected so that volume expansion of the materials of the second pad base portions 778 and the second pad pillar portions 788 causes the top surface of the second pad pillar portions 788 to be flush with the distal horizontal surface of the second distal pad-level dielectric layer 784D at the elevated temperature of a bonding process to be subsequently employed. For example, the vertical recess distance of the top surfaces of the second pad pillar portion 788 relative to the horizontal plane including the distal horizontal surface of the second distal pad-level dielectric layer 784D can be in a range from 10 nm to 100 nm, such as from 20 nm to 60 nm, although lesser and greater vertical recess distances may also be employed. Each second pad pillar portion 788 can be formed in a respective second pillar cavity directly on the top surface of a respective second pad base portion 778.

Each contiguous combination of a second pad base portion 778 and a second pad pillar portion 788 constitutes a second bonding pad (778, 788). The combination of the second proximal pad-level dielectric layer 784P and the second distal pad-level dielectric layer 784D constitutes a second pad-level dielectric layer 784 that laterally surrounds, and embeds, the second bonding pads (778, 788). The second pad-level dielectric layer 784 is a composite layer including a layer stack of the second proximal pad-level dielectric layer 784P and the second distal pad-level dielectric layer 784D.

Generally, the second bonding pads (778, 788) in the second pad-level dielectric layer 784 can be formed such that the each of the second bonding pads (778, 788) comprises a second proximal horizontal surface PHS2 and a second distal horizontal surface DHS2 that is more distal from the second substrate 708 than the second proximal horizontal surface PHS2 is from the second substrate 708 and has a lesser total area than a total area of the second proximal horizontal surface PHS2. The second pad-level dielectric layer 784 overlies the second interconnect-level dielectric material layers 760 and embeds the second bonding pads (778, 788).

Each of the second bonding pads (778, 788) comprises a second pad base portion 778 embedded in the second proximal pad-level dielectric layer 784P and a second pad pillar portion 788 contacting the second distal pad-level dielectric layer 784D. The second pad base portions 778 are formed within the second proximal pad-level dielectric layer 784P prior to formation of the second distal pad-level dielectric layer 784D.

In one embodiment, planar distal surfaces of each second pad base portion 778 contacts portions of a proximal horizontal surface of the second distal pad-level dielectric layer 784D. In one embodiment, each second pad base portion 778 comprises a stack of a second metallic liner 778A and a pad base plate portion 778B. Each second pad pillar portion 788 contacts a sidewall of the second distal pad-level dielectric layer 784D. In one embodiment, each of the second bonding pads (778, 788) consists of a second pad base portion 778 and a single second pad pillar portion 788. In on embodiment, each second pad base portion 778 comprises a straight sidewall that vertically extends from a proximal horizontal surface of the second proximal pad-level dielectric layer 784P to a distal horizontal surface of the second proximal pad-level dielectric layer 784P.

Referring to FIG. 8B, a variant of the first configuration of the second semiconductor die 700 can be derived from the second semiconductor die 700 of FIG. 8A by performing the processing steps of FIGS. 2A and 2B instead of the processing steps of FIGS. 1D-1F. At least two pad pillar portions 788 can be formed directly on each second pad base portion 778. In one embodiment, a one-dimensional array of pad pillar portions 788 or a two-dimensional array of pad pillar portions 788 can be formed directly on a top surface of each second pad base portion 778. Generally, a second bonding pad (778, 788) can include a second pad base portion 778 and at least one second pad pillar portion 788. The at least one second pad pillar portion 788 may include a single pad pillar portion 788, or a plurality of second pad pillar portions 788 that are laterally spaced apart from each other. In one embodiment, the plurality of second pad pillar portions 788 may include an M′×N′ rectangular periodic array of second pad pillar portions 788, in which M′ and N′ are independent integers in a range from 2 to 10.

Referring to FIG. 8C, a second configuration of the second semiconductor die 700 can be derived from the first configuration of the second semiconductor die 700 by performing the processing steps of FIGS. 3A-3H according to an embodiment of the present disclosure. Second bonding pads 758 can be formed in the second pad-level dielectric layer 784 such that the each of the second bonding pads 758 comprises a second proximal horizontal surface PHS2 and a second distal horizontal surface DHS2 that is more distal from the second substrate 708 than the second proximal horizontal surface PHS2 is from the second substrate 708 and has a lesser total area than a total area of the second proximal horizontal surface PHS2. The second pad-level dielectric layer 784 overlies the second interconnect-level dielectric material layers 760 and embeds the second bonding pads 750.

Each of the second bonding pads 758 comprises a second pad base portion (758A, 758B) embedded in the second proximal pad-level dielectric layer 784P and a second pad pillar portion 758C contacting the second distal pad-level dielectric layer 784D. The second pad base portions (758A, 758B) are formed within the second proximal pad-level dielectric layer 784P after formation of the second distal pad-level dielectric layer 784D.

In one embodiment, planar distal surfaces of each second pad base portion (758A, 758B) contacts portions of a proximal horizontal surface of the second distal pad-level dielectric layer 784D. In one embodiment, each second pad base portion (758A, 758B) comprises a stack of a second metallic liner 758A and a pad base plate portion 758B. Each second pad pillar portion 758C contacts a sidewall of the second distal pad-level dielectric layer 784D. In one embodiment, each of the second bonding pads 758 consists of a second pad base portion (758A, 758B) and a single second pad pillar portion 758C. In on embodiment, each second pad base portion (758A, 758B) comprises a convex sidewall that vertically extends from a proximal horizontal surface of the second proximal pad-level dielectric layer 784P to a distal horizontal surface of the second proximal pad-level dielectric layer 784P.

Referring to FIG. 8D, a first variant of the second configuration of the second semiconductor die 700 can be derived from the second configuration of the second semiconductor die 700 of FIG. 8C by performing with any needed modifications the processing steps of FIG. 3G in lieu of a subset of the processing steps employed to form the second configuration of the second semiconductor die 700 of FIG. 8C.

Referring to FIG. 8E, a second variant of the second configuration of the second semiconductor die 700 can be derived from the second configuration of the second semiconductor die 700 of FIG. 8C by performing with any needed modifications the processing steps of FIG. 3H in lieu of a subset of the processing steps employed to form the second configuration of the second semiconductor die 700 of FIG. 8C.

Referring to FIG. 9, a third configuration of the second semiconductor die 700 can be derived from the second semiconductor die 700 of FIG. 8A by performing with any needed modifications the processing steps of FIGS. 4A-4G or the processing steps of FIG. 6A-6C. Second bonding pads 748 are formed in a second pad-level dielectric layer 744. Each second bonding pad 748 may have a configuration that is equivalent to the configuration of the first bonding pads 948 in FIG. 4F, or may have a configuration that is equivalent to the configuration of the first bonding pads 948 in FIG. 6C.

Top surfaces of the second bonding pads 748 can be vertically recessed, for example, by overpolishing and/or a recess etch, to be located below the horizontal plane including the distal horizontal surface (i.e., the top surface) of the second pad-level dielectric layer 744. The vertical recess distance is selected so that volume expansion of the materials of the second bonding pads 748 causes the top surface of the second bonding pads 748 to be flush with the horizontal surface of the second pad-level dielectric layer 744 at the elevated temperature of a bonding process to be subsequently employed. For example, the vertical recess distance of the top surfaces of the second bonding pads 748 relative to the horizontal plane including the distal horizontal surface of the second pad-level dielectric layer 744 can be in a range from 10 nm to 100 nm, such as from 20 nm to 60 nm, although lesser and greater vertical recess distances may also be employed. The second pad-connection-level dielectric layer 764 can be located between the second interconnect-level dielectric material layers 760 and the second pad-level dielectric layer 744, and can embed second pad-connection via structures 768 having a respective distal surface that is in contact with a respective one of the second bonding pads 748 and having a lesser area than an area of a horizontal surface of the respective one of the second bonding pads 748.

Each of the second bonding pads 748 comprises a second proximal horizontal surface PHS2 and a second distal horizontal surface DHS2 that is more distal from the second substrate 708 than the second proximal horizontal surface PHS2 is from the second substrate 708. The second distal horizontal surface DHS2 has a lesser total area than a total area of the second proximal horizontal surface PHS2.

The second distal horizontal surface DHS2 is connected to the second proximal horizontal surface PHS2 by a continuous sidewall that contacts the second pad-level dielectric layer 744. In one embodiment, the continuous sidewall comprises a concave sidewall that contacts a convex sidewall of the second pad-level dielectric layer 744. A periphery of the second distal horizontal surface DHS2 is located entirely within a periphery of the second proximal horizontal surface PHS2 in a plan view along a direction that is perpendicular to a top surface of the second substrate 708. In one embodiment, the periphery of the second proximal horizontal surface PHS2 is laterally offset outward from the periphery of the second distal horizontal surface DHS2 by a uniform lateral offset distance.

Referring to FIG. 10, a fourth configuration of the second semiconductor die 700 can be derived from the second semiconductor die 700 of FIG. 8A by performing with any needed modifications the processing steps of FIGS. 5A-5G or the processing steps of FIG. 7A-7C. Second bonding pads 748 are formed in a second pad-level dielectric layer 744. Each second bonding pad 748 may have a configuration that is equivalent to the configuration of the first bonding pads 948 in FIG. 5F, or may have a configuration that is equivalent to the configuration of the first bonding pads 948 in FIG. 7C.

Top surfaces of the second bonding pads 748 can be vertically recessed, for example, by overpolishing and/or a recess etch, to be located below the horizontal plane including the distal horizontal surface (i.e., the top surface) of the second pad-level dielectric layer 744. The vertical recess distance is selected so that volume expansion of the materials of the second bonding pads 748 causes the top surface of the second bonding pads 748 to be flush with the horizontal surface of the second pad-level dielectric layer 744 at the elevated temperature of a bonding process to be subsequently employed. For example, the vertical recess distance of the top surfaces of the second bonding pads 748 relative to the horizontal plane including the distal horizontal surface of the second pad-level dielectric layer 744 can be in a range from 10 nm to 100 nm, such as from 20 nm to 60 nm, although lesser and greater vertical recess distances may also be employed. The second pad-connection-level dielectric layer 764 can be located between the second interconnect-level dielectric material layers 760 and the second pad-level dielectric layer 744, and can embed second pad-connection via structures 768 having a respective distal surface that is in contact with a respective one of the second bonding pads 748 and having a lesser area than an area of a horizontal surface of the respective one of the second bonding pads 748.

Each of the second bonding pads 748 comprises a second proximal horizontal surface PHS2 and a second distal horizontal surface DHS2 that is more distal from the second substrate 708 than the second proximal horizontal surface PHS2 is from the second substrate 708. The second distal horizontal surface DHS2 has a lesser total area than a total area of the second proximal horizontal surface PHS2.

The second distal horizontal surface DHS2 is connected to the second proximal horizontal surface PHS2 by a continuous sidewall that contacts the second pad-level dielectric layer 744. In one embodiment, the continuous sidewall comprises a tapered straight sidewall that contacts a tapered straight sidewall of the second pad-level dielectric layer 744. A periphery of the second distal horizontal surface DHS2 is located entirely within a periphery of the second proximal horizontal surface PHS2 in a plan view along a direction that is perpendicular to a top surface of the second substrate 708. In one embodiment, the periphery of the second proximal horizontal surface PHS2 is laterally offset outward from the periphery of the second distal horizontal surface DHS2 by a uniform lateral offset distance.

Referring to FIG. 11A, a first wafer including a plurality of the first semiconductor dies 900 and a second wafer including a plurality of second semiconductor dies 700 can be aligned to each other for bonding. While the present disclosure is described employing the configuration of the first semiconductor die 900 illustrated in FIGS. 1E and 1F and the configuration of the second semiconductor die 700 illustrated in FIG. 8A, any configuration of the first semiconductor die 900 and any configuration of the second semiconductor die 700 may be employed in all possible combinations. Generally, the pattern of the bonding surfaces of the first bonding pads {(978, 988), 958, 948, 998} in each first semiconductor die 900 can be a mirror image pattern of the bonding surfaces of the second bonding pads {(778, 788}, 758, 748, 798}.

Each second bonding pad {(778, 788}, 758, 748, 798} faces a respective one of the first bonding pads {(978, 988}, 958, 948, 998}. Each facing pair of a first bonding pad {(978, 988}, 958, 948, 998} and a second bonding pad {(778, 788}, 758, 748, 798} can be aligned to maximize the areal overlap between the first bonding pads {(978, 988}, 958, 948, 998} and the second bonding pads {(778, 788}, 758, 748, 798}. If the first bonding pads {(978, 988}, 958, 948, 998} and the second bonding pads {(778, 788}, 758, 748, 798} have different areas, each overlap area between a facing pair of a first bonding pad {(978, 988}, 958, 948, 998} and a second bonding pad {(778, 788}, 758, 748, 798} can be the same as the area of the smaller bonding pad between the facing pair of the first bonding pad {(978, 988}, 958, 948, 998} and the second bonding pad {(778, 788}, 758, 748, 798}. If the first bonding pads {(978, 988}, 958, 948, 998} and the second bonding pads {(778, 788}, 758, 748, 798} have the same area, the overlap area between a facing pair of a first bonding pad {(978, 988}, 958, 948, 998} and a second bonding pad {(778, 788}, 758, 748, 798} can be in a range from 90% to 100%, such as from 95% to 100%, of the area of the first bonding pad {(978, 988}, 958, 948, 998} (which is the same as the area of the second bonding pad {(778, 788}, 758, 748, 798}).

Each facing pair of a first semiconductor die 900 and a second semiconductor die 700 can be brought into contact each other so that each first bonding pad {(978, 988}, 958, 948, 998} contacts a respective one of the second bonding pads {(778, 788}, 758, 748, 798} with a respective areal overlap therebetween. The assembly of the first semiconductor die 900 and the second semiconductor die 700 are annealed at an elevated temperature in a range from 300 degrees Celsius to 400 degrees Celsius to induce copper diffusion across each interface between facing pairs of a respective first bonding pad {(978, 988}, 958, 948, 998} and a respective second bonding pad {(778, 788}, 758, 748, 798}. Each mating pair of a first bonding surface of a first bonding pad {(978, 988}, 958, 948, 998} and a second bonding surface of a second bonding pad {(778, 788}, 758, 748, 798} are brought into contact with each other at a bonding interface located at, or close to, the horizontal plane at which the first pad-level dielectric layer (984, 944) contacts the second pad-level dielectric layer (784, 744). The duration of the anneal process at the elevated temperature can be in a range from 5 minutes to 2 hours, although shorter or longer anneal duration may also be employed. Each facing pair of a first bonding pad {(978, 988}, 958, 948, 998} and a second bonding pad {(778, 788}, 758, 748, 798} is bonded to each other during the anneal process at the elevated temperature. A first exemplary bonded structure including the first semiconductor die 900 and the second semiconductor die 700 can be formed.

Referring to FIG. 11B, the first substrate 908 may be thinned from the backside by grinding, polishing, an anisotropic etch, or an isotropic etch. The thinning process can continue until horizontal portions of the through-substrate liners 386 are removed, and horizontal surfaces of the through-substrate via structures 388 are physically exposed. Generally, end surfaces of the through-substrate via structures 388 can be physically exposed by thinning the backside of the first substrate 908, which may be the substrate of a memory die. The thickness of the first substrate 908 after thinning may be in a range from 1 micron to 30 microns, such as from 2 microns to 15 microns, although lesser and greater thicknesses can also be employed.

Referring to FIG. 11C, a backside insulating layer 930 may be formed on the backside of the first substrate 908. The backside insulating layer 930 includes an insulating material such as silicon oxide. The thickness of the backside insulating layer 930 can be in a range from 50 nm to 500 nm, although lesser and greater thicknesses can also be employed. A photoresist layer (not shown) may be applied over the backside insulating layer 930, and may be lithographically patterned to form opening over areas of the through-substrate via structures 388. An etch process can be performed to form via cavities through the backside insulating layer 930 underneath each opening in the photoresist layer. A top surface of a through-substrate via structure 388 can be physically exposed at the bottom of each via cavity through the backside insulating layer 930.

At least one metallic material can be deposited into the openings through the backside insulating layer 930 and over the planar surface of the backside insulating layer 930 to form a metallic material layer. The at least one metallic material can include copper, aluminum, ruthenium, cobalt, molybdenum, and/or any other metallic material that may be deposited by physical vapor deposition, chemical vapor deposition, electroplating, vacuum evaporation, or other deposition methods. For example, a metallic nitride liner material (such as TiN, TaN, or WN) may be deposited directly on the physically exposed surfaces of the through-substrate via structures 388, on sidewalls of the openings through the backside insulating layer 930, and over the physically exposed planar surface of the backside insulating layer 930. The thickness of the metallic nitride liner material can be in a range from 10 nm to 100 nm, although lesser and greater thicknesses can also be employed. At least one metallic fill material such as copper or aluminum can be deposited over the metallic nitride liner material. In one embodiment, the at least one metallic fill material can include a stack of a high-electrical-conductivity metal layer (such as a copper layer or an aluminum layer) and an underbump metallurgy (UBM) layer stack for bonding a solder ball thereupon. Exemplary UBM layer stacks include, but are not limited to, an Al/Ni/Au stack, an Al/Ni/Cu stack, a Cu/Ni/Au stack, a Cu/Ni/Pd stack, a Ti/Ni/Au stack, a Ti/Cu/Ni/Au stack, a Ti—W/Cu stack, a Cr/Cu stack, and a Cr/Cu/Ni stack. The thickness of the metallic material layer over the planar horizontal surface of the backside insulating layer 930 can be in a range from 0.5 microns to 10 microns, such as from 1 micron to 5 microns, although lesser and greater thicknesses can also be employed.

The at least one metallic fill material and the metallic material layer can be subsequently patterned to form discrete backside bonding pads 936 contacting a respective one of the through-substrate via structures 388. The backside bonding pads 936 can function as external bonding pads that can be employed to electrically connect various nodes of within the first semiconductor die 900 and the second semiconductor die 700 to external nodes, such as bonding pads on a packaging substrate or C4 bonding pads of another semiconductor die. For example, solder material portions 938 can be formed on the backside bonding pads 936, and a C4 bonding process or a wire bonding process can be performed to electrically connect the backside bonding pads 936 to external electrically active nodes.

Generally, backside bonding pads 936 can be formed on a backside surface of the first semiconductor die 900 (which may be a memory die) that is located on an opposite side of the bonding interface between the first bonding pads {(978, 988}, 958, 948, 998} and the second bonding pads {(778, 788}, 758, 748, 798}. Through-substrate via structures 388 can vertically extend through the first semiconductor die 900, and can provide electrical connection between the backside bonding pads 936 and a subset of the bonding pads (988, 788).

In alternative variants of the first exemplary structure, the reentrant shaped bonding pads having a lesser distal horizontal surface area of each bonding pad than the area of a proximal horizontal surface area of the respective bonding pad shown in FIG. 11C may be implemented in only one semiconductor die in a bonded assembly, as illustrated in FIGS. 11D and 11E. As shown in FIG. 11D, only the first semiconductor die 900 has reentrant shaped bonding pads. Alternatively, as shown in FIG. 11E, only the second semiconductor die 700 has reentrant shaped bonding pads.

Referring to FIG. 12, a variant of the first exemplary structure can be derived from the first exemplary structure of FIG. 11C by employing a variant of the first configuration of the first semiconductor die 900 illustrated in FIGS. 2A and 2B and by employing a variant of the first configuration of the second semiconductor die 700 illustrated in FIG. 8B.

Referring to FIG. 13, a second exemplary structure can be derived from the first exemplary structure of FIG. 11C by employing a second configuration of the first semiconductor die 900 illustrated in FIG. 3F (or variants thereof as shown in FIGS. 3G and 3H) and by employing a second configuration of the second semiconductor die 700 illustrated in FIG. 8C (or variants thereof as illustrated in FIGS. 8D and 8E).

Referring to FIG. 14, a third exemplary structure can be derived from the first exemplary structure of FIG. 11C by employing a third configuration of the first semiconductor die 900 illustrated in FIGS. 4F and 4G or by employing a fifth configuration of the first semiconductor die 900 illustrated in FIG. 6C, and by employing a third configuration of the second semiconductor die 700 illustrated in FIG. 9.

Referring to FIG. 15, a fourth exemplary structure can be derived from the first exemplary structure of FIG. 11C by employing a fourth configuration of the first semiconductor die 900 illustrated in FIGS. 5F and 4G or by employing a sixth configuration of the first semiconductor die 900 illustrated in FIG. 7C, and by employing a fourth configuration of the second semiconductor die 700 illustrated in FIG. 10.

The reentrant shaped bonding pads having a lesser distal horizontal surface area of each bonding pad than the area of a proximal horizontal surface area of the respective bonding pad shown in FIGS. 11D and 11E may be implemented in only one semiconductor die in a bonded assembly illustrated in FIGS. 12, 13, 14 and/or 15.

The change in volume of a bonding pad after the bonding anneal is a function of the initial volume of the bonding pad. The change in height of the bonding pad after the bonding anneal is proportional to the change in volume divided by the area of the bonding pad at the bonding interface. Thus, reentrant shaped bonding pads have a larger change in height of the bonding pad after the bonding anneal because they have a larger volume in the proximal portion of the bonding pad (which acts as a reservoir of the bonding metal) and a smaller area of the distal portion of the bonding pad at the bonding interface. Therefore, the reentrant shape of bonding pad of one or more semiconductor dies of the embodiments present disclosure can be advantageously employed to ensure that the bonding surface of a mating pair of bonding pads make direct contact with each other during a bonding process, and thus decrease an amount of voids between the mating pads, and increase the bonding yield and the reliability of bonded pads.

Referring to all drawings of the present disclosure collectively, the various embodiments of the present disclosure provide a structure comprising a first semiconductor die 900. The first semiconductor die 900 can comprise: first semiconductor devices 920 located over a first substrate 908; first interconnect-level dielectric material layers (290, 960) embedding first metal interconnect structures 980 and located on the first semiconductor devices 920; and a first pad-level dielectric layer (984, 944) located on the first interconnect-level dielectric material layers (290, 960) and embedding first bonding pads {(978, 988}, 958, 948, 998}, wherein each of the first bonding pads {(978, 988}, 958, 948, 998} comprises a first pad base portion {(958A, 958B), (958A, 958D1), 958B} and at least one first pad pillar portion (958C, 958D2) that has a lesser area than the first pad base portion {(958A, 958B), (958A, 958D1), 958B}, and is more distal from the first substrate 908 than the first pad base portion {(958A, 958B), (958A, 958D1), 958B} is from the first substrate 908.

According to another aspect of the present disclosure, a structure comprising a first semiconductor die 900 is provided. The first semiconductor die 900 can comprise: first semiconductor devices 920 located over a first substrate 908; first interconnect-level dielectric material layers (290, 960) embedding first metal interconnect structures 980 and located on the first semiconductor devices 920; and a first pad-level dielectric layer (984, 944) located on the first interconnect-level dielectric material layers (290, 960) and embedding first bonding pads {(978, 988}, 958, 948, 998}, wherein each of the first bonding pads {(978, 988}, 958, 948, 998} comprises a first proximal horizontal surface PHS1 and at least one first distal horizontal surface DHS1 that is more distal from the first substrate 908 than the first proximal horizontal surface PHS1 is from the first substrate 908 and has a lesser total area than a total area of the first proximal horizontal surface PHS1.

FIGS. 16A-16D are sequential vertical cross-sectional views of a first configuration of a first bonding pad for a fifth exemplary structure according to another embodiment of the present disclosure.

Referring to FIG. 16A, the first configuration of the first bonding pad for the fifth exemplary structure can be provided by performing any of the previously described processing steps for forming first pad base portions 978 in the first proximal pad-level dielectric layer 984P. In one embodiment, the first pad base portions 978 may include copper at an atomic percentage greater than 95%. In one embodiment, the first pad base plate portions 978B comprise, and/or consist essentially of, copper, and can be formed by electroplating and a subsequent planarization process, such as a chemical mechanical planarization process. In one embodiment, the first pad base portions 978 may have a respective planar top surface that is coplanar with a top surface of the first proximal pad-level dielectric layer 984P.

Referring to FIG. 16B, a first distal pad-level dielectric layer 984D can be deposited in the same manner as described above. The combination of the first proximal pad-level dielectric layer 984P and the first distal pad-level dielectric layer 984D constitutes a first pad-level dielectric layer 984.

Referring to FIG. 16C, a pad cavity can be formed above each first pad base portion 978, for example, by forming a photoresist layer above the first distal pad-level dielectric layer 984D, patterning the photoresist layer with openings having the same pattern as the first pad base portions 978, and transferring the pattern in the photoresist layer through the first distal pad-level dielectric layer 984D. A top surface of a first pad base portion 978 can be physically exposed at the bottom of each pad cavity. The photoresist layer can be subsequently removed, for example, by ashing.

Referring to FIG. 16D and according to an aspect of the present disclosure, first metal alloy-forming material portions 918 can be formed in each pad cavity in the first distal pad-level dielectric layer on a respective one of the first pad base portions 978. In one embodiment, the first metal alloy-forming material portions 918 comprise silicon, germanium or a silicon-germanium compound semiconductor material which can form a first metal-semiconductor alloy material, such as copper silicide (e.g., Cu₅Si, Cu₁₅Si₄ and/or Cu₃Si), copper germanide or copper germanide-silicide after annealing by interdiffusion with copper of first pad base portions 978. The annealing may be conducted after deposition of the first metal alloy-forming material portions 918, or during a subsequent die bonding step which will be described in more detail below with respect to FIGS. 18 and 19. In another embodiment, the first metal alloy-forming material portions 918 comprise an as-deposited first metal-semiconductor alloy material, such as copper silicide, copper germanide or copper germanide-silicide. In yet another embodiment, the first metal alloy-forming material portions 918 comprise a first intermetallic alloy material, such as an alloy of copper and at least one other metal. For example, the intermetallic alloy may comprise a copper based alloy containing more than 50 atomic percent copper, such as 60 to 99 atomic percent copper, such as 80 to 98 atomic percent copper, and less than 50 atomic percent, such as 1 to 40 atomic percent, such as 2 to 20 atomic percent of another metal, such as a metal selected from aluminum, zinc, iron and/or tin.

Generally, the first metal-semiconductor alloy material or the first intermetallic alloy material of the first metal alloy-forming material portions 918 has a higher coefficient of thermal expansion (CTE) than the material (e.g., copper) of first pad base portions 978. Copper has a CTE of about 1.65×10⁻⁵/K. In one embodiment, the first pad base portions 978 may include copper at an atomic percentage greater than 95%, and can have a CTE in a range from 1.5×10⁻⁵/K to 2.0×10⁻⁵/K, and the material of the first metal alloy-forming material portions 918 can have a CTE in a range from 1.7×10⁻⁵/K to 4.0×10⁻⁵/K. The first metal alloy-forming material portions 918 can be formed by chemical vapor deposition, physical vapor deposition, spin coating, electroplating, or electroless plating. Each contiguous combination of a first pad base portion 978 and a first metal alloy-forming material portion 918 comprises a first bonding pad (978, 918).

FIGS. 17A-17C are sequential vertical cross-sectional views of a second configuration of a first bonding pad for the fifth exemplary structure according to an embodiment of the present disclosure.

Referring to FIG. 17A, first pad base portions 978 can be formed in a first pad-level dielectric layer 984. The thickness of the first pad-level dielectric layer 984 may be in a range for the combined thickness for the first proximal pad-level dielectric layer 984P and the first distal pad-level dielectric layer 984D. The first pad base portions 978 may include copper at an atomic percentage greater than 95%. In one embodiment, the first pad base plate portions 978B comprise, and/or consist essentially of, copper, and can be formed by electroplating and a subsequent planarization process such as a chemical mechanical planarization process. In one embodiment, the first pad base portions 978 may have a respective planar top surface that is coplanar with a top surface of the first pad-level dielectric layer 984.

Referring to FIG. 17B, a recess etch process can be performed to vertically recess the top surfaces of the first pad base portions 978. The vertical recess distance may be in a range from 30 nm to 600 nm, such as from 60 nm to 300 nm, although lesser and greater vertical recess distances may also be employed. A wet etch process or a dry etch process may be employed for the recess etch process. Pad cavities are formed in volumes formed by recessing the first pad base portions 978.

Referring to FIG. 17C, the processing steps of FIG. 16D can be performed to form first metal alloy-forming material portions 918 in each pad cavity in the first pad-level dielectric layer 984 on a respective one of the first pad base portions 978. The first metal alloy-forming material portions 918 can have the same material composition and the same thickness as described above. Each contiguous combination of a first pad base portion 978 and a first metal alloy-forming material portion 918 comprises a first bonding pad (978, 918).

Referring to FIG. 18, a fifth exemplary structure is illustrated after aligning a first semiconductor die 900 and a second semiconductor die 700 for bonding. Generally, a first semiconductor die 900 is provided, which comprises first semiconductor devices 910 located over a first substrate 908, and a first pad-level dielectric layer 984 and embedding first bonding pads (978, 918). In one embodiment, each of the first bonding pads (978, 918) comprises a respective first pad base portion 978 and a respective first metal alloy-forming material portion 918. A second semiconductor die 700 is provided, which comprises second semiconductor devices 710 located over a second substrate 708, and a second pad-level dielectric layer 784 embedding second bonding pads (778, 718). In one embodiment, each of the second bonding pads (778, 718) comprises a respective second pad base portion 778 and a respective second metal alloy-forming material portion 718. Generally, the second pad base portions 778 can have the same geometry and the same material composition as any of the first pad base portions 978 described above. The second metal alloy-forming material portions 718 can have the same geometry and the same material composition as any of the first metal alloy-forming material portions 918 described above. In one embodiment described above with respect to FIG. 16D, the first metal alloy-forming material portions 918 comprise silicon, germanium or a silicon-germanium compound semiconductor material which can form a first metal-semiconductor alloy material, such as copper silicide (e.g., Cu₅Si, Cu₁₅Si₄ and/or Cu₃Si), copper germanide or copper germanide-silicide after annealing by interdiffusion with copper of first pad base portions 978.

Referring to FIG. 19, an anneal process is performed to induce bonding between the first bonding pads (978, 918) and the second bonding pads (778, 718). In one embodiment, the first metal alloy-forming material portions 918 and the second metal alloy-forming material portions 718 comprise a first metal-semiconductor alloy-forming material and a second metal-semiconductor alloy material. The second metal-semiconductor alloy material may be the same as, or may be different from, the first metal-semiconductor alloy material.

In one embodiment, the as-deposited first metal alloy-forming material portions 918 and the second metal alloy-forming material portions 718 comprise, and/or consist essentially of, silicon, germanium or a silicon-germanium compound semiconductor. During the bonding anneal, the first metal alloy-forming material portions 918 interdiffuse with the first pad base portions 978 to form first metal-semiconductor alloy material, such as copper silicide, copper germanide, or copper germanide-silicide in the first metal alloy-forming material portions 918. During the bonding anneal, the second metal alloy-forming material portions 718 also interdiffuse with the second pad base portions 778 to form a second metal-semiconductor alloy material, such as copper silicide, copper germanide, or copper germanide-silicide in the second metal alloy-forming material portions 718. For example, the Cu₃Si phase of copper silicide may be formed at about 200° C. by reaction of a copper layer and a silicon layer. The bonding anneal temperature may be between 200° C. and 400° C., such as between 250° C. and 350° C., which is sufficient to form copper silicide first metal alloy-forming material portions 918 and second metal alloy-forming material portions 718. Performing the silicidation anneal and the bonding anneal during the same annealing step results in the volume expansion during formation of the silicide and also leads to a strong contact and bond between the two silicide portions (718, 918). This can supplement the benefits of higher volume expansion of the bonding surfaces due to a higher coefficient of thermal expansion.

In another embodiment, the as-deposited first metal alloy-forming material portions 918 and the second metal alloy-forming material portions 718 comprise, and/or consist essentially of, copper silicide, copper germanide, or copper germanide-silicide. In yet another embodiment, the as-deposited first metal alloy-forming material portions 918 and the second metal alloy-forming material portions 718 comprise, and/or consist essentially of an intermetallic alloy, such as a copper based alloy with at least one of Al, Zn, Fe or Sn.

The first metal alloy-forming material portions 918 which comprise the above metal-semiconductor alloy or intermetallic alloy material have a higher coefficient of thermal expansion (CTE) than the CTE of the respective first pad base portion 978. The second metal alloy-forming material portions 718 which comprise the above metal-semiconductor alloy or intermetallic alloy material have a higher CTE than the CTE of the respective second pad base portion 778. The higher CTE leads to a higher volume expansion during an anneal.

The volumes of the first metal alloy-forming material portions 918 and the second metal alloy-forming material portions 718 expand at the elevated temperature during the bonding anneal process. Each mating pair of a first metal alloy-forming material portions 918 and a second metal alloy-forming material portions 718 is bonded to each other by metal-to-metal bonding to form bonded pairs of a first bonding pad (978, 918) and a second bonding pad (778, 718). The higher CTE of the first metal alloy-forming material portions 918 and the second metal alloy-forming material portions 718 relative to the materials of the first pad base portions 978 and the second pad base portions 778 facilitates improved filling of the cavities between mating pairs of the first bonding pads (978, 918) and a second bonding pads (778, 718) compared to bonding pads which consist of only the respective copper base portions 998 and 778. Each of the second bonding pads (778, 718) is bonded to a respective one of the first bonding pads (978, 918).

FIGS. 20A and 20B are sequential vertical cross-sectional views of a third configuration of bonding pads in the fifth exemplary structure during a bonding process according to another embodiment of the present disclosure.

Referring to FIG. 20A, the third configuration of the bonding pads can be derived from the configuration illustrated in FIG. 18 by reducing the lateral dimension of the second bonding pads (778, 718) relative to the lateral dimension of the first bonding pads (978, 918) and by employing a tapered reentrant profile for the second bonding pads (778, 718). In one embodiment, the processing steps of FIGS. 5A-5F, 6A-6C, or 7A-7C may be employed to form the second bonding pads (778, 718) illustrated in FIG. 20A.

Referring to FIG. 20B, the processing steps of FIG. 19 may be performed to form a bonded assembly. Each mating pair of a first bonding pad (978, 918) and a second bonding pad (778, 718) is bonded to each other.

FIGS. 21A and 21B are sequential vertical cross-sectional views of a fourth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

Referring to FIG. 21A, the fourth configuration of the bonding pads can be derived from the configuration illustrated in FIG. 20A by omitting the processing steps for formation of the second distal pad-level dielectric layer 784D and the second metal alloy-forming material portions 718. Each second bonding pad includes a second pad base portion 778.

Referring to FIG. 21B, the processing steps of FIG. 19 may be performed to form a bonded assembly. Each mating pair of a first bonding pad (978, 918) and a second bonding pad 778 is bonded to each other. In one embodiment, the second pad base portions 778 include copper at an atomic percentage greater than 95%, and are bonded directly to a respective one of the first metal alloy-forming material portions 918.

FIGS. 22A and 22B are sequential vertical cross-sectional views of a fifth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

Referring to FIG. 22A, the fifth configuration of the bonding pads can be derived from the configuration illustrated in FIG. 20A by omitting the processing steps for formation of the first distal pad-level dielectric layer 984D and the first metal alloy-forming material portions 918. Each first bonding pad includes a first pad base portion 978.

Referring to FIG. 22B, the processing steps of FIG. 19 may be performed to form a bonded assembly. Each mating pair of a first bonding pad 978 and a second bonding pad (778, 718) is bonded to each other. In one embodiment, the first pad base portions 978 include copper at an atomic percentage greater than 95%, and are bonded directly to a respective one of the second metal alloy-forming material portions 718.

FIGS. 23A-23D are sequential vertical cross-sectional views of a sixth configuration of a first bonding pad for the fifth exemplary structure according to an embodiment of the present disclosure.

Referring to FIG. 23A, the sixth configuration of a first bonding pad for the fifth exemplary structure can be derived from the structure employed in FIG. 16A by employing a chemical mechanical planarization (i.e., chemical mechanical polishing) process that induces dishing of the first pad base portions 978. In this embodiment, the first pad-level dielectric layer 984 may consist of a first distal pad-level dielectric layer 984P.

Referring to FIG. 23B, the processing steps of FIG. 16B can be performed to form a first distal pad-level dielectric layer 984D over the first proximal pad-level dielectric layer 984P.

Referring to FIG. 23C, the processing steps of FIG. 16C can be performed to form pad cavities in the first proximal pad-level dielectric layer 984P over each of the first pad base portions 978.

Referring to FIG. 23D, the processing steps of FIG. 16D can be performed to form first metal alloy-forming material portions 918. The first metal alloy-forming material portions 918 can be formed with convex bottom surfaces and concave top surfaces. Subsequently, the processing steps of FIGS. 18 and 19 can be performed to form a bonded assembly.

FIGS. 24A-24C are sequential vertical cross-sectional views of an alternative of the sixth configuration of a first bonding pad for the fifth exemplary structure according to an embodiment of the present disclosure in which the first distal pad-level dielectric layer 984D is omitted.

Referring to FIG. 24A, the alternative of the sixth configuration of a first bonding pad for the fifth exemplary structure can be derived from the structure employed in FIG. 17A by employing a chemical mechanical planarization process that induces dishing of the first pad base portions 978. In this embodiment, the first pad-level dielectric layer 984 may consist of a first distal pad-level dielectric layer 984P.

Referring to FIG. 24B, the processing steps of FIG. 17B can be performed to form pad cavities in the first pad-level dielectric layer 984 over each of the first pad base portions 978.

Referring to FIG. 24C, the processing steps of FIG. 17C can be performed to form first metal alloy-forming material portions 918. The first metal alloy-forming material portions 918 can be formed with convex bottom surfaces and concave top surfaces. Subsequently, the processing steps of FIGS. 18 and 19 can be performed to form a bonded assembly.

FIGS. 25A and 25B are sequential vertical cross-sectional views of the sixth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

Referring to FIG. 25A, each of the first semiconductor die 900 and the second semiconductor die 700 can have the configuration illustrated in FIG. 23D or in FIG. 24C. The processing steps of FIG. 18 can be performed to align the first semiconductor die 900 and the second semiconductor die.

Referring to FIG. 25B, the processing steps of FIG. 19 can be performed to form a bonded assembly of the first semiconductor die 900. Each mating pair of a first bonding pad (978, 918) and a second bonding pad (778, 718) is bonded, and void between the first bonding pad (978, 918) and the second bonding pad (778, 718) may be eliminated during, and after, the bonding process.

FIGS. 26A and 26B are sequential vertical cross-sectional views of a seventh configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

Referring to FIG. 26A, the seventh configuration of the bonding pads can be derived from the configuration illustrated in FIG. 25A by omitting the processing steps for recessing the second pad base portions 778 and by omitting the processing steps for forming the second metal alloy-forming material portions 718. Each second bonding pad includes a second pad base portion 778.

Referring to FIG. 26B, the processing steps of FIG. 19 may be performed to form a bonded assembly. Each mating pair of a first bonding pad (978, 918) and a second bonding pad 778 is bonded to each other. In one embodiment, the second pad base portions 778 include copper at an atomic percentage greater than 95%, and are bonded directly to a respective one of the first metal alloy-forming material portions 918.

FIGS. 27A and 27B are sequential vertical cross-sectional views of an eighth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

Referring to FIG. 27A, the eighth configuration of the bonding pads can be derived from the configuration illustrated in FIG. 25A by omitting the processing steps for recessing the first pad base portions 978 and by omitting the processing steps for forming the first metal alloy-forming material portions 918. Each first bonding pad includes a first pad base portion 978.

Referring to FIG. 27B, the processing steps of FIG. 19 may be performed to form a bonded assembly. Each mating pair of a first bonding pad 978 and a second bonding pad (778, 718) is bonded to each other. In one embodiment, the first pad base portions 978 include copper at an atomic percentage greater than 95%, and are bonded directly to a respective one of the second metal alloy-forming material portions 718.

FIGS. 28A and 28B are sequential vertical cross-sectional views of a ninth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

Referring to FIG. 28A, the ninth configuration of the bonding pads can be derived from the structure illustrated in FIG. 20A by forming concave top surfaces during the planarization processes that form the first pad base portions 978, and by forming concave top surfaces during the planarization process that forms the second pad base portions 778. In one embodiment, each of the first metal alloy-forming material portions 918 can be formed with a convex surface and with a concave surface. Each of the second metal alloy-forming material portions 718 can be formed with a convex surface and with a concave surface.

Referring to FIG. 28B, the processing steps of FIG. 19 may be performed to form a bonded assembly. Each mating pair of a first bonding pad (978, 918) and a second bonding pad (778, 718) is bonded to each other.

FIGS. 29A and 29B are sequential vertical cross-sectional views of a tenth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

Referring to FIG. 29A, the tenth configuration of the bonding pads can be derived from the configuration illustrated in FIG. 28A by omitting the processing steps for recessing the second pad base portions 778 and by omitting the processing steps for forming the second metal alloy-forming material portions 718. Each second bonding pad includes a second pad base portion 778.

Referring to FIG. 29B, the processing steps of FIG. 19 may be performed to form a bonded assembly. Each mating pair of a first bonding pad (978, 918) and a second bonding pad 778 is bonded to each other. In one embodiment, the second pad base portions 778 include copper at an atomic percentage greater than 95%, and are bonded directly to a respective one of the first metal alloy-forming material portions 918.

FIGS. 30A and 30B are sequential vertical cross-sectional views of an eleventh configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

Referring to FIG. 30A, the eleventh configuration of the bonding pads can be derived from the configuration illustrated in FIG. 28A by omitting the processing steps for recessing the first pad base portions 978 and by omitting the processing steps for forming the first metal alloy-forming material portions 918. Each first bonding pad includes a first pad base portion 978.

Referring to FIG. 30B, the processing steps of FIG. 19 may be performed to form a bonded assembly. Each mating pair of a first bonding pad 978 and a second bonding pad (778, 718) is bonded to each other. In one embodiment, the first pad base portions 978 include copper at an atomic percentage greater than 95%, and are bonded directly to a respective one of the second metal alloy-forming material portions 718.

FIGS. 31A and 31B are sequential vertical cross-sectional views of a twelfth configuration of bonding pads in the fifth exemplary structure during a bonding process according to an embodiment of the present disclosure.

Referring to FIG. 31A, the twelfth configuration of the bonding pads can be derived from any of the configurations described above by employing a layer stack of at least two material layers to form first metal alloy-forming material portions 918 and/or to form second metal alloy-forming material portions 718. In one embodiment, one or both of the first metal alloy-forming material portions 918 and/or the second metal alloy-forming material portions 718 may include at least one metal layer and at least one semiconductor material layer that can interdiffuse to form a metal-semiconductor alloy material such as a metal silicide, a metal germanide, or a metal germane-silicide. In another embodiment, one or both of the first metal alloy-forming material portions 918 and/or the second metal alloy-forming material portions 718 may include at least one first transition metal layer and at least one second transition metal layer that can interdiffuse to form an intermetallic alloy material.

Referring to FIG. 31B, the processing steps of FIG. 19 may be performed to form a bonded assembly. Each mating pair of a first bonding pad (978, 918) and a second bonding pad (778, 718) is bonded to each other. In one embodiment, the first and second pad base portions 978 and 778 include copper at an atomic percentage greater than 95%, and the first metal alloy-forming material portions 918 are bonded directly to a respective one of the second metal alloy-forming material portions 718. In one embodiment, each of the first metal alloy-forming material portions 918 and/or the second metal alloy-forming material portions 718 includes a metal-semiconductor alloy material or an intermetallic alloy material.

The exemplary structure of FIG. 19 includes a bonded assembly, which includes a first semiconductor die 900 that comprises first semiconductor devices 910, and a first pad-level dielectric layer 984 and embedding first bonding pads {978 and (918 or 988)}; and a second semiconductor die 700 that comprises second semiconductor devices 710, and a second pad-level dielectric layer 784 embedding second bonding pads {778 or (778, 718)} that includes a respective second pad base portion 778. Each of the second bonding pads is bonded to a respective one of the first bonding pads. Each of the first bonding pads comprises a respective first pad base portion 978 and a respective first material portion (918 or 988) comprising a different material than the first pad base portion 978, such as a respective first metal alloy material portion 918 having a higher coefficient of thermal expansion (CTE) than the respective first pad base portion 978.

In one embodiment, the first metal alloy material portion 918 comprises copper silicide, copper germanide, or copper germanide-silicide. In another embodiment, the first metal alloy material portion 918 comprises an intermetallic copper based alloy material that includes greater than 50 atomic percent copper and less than 50 atomic percent of another metal selected from at least one of aluminum, zinc, iron or tin.

In one embodiment, the second pad base portions 778 include copper at an atomic percentage greater than 95%, and each of the second bonding pads further comprises a second metal alloy material portion 718 having a higher coefficient of thermal expansion (CTE) than the second pad base portions 778.

In one embodiment, the first metal alloy material portions 918 comprise a first metal-semiconductor alloy material; the second metal alloy material portions 718 comprise a second metal-semiconductor alloy material; and the first metal alloy material portions 918 are bonded to a respective one of the second metal alloy material portions 718.

In one embodiment, the first metal alloy material portions 918 comprise a first intermetallic alloy material; the second metal alloy material portions 718 comprise a second intermetallic alloy material; and the first metal alloy-forming material portions 918 are bonded to a respective one of the second metal alloy-forming material portions 718.

In one embodiment, the first pad-level dielectric layer 984 comprises a layer stack that includes: a proximal pad-level dielectric layer 984P laterally surrounding the first pad base portions 978; and a distal pad-level dielectric layer 984D laterally surrounding the first metal alloy material portions 918. In one embodiment, each of the first metal alloy material portions 918 comprises a convex surface that contacts a concave surface of a respective one of the first pad base portions 978. In one embodiment, each of the second bonding pads (778, 718) comprises a respective second metal alloy material portion 718 having a higher coefficient of thermal expansion (CTE) than the second pad base portions 778. In one embodiment, within each of the second bonding pads (778, 718), a concave surface of the respective second pad base portion 778 contacts a convex surface of the respective second metal alloy material portion 718. In one embodiment, each of the first metal alloy material portions 918 comprises an additional convex surface that contacts a concave surface of a respective one of the second bonding pads (778, 718).

The various configurations of the fifth exemplary structure provide a strong metal-to-metal bond with fewer or no voids than prior art bonds, while also avoiding or reducing voids or gaps between the opposing pad-level dielectric layers. By using a copper alloy with a higher coefficient of thermal expansion and/or a higher coefficient of volume expansion than pure copper at the bonding interface, the metal voids at the bonding interface are avoided or reduced, and bond strength is increased. Furthermore, the formation of protrusions in bonding pads is not required, which reduces or eliminates voids or gaps between the opposing pad-level dielectric layers.

Referring to FIG. 32A, a first semiconductor die 900 of a sixth exemplary structure is illustrated according to an embodiment of the present disclosure. The first semiconductor die 900 of the sixth exemplary structure can be derived from the first semiconductor die 900 of the first exemplary structure by omitting formation of the first interconnect-capping dielectric diffusion barrier layer 962, the first pad-connection-level dielectric layer 964, the optional first pad-level diffusion barrier layer 972, and the first pad-connection via structures 968. In other words, the processing steps for forming the first interconnect-capping dielectric diffusion barrier layer 962, the first pad-connection-level dielectric layer 964, the optional first pad-level diffusion barrier layer 972, and the first pad-connection via structures 968 illustrated in FIG. 1A can be omitted for the purpose of forming the first semiconductor die 900 of the sixth exemplary structure.

Further, the pattern of the first metal interconnect structures 980 can be modified such that a subset of the first metal interconnect structures 980 formed at the topmost level of the first interconnect-level dielectric material layers 960 comprises first metallic bonding structures 981. In other words, a subset of the first metal interconnect structures 980 located at the topmost level of the interconnect-level dielectric material layers 960 can have a pattern of the first metallic bonding structures 981 that can be directly bonded to a metal bonding pad in an opposing second die without an intervening bonding pad (978, 988) described above in the first semiconductor die 900. In one embodiment, an additional subset of the first metal interconnect structures 980 formed at the topmost level of the first interconnect-level dielectric material layers 960 may comprise optional first metal lines 98L having a respective uniform width along a respective widthwise direction and having top surfaces located within a same horizontal plane as the top surface of the first metallic bonding structures 981 and the topmost layer among the first interconnect-level dielectric material layers 960.

The dielectric material of the topmost layer among the first interconnect-level dielectric material layers 960 may comprise, and/or may consist essentially of, undoped silicate glass (e.g., silicon oxide) or a doped silicate glass. In one embodiment, the first metallic bonding structures 981 and the first metal lines 98L may be composed primarily of a metallic material (such as copper) that forms metal-to-metal bonds (such as copper-to-copper bonds). The thickness of the first metallic bonding structures 981 and the first metal lines 98L may be in a range from 500 nm to 5,000 nm, although lesser and greater thicknesses may also be employed. In one embodiment, the lateral dimensions (such as the width and the length) of each of the first metallic bonding structures 981 may be in a range from 500 nm to 20 microns, such as from 1 micron to 10 microns, although lesser and greater lateral dimensions may also be employed.

Generally, the first semiconductor die 900 comprises first semiconductor devices 920, and first interconnect-level dielectric material layers 960 embedding first metal interconnect structures 980 and first metallic bonding structures 981. In one embodiment, the subset of the first metal interconnect structures 980 comprises first metal lines 98L having a respective uniform width along a respective widthwise direction.

Referring to FIG. 32B, a first dielectric capping layer 987 may be formed over the first interconnect-level dielectric material layers 960, the first metallic bonding structures 981, and the first metal lines 98L. The first capping dielectric layer 987 comprises a dielectric material that provides vertical spacing between the first metallic bonding structures 981 and a second semiconductor die to be subsequently bonded to the first semiconductor die 900. In one embodiment, the first dielectric capping layer 987 comprises a dielectric material selected from silicon carbide nitride (i.e., silicon carbonitride), silicon nitride, silicon oxide, or a dielectric metal oxide. In one embodiment, the first dielectric cap layer 987 may comprise a diffusion-blocking dielectric material, such as silicon carbide nitride or silicon nitride. The first dielectric capping layer 987 contacts distal horizontal surfaces of the first metallic bonding structures 981 and distal horizontal surfaces of a subset of the first metal interconnect structures 980.

In one embodiment, the first dielectric capping layer 987 may be formed by depositing a dielectric material and planarizing the dielectric material. For example, the first dielectric cap layer 987 may be formed by depositing a blanket (i.e., unpatterned) dielectric capping material layer having a first thickness, and by planarizing the blanket dielectric capping material layer so that the thickness of the blanket dielectric capping material layer is reduced to a second thickness. In an illustrative example, a silicon nitride layer or a silicon carbide nitride layer may be deposited to a first thickness in a range from 40 nm to 100 nm, and may be planarized (e.g., by chemical mechanical polishing, CMP) to a second thickness in a range from 10 nm to 50 nm to form the first dielectric capping layer 987.

In one embodiment, a photoresist layer (not shown) can be applied over the first dielectric capping layer 987, and can be lithographically patterned to form openings 989A having a respective area that is less than area of a respective underlying first metallic bonding structure 981. The first dielectric capping layer 987 can be patterned to form openings 989A therein by transferring the pattern in the photoresist layer through the first dielectric capping layer 987. An isotropic etch process or an anisotropic etch process may be employed to etch the material of the first dielectric capping layer 987 selective to the material of the first metallic bonding structures 981. Each opening 989A in a first subset of the openings in the first dielectric capping layer 987 may have a periphery that is located entirely within, and is laterally offset inward from, the periphery of an underlying first metallic bonding structure 981. In one embodiment, a second subset of the openings 989B in the first dielectric capping layer 987 may be formed over the area of the first interconnect-level dielectric material layers 960. In this case, a top surface of the first interconnect-level dielectric material layers 960 may be physically exposed underneath the openings within the second subset of openings 989B in the first dielectric capping layer 987.

Referring to FIG. 32C, a second semiconductor die 700 for the sixth exemplary structure is illustrated according to an embodiment of the present disclosure. The second semiconductor die 700 for the sixth exemplary structure may derived from the second semiconductor die 700 illustrated in FIG. 8A by omitting formation of the second distal pad-level dielectric layer 784D and the second pad pillar portions 788. The second proximal pad-level dielectric layer 784P is herein referred to as a pad-level dielectric layer 785.

The second bonding pads 778 containing the second pad base portions 778B of the second semiconductor die 700 of the sixth exemplary structure constitutes second metallic bonding structures. Thus, the second bonding pads 778 can be metallic bonding pads comprising a metallic material that can form metal-to-metal bonds, such as copper-to-copper bonds, with the first metallic bonding structure 981 of the first semiconductor die 900, and are embedded within the pad-level dielectric layer 785. The second bonding pads 778 may comprise copper or a copper alloy. The thickness of the second bonding pads 778 may be in a range from 500 nm to 5,000 nm, although lesser and greater thicknesses may also be employed. In one embodiment, the lateral dimensions (such as the width and the length) of each of the second bonding pads 778 may be in a range from 500 nm to 20 microns, such as from 1 micron to 10 microns, although lesser and greater lateral dimensions may also be employed. The pattern of the second bonding pads 778 may be a mirror image pattern of the pattern of the first metallic bonding structures 981.

Generally, the second semiconductor die 700 comprises second semiconductor devices 720, second interconnect-level dielectric material layers 760 embedding second metal interconnect structures 780, and second metallic bonding structures comprising the second bonding pads 778. In one embodiment, the second bonding pads 778 comprise an array of metal bonding pads embedded in a pad-level dielectric layer 785 that overlies the second interconnect-level dielectric material layers 760.

Referring to FIG. 32D, the second semiconductor die 700 can be disposed on the first semiconductor die 900 such that the first metallic bonding structures 981 face the second bonding pads 778. In one embodiment, the pad-level dielectric layer 785 is disposed directly on the first dielectric capping layer 987 upon disposing the second semiconductor die 700 on the first semiconductor die 900. Encapsulated cavities 989 can be formed within volumes of the openings (989A, 989B) through the first dielectric capping layer 987. Each encapsulated cavity 989 can be bounded by a horizontal surface of a first metallic bonding structure 981, a second metallic bonding structure comprising a second bonding pad 778, and sidewalls of an opening through the first dielectric capping layer 987. Each encapsulated cavity 989 can have a height of 20 nm to 50 nm, for example.

Referring to FIG. 32E, an anneal process can be performed to induce metal-to-metal bonding between mating pairs of a first metallic bonding structure 981 and a second metallic bonding structure comprising the second bonding pad 778. The elevated temperature may be in a range from 250 degrees Celsius to 450 degrees Celsius, such as from 300 degrees Celsius to 350 degrees Celsius. The duration of the anneal process may be 3 minutes to 60 minutes, such as 5 minutes to 10 minutes. The material of the second bonding pads 778 (e.g., copper or copper alloy) and optionally the material of the first metallic bonding structures 981 (e.g., if the material comprises copper or copper alloy) expand to fill the volumes of the encapsulated cavities 989, and metal-to-metal bonding interfaces 800 between mating pairs of the first metallic bonding structures 981 and the second bonding pads 778 is formed within a thickness of the first dielectric capping layer 987. In other words, the bonding interfaces 800 may be formed between a first horizontal plane including an interface between the first dielectric capping layer 987 and the first interconnect-level dielectric material layers 960 and a second horizontal plane including an interface between the first dielectric capping layer 987 and the second interconnect-level dielectric material layers 760. Each of the second bonding pads 778 comprises second pad base portion 778B and at least one second pad pillar portion 778P that has a lesser area than the first pad base portion 778B, and is more distal from the second substrate 708 than the second pad base portion 778B is from the second substrate 708. The second pad pillar portion 778P has a thickness of 10 nm to 50 nm, while the base portion has a thickness of greater than 100 nm in a direction perpendicular to the bonding interface 800.

Referring to FIG. 32F, the first substrate 908 may be thinned from the backside by grinding, polishing, an anisotropic etch, or an isotropic etch. The thinning process can continue until horizontal portions of the through-substrate liners 386 are removed, and horizontal surfaces of the through-substrate via structures 388 are physically exposed. Generally, end surfaces of the through-substrate via structures 388 can be physically exposed by thinning the backside of the first substrate 908, which may be the substrate of a memory die. The thickness of the first substrate 908 after thinning may be in a range from 1 micron to 30 microns, such as from 2 microns to 15 microns, although lesser and greater thicknesses can also be employed.

The processing steps of FIG. 11C, FIG. 11D, or FIG. 11E may be subsequently performed to form a backside insulating layer 930, backside bonding pads 936 contacting a respective one of the through-substrate via structures 388, and solder material portions 938.

Referring to FIG. 32G, a first alternative embodiment of the sixth exemplary structure can be derived from the sixth exemplary structure by employing at least one first metallic bonding structure 981 that comprises a metal line that laterally extends by a lateral extension distance that is greater than the center-to-center distance of a neighboring pair of second metallic bonding structures (such as a neighboring pair of second bonding pads 788). In this case, two or more openings in the first dielectric capping layer 987 can be formed over a same first metallic bonding structure 981, which can be subsequently bonded to two or more second metallic bonding structures (such as two or more second bonding pads 788).

Referring to FIG. 32H, a second alternative embodiment of the sixth exemplary structure can be derived from the sixth exemplary structure by providing at least one first metallic bonding structure 981 that does not mate with a second metallic bonding structure. In some embodiments, use of such non-mating first metallic bonding structures 981 may provide a uniform pattern density for the first metallic bonding structures 981 and enhance thickness uniformity of the first metallic bonding structures 981. In this case, a second subset of the first metallic bonding structures 983 (comprising another subset of the first metal interconnect structures 980) comprises a respective vertically protruding portion 983P that protrudes through a respective opening in the first dielectric capping layer 987 and contacting a horizontal dielectric surface of the second semiconductor die 700, which may be a horizontal surface of the second dielectric material layers 760.

Referring to FIG. 33A, a first semiconductor die 900 for a seventh exemplary structure is illustrated according to an embodiment of the present disclosure. The first semiconductor die 900 for the sixth exemplary structure may be the same as the first semiconductor die 900 illustrated in FIG. 1B. In the seventh exemplary structure, the first proximal pad-level dielectric layer 984P is herein referred to as a pad-level dielectric layer 985.

The first bonding pads 978 containing the first pad base portions 978B of the first semiconductor die 900 of the seventh exemplary structure constitutes first metallic bonding structures. Thus, the first bonding pads 978 can be metallic bonding pads comprising a metallic material that can form metal-to-metal bonding, such as copper-to-copper bonding, and are embedded within the pad-level dielectric layer 985. The thickness of the first bonding pads 978 may be in a range from 500 nm to 5,000 nm, although lesser and greater thicknesses may also be employed. In one embodiment, the lateral dimensions (such as the width and the length) of each of the first bonding pads 978 may be in a range from 500 nm to 20 microns, such as from 1 micron to 10 microns, although lesser and greater lateral dimensions may also be employed.

Referring to FIG. 33B, a second semiconductor die 700 of the seventh exemplary structure is illustrated according to an embodiment of the present disclosure. The second semiconductor die 700 of the seventh exemplary structure can be derived from the second semiconductor die 700 of the first exemplary structure illustrated in FIG. 8A by omitting formation of the second interconnect-capping dielectric diffusion barrier layer 762, the second pad-connection-level dielectric layer 764, the optional second pad-level diffusion barrier layer 772, the second pad-connection via structures 768, the second proximal pad-level dielectric layer 784P, the second distal pad-level dielectric layer 784D, the second pad base portions 778, and the second pad pillar portions 788. Thus, the processing steps for forming the second semiconductor die 700 illustrated in FIG. 8A can be terminated after formation of the topmost second metal interconnect structures 780 and prior to formation of the first interconnect-capping dielectric diffusion barrier layer 962 for the purpose of forming the second semiconductor die 700 of the seventh exemplary structure.

Further, the pattern of the second metal interconnect structures 780 can be modified such that a subset of the second metal interconnect structures 780 formed at the topmost level of the second interconnect-level dielectric material layers 760 comprises second metallic bonding structures 781. In other words, a subset of the second metal interconnect structures 780 located at the topmost level of the second interconnect-level dielectric material layers 760 can have a pattern of the second metallic bonding structures 781 that can be directly bonded to a metal bonding pad in an opposing first die without an intervening bonding pad (778, 788) described above in the second semiconductor die 700. In one embodiment, an additional subset of the second metal interconnect structures 780 formed at the topmost level of the second interconnect-level dielectric material layers 760 may comprise second metal lines 78L having a respective uniform width along a respective widthwise direction and having top surfaces located within a same horizontal plane as the top surface of the second metallic bonding structures 781 and the topmost layer among the second interconnect-level dielectric material layers 760.

The dielectric material of the topmost layer of the second interconnect-level dielectric material layers 760 may comprise, and/or may consist essentially of, undoped silicate glass or a doped silicate glass. In one embodiment, the second metallic bonding structures 781 and the second metal lines 78L may be composed primarily of a metallic material (such as copper) that forms metal-to-metal bonds (such as copper-to-copper bonds). The thickness of the second metallic bonding structures 781 and the second metal lines 78L may be in a range from 500 nm to 5,000 nm, although lesser and greater thicknesses may also be employed. In one embodiment, the lateral dimensions (such as the width and the length) of each of the second metallic bonding structures 781 may be in a range from 500 nm to 20 microns, such as from 1 micron to 10 microns, although lesser and greater lateral dimensions may also be employed. Generally, the second semiconductor die 700 comprises second semiconductor devices 720, and second interconnect-level dielectric material layers 760 embedding second metal interconnect structures 780 and second metallic bonding structures 781.

Referring to FIG. 32B, a second dielectric capping layer 787 may be formed over the second interconnect-level dielectric material layers 760, the second metallic bonding structures 781, and the second metal lines 78L. The second capping dielectric layer 787 comprises a dielectric material that provides vertical spacing between the second metallic bonding structures 781 and a second semiconductor die to be subsequently bonded to the second semiconductor die 700. In one embodiment, the second dielectric capping layer 787 comprises a dielectric material selected from silicon carbide nitride, silicon nitride, silicon oxide, or a dielectric metal oxide. In one embodiment, the second dielectric cap layer 787 may comprise a diffusion-blocking dielectric material such as silicon carbide nitride or silicon nitride. The second dielectric capping layer 787 contacts distal horizontal surfaces of the second metallic bonding structures 781 and distal horizontal surfaces of a subset of the second metal interconnect structures 780.

In one embodiment, the second dielectric capping layer 787 may be formed by depositing a dielectric material and planarizing the dielectric material. For example, the second dielectric cap layer 787 may be formed by depositing a blanket (i.e., unpatterned) dielectric capping material layer having a second thickness, and by planarizing the blanket dielectric capping material layer so that the thickness of the blanket dielectric capping material layer is reduced to a second thickness. In an illustrative example, a silicon nitride layer or a silicon carbide nitride layer may be deposited to a second thickness in a range from 40 nm to 100 nm, and may be planarized (e.g., by CMP) to a second thickness in a range from 10 nm to 50 nm to form the second dielectric capping layer 787.

In one embodiment, a photoresist layer (not shown) can be applied over the second dielectric capping layer 787, and can be lithographically patterned to form openings 789A having a respective area that is less than area of a respective underlying second metallic bonding structure 781. The second dielectric capping layer 787 can be patterned to form openings 789A therein by transferring the pattern in the photoresist layer through the second dielectric capping layer 787. An isotropic etch process or an anisotropic etch process may be employed to etch the material of the second dielectric capping layer 787 selective to the material of the second metallic bonding structures 781. Each opening 789A in a first subset of the openings in the second dielectric capping layer 787 may have a periphery that is located entirely within, and is laterally offset inward from, the periphery of an underlying second metallic bonding structure 781. In one embodiment, a second subset of the openings 789B in the second dielectric capping layer 787 may be formed over the area of the second interconnect-level dielectric material layers 760. In this case, a top surface of the second interconnect-level dielectric material layers 760 may be physically exposed underneath the openings within the second subset of openings 789B in the second dielectric capping layer 787.

Referring to FIG. 33D, the second semiconductor die 700 can be disposed on the first semiconductor die 900 such that the first metallic bonding structures (as embodied as the first bonding pads 978) face the second metallic bonding structures 781. In one embodiment, the pad-level dielectric layer 985 is disposed directly on the second dielectric capping layer 787 upon disposing the second semiconductor die 700 on the first semiconductor die 900. Encapsulated cavities 789 can be formed within volumes of the openings (789A, 789B) through the second dielectric capping layer 787. Each encapsulated cavity 789 can be bounded by a horizontal surface of a first metallic bonding structure comprising the first bonding pad 978, and sidewalls of an opening through the second dielectric capping layer 787.

Referring to FIG. 33E, an anneal process can be performed to induce metal-to-metal bonding between mating pairs of a first metallic bonding structure 978 and a second metallic bonding structure 781 comprising one of the second metal interconnect structures 780. The elevated temperature may be in a range from 250 degrees Celsius to 440 degrees Celsius, such as from 300 degrees Celsius to 350 degrees Celsius. The duration of the anneal process may be 3 minutes to 60 minutes, such as 5 minutes to 10 minutes. The material of the first bonding pads 978 (e.g., copper or copper alloy) and optionally the material of the second metallic bonding structures 781 (e.g., if the material comprises copper or copper alloy) expand to fill the volumes of the encapsulated cavities 789, and metal-to-metal bonding interfaces 800 between mating pairs of the first metallic bonding structures 978 and the second metallic bonding structures 781 can be formed within a thickness of the second dielectric capping layer 787. In other words, the bonding interfaces 800 may be formed between a first horizontal plane including an interface between the second dielectric capping layer 787 and the first interconnect-level dielectric material layers 960 and a second horizontal plane including an interface between the second dielectric capping layer 787 and the second interconnect-level dielectric material layers 760.

Each of the first bonding pads 978 comprises first pad base portion 978B and at least one first pad pillar portion 978P that has a lesser area than the first pad base portion 978B, and is more distal from the first substrate 908 than the first pad base portion 978B is from the first substrate 908. The first pad pillar portion 978P has a thickness of 10 nm to 50 nm, while the base portion has a thickness of greater than 100 nm in a direction perpendicular to the bonding interface 800.

Referring to FIG. 33F, the first substrate 908 may be thinned from the backside by grinding, polishing, an anisotropic etch, or an isotropic etch. The thinning process can continue until horizontal portions of the through-substrate liners 386 are removed, and horizontal surfaces of the through-substrate via structures 388 are physically exposed. Generally, end surfaces of the through-substrate via structures 388 can be physically exposed by thinning the backside of the first substrate 908, which may be the substrate of a memory die. The thickness of the first substrate 908 after thinning may be in a range from 1 micron to 30 microns, such as from 2 microns to 15 microns, although lesser and greater thicknesses can also be employed.

The processing steps of FIG. 11C, FIG. 11D, or FIG. 11E may be subsequently performed to form a backside insulating layer 930, backside bonding pads 936 contacting a respective one of the through-substrate via structures 388, and solder material portions 938.

Referring to FIG. 33G, an alternative embodiment of the seventh exemplary structure can be derived from the seventh exemplary structure by employing at least one second metallic bonding structure 781 that comprises a metal line that laterally extends by a lateral extension distance that is greater than the center-to-center distance of a neighboring pair of first metallic bonding structures (such as a neighboring pair of first bonding pads 988). In this case, two or more openings in the second dielectric capping layer 887 can be formed over a same second metallic bonding structure 781, which can be subsequently bonded to two or more first metallic bonding structures (such as two or more first bonding pads 988).

Referring to FIG. 34A, a first semiconductor die 900 for an eighth exemplary structure is illustrated according to an embodiment of the present disclosure. The first semiconductor die 900 for the eighth exemplary structure may be the same as the first semiconductor die 900 for the sixth exemplary structure illustrated in FIG. 32B.

Referring to FIG. 34B, a second semiconductor die 700 for the eighth exemplary structure is illustrated according to an embodiment of the present disclosure. The second semiconductor die 700 for the eighth exemplary structure may be the same as the second semiconductor die 700 of FIG. 33C.

Referring to FIG. 34C, the second semiconductor die 700 can be disposed on the first semiconductor die 900 such that the first metallic bonding structures 981 face the second metallic bonding structures 781. In one embodiment, the second dielectric capping layer 787 is disposed directly on the first dielectric capping layer 987 upon disposing the second semiconductor die 700 on the first semiconductor die 900. Encapsulated cavities (789, 989) can be formed within volumes of the openings through the first dielectric capping layer 987 and the second dielectric capping layer 787. Each encapsulated cavity (789, 989) can be bounded by a horizontal surface of a first metallic bonding structure 981, a second metallic bonding structure 781, and sidewalls of an opening through the first dielectric capping layer 987 and sidewalls of an opening through the second dielectric capping layer 787. Thus, in the eighth embodiment, both first bonding pads 978 and the second bonding pads 778 are omitted.

Referring to FIG. 34D, an anneal process can be performed to induce metal-to-metal bonding between mating pairs of a first metallic bonding structure 981 and a second metallic bonding structure 781. The elevated temperature may be in a range from 250 degrees Celsius to 450 degrees Celsius, such as from 300 degrees Celsius to 350 degrees Celsius. The duration of the anneal process may be 3 minutes to 60 minutes, such as 5 minutes to 10 minutes. The metallic materials (e.g., copper or copper alloy) of the first metallic bonding structures 981 and the second metallic bonding structures 781 (expand to fill the volumes of the encapsulated cavities (989, 789), and metal-to-metal bonding interfaces 800 between mating pairs of the first metallic bonding structures 981 and the second metallic bonding structures 781 is formed within a thickness of the first and the second dielectric capping layers (987, 787). In other words, the bonding interfaces 800 may be formed between a first horizontal plane including an interface between the first dielectric capping layer 987 and the first interconnect-level dielectric material layers 960 and a second horizontal plane including an interface between the second dielectric capping layer 787 and the second interconnect-level dielectric material layers 760.

In one embodiment, each of a first subset of the first metallic bonding structures 981 comprises a respective vertically protruding portion 981P that protrudes through a respective opening in the first dielectric capping layer 987 and contacting a bonding surface of the respective one of the second metallic bonding structures 781. Additionally or alternatively, each of a first subset of the second metallic bonding structures 781 comprises a respective vertically protruding portion 781P that protrudes through a respective opening in second first dielectric capping layer 787 and contacting a bonding surface of the respective one of the first metallic bonding structures 981. Thus, in one embodiment, the first protruding portions 981P may contact the respective second protruding portions 781P to form the bonding interfaces 800.

In one embodiment, the bonding surfaces of the second metallic bonding structures 781 may be formed between a first horizontal plane including a proximal horizontal surface of the first dielectric capping layer 987 (that is in contact with the first interconnect-level dielectric material layers 960) and a second horizontal plane including a proximal horizontal surface of the second dielectric capping layer 787 (that is in contact with the second interconnect-level dielectric material layers 760).

Referring to FIG. 34E, the first substrate 908 may be thinned from the backside by grinding, polishing, an anisotropic etch, or an isotropic etch. The thinning process can continue until horizontal portions of the through-substrate liners 386 are removed, and horizontal surfaces of the through-substrate via structures 388 are physically exposed. Generally, end surfaces of the through-substrate via structures 388 can be physically exposed by thinning the backside of the first substrate 908, which may be the substrate of a memory die. The thickness of the first substrate 908 after thinning may be in a range from 1 micron to 30 microns, such as from 2 microns to 15 microns, although lesser and greater thicknesses can also be employed.

The processing steps of FIG. 11C, FIG. 11D, or FIG. 11E may be subsequently performed to form a backside insulating layer 930, backside bonding pads 936 contacting a respective one of the through-substrate via structures 388, and solder material portions 938.

Referring to FIG. 34F, a first alternative embodiment of the eighth exemplary structure can be derived from the eighth exemplary structure by employing at least one first metallic bonding structure 981 that comprises a metal line that laterally extends by a lateral extension distance that is greater than the center-to-center distance of a neighboring pair of second metallic bonding structures (such as a neighboring pair of second metallic bonding structures 781). In this case, two or more openings in the first dielectric capping layer 987 can be formed over a same first metallic bonding structure 981, which can be subsequently bonded to two or more second metallic bonding structures 781.

Referring to FIG. 34G, a second alternative embodiment of the eighth exemplary structure can be derived from the eighth exemplary structure by providing at least one first metallic bonding structure 981 that does not mate with a second metallic bonding structure. In some embodiments, use of such non-mating first metallic bonding structures 981 may provide a uniform pattern density for the first metallic bonding structures 981 and enhance thickness uniformity of the first metallic bonding structures 981. In this case, a second subset of the first metallic bonding structures 983 comprises a respective vertically protruding portion 983P that protrudes through a respective opening in the first dielectric capping layer 987 and contacting a horizontal dielectric surface of the second semiconductor die 700, which may be a horizontal surface of the second dielectric capping layer 787.

Referring to FIGS. 32A-34G and related figures and according to various embodiments of the present disclosure, a bonded assembly includes a first semiconductor die (900 or 700) that comprises first semiconductor devices (920 or 720), first interconnect-level dielectric material layers (960 or 760) embedding first metal interconnect structures (980 or 780) and first metallic bonding structures (981 or 781), and a first dielectric capping layer (987 or 787) contacting distal horizontal surfaces of the first metallic bonding structures and distal horizontal surfaces of a subset of the first metal interconnect structures, and a second semiconductor die (700 or 900) that comprises second semiconductor devices (720 or 920), second interconnect-level dielectric material layers (760 or 960) embedding second metal interconnect structures (780 or 980), and second metallic bonding structures (781, 778, 981 or 998). A first subset of the second metallic bonding structures comprises a respective vertically protruding portion (781P, 778P, 981P or 998P) that protrudes through a respective opening (989 or 789) in the first dielectric capping layer (987 or 787) and contacting a bonding surface of a respective one of the first metallic bonding structures (981 or 781).

In one embodiment, the first dielectric capping layer has a thickness in a range from 10 nm to 50 nm. In one embodiment, the first capping dielectric layer comprises, and/or consists essentially of, a material selected from silicon carbide nitride, silicon nitride, silicon oxide, and a dielectric metal oxide. In one embodiment, the subset of the first metal interconnect structures (980 or 780) comprises first metal lines having a respective uniform width along a respective widthwise direction.

In one embodiment, a first metallic bonding structure (981 or 781) within the first subset of the first metallic bonding structures (981 or 781) comprises two or more vertically protruding portions that protrudes through a respective opening in the first dielectric capping layer (987 or 787) and contacting bonding surfaces of two or more of the second metallic bonding structures.

In one embodiment, the second metallic bonding comprise an array of metal bonding pads (778 or 978) embedded in a pad-level dielectric layer (785 or 985) that is interposed between the first dielectric capping layer (987 or 787) and the second interconnect-level dielectric material layers (760 or 960).

In one embodiment, the bonding surfaces of the second metallic bonding structures (778 or 978) are located between a first horizontal plane including a proximal horizontal surface of the first dielectric capping layer (987 or 787) and a second horizontal plane including a distal horizontal surface of the first dielectric capping layer. In one embodiment, each of the second bonding structures (778 or 97P) comprises a horizontal surface segment that contacts the distal horizontal surface of the first dielectric capping layer (987 or 787) and a vertical sidewall segment of the vertically protruding portion (778P or 978P) that contact a sidewall of a respective opening in the first dielectric capping layer 987, for example, as illustrated in FIGS. 32F-32H or 33A-33G.

In one embodiment, a second subset of the first metallic bonding structures comprises a respective vertically protruding portion 983P that protrudes through a respective opening in the first dielectric capping layer 987 and contacting a horizontal dielectric surface of the second semiconductor die 700, for example, as illustrated in 32H and 34G.

In one embodiment, the second metallic bonding structures 780 comprise second metal lines having a respective uniform width along a respective widthwise direction. In one embodiment, the second semiconductor die 700 comprises a second dielectric capping layer 787 contacting distal horizontal surfaces of the second metallic bonding structures 781 and distal horizontal surfaces of the second metal interconnect structures 780, for example, as illustrated in FIGS. 34E-34G.

In one embodiment, the second metallic bonding structures 781 (comprise a respective vertically protruding portion 781P that protrudes through a respective opening in the second dielectric capping layer 787 and contacting a respective first metallic bonding structure 981 within the first subset of the first metallic bonding structures 981.

In one embodiment, the bonding surfaces of the first metallic bonding structures 981 is located between a first horizontal plane including a proximal horizontal surface of the first dielectric capping layer 987 and a second horizontal plane including a proximal horizontal surface of the second dielectric capping layer 787.

The structures and methods of the sixth, seventh, and eighth exemplary structures provide a bonded assembly of a first semiconductor die 900 and a second semiconductor die 700 with a reduced number of metal levels by incorporating metallic bonding structures in the metal wiring/interconnect levels. The volume expansion due to thermal expansion of the bonding structures forms the bond between the two die through cavities that are formed as openings through the dielectric capping layers.

Referring to FIG. 35, a memory die 900 for forming a ninth exemplary structure according to an embodiment of the present disclosure is illustrated. The memory die 900 illustrated in FIG. 35 can be derived from the memory die 900 illustrated in FIG. 1A by forming a first bonding-level dielectric layer 970 in lieu of a first pad-connection-level dielectric layer 964 and an optional first pad-level diffusion barrier layer 972, and by forming first metallic bonding structures 928 in lieu of first pad-connection via structures 968. In one embodiment, the first bonding-level dielectric layer 970 may comprise a layer stack including, from a side that is proximal to the first semiconductor devices 920 to a side that is distal from the first semiconductor devices 920, a first silicon oxide layer 971, a silicon nitride layer 972, and a second silicon oxide layer 973. In one embodiment, the second silicon oxide layer 973 may have a thickness that is greater than a sum of a thickness of the first silicon oxide layer 971 and a thickness of the silicon nitride layer 972. In an illustrative example, the first silicon oxide layer 971 may have a thickness in a range from 50 nm to 200 nm, such as 60 nm to 100 nm, the silicon nitride layer 972 may have a thickness in a range from 50 nm to 200 nm, such as 65 nm to 110 nm, and the second silicon oxide layer 973 may have a thickness in a range from 200 nm to 1,000 nm, such as from 250 nm to 400 nm, although lesser and greater thicknesses may also be employed.

According to an aspect of the present disclosure, the first metallic bonding structures 928 may be formed in any of the configurations illustrated in FIGS. 36A-36C, 37A-37C, or 38A-38C.

Referring to FIGS. 36A-36C, a first configuration of a first metallic bonding structure in the memory die 900 of FIG. 35 is illustrated. The first metallic bonding structure 928 may be provided by forming a stepped cavity in the first bonding-level dielectric layer 970, and by filling the stepped cavity with an optional metallic barrier liner described above and a metallic fill material, such as a copper. The stepped cavity comprises a pad cavity portion formed within a first vertical dimension vd1 from the topmost surface of the first bonding-level dielectric layer 970, and a via cavity portion formed underneath the pad cavity portion. The via cavity portion may vertically extend from the horizontal plane including the top surface of topmost first metal interconnect structures 980 to the horizontal plane including the bottom surface of the pad cavity portion. The vertical extent of the via cavity portion is herein referred to as a second vertical dimension vd2. According to an embodiment of the present disclosure, the second vertical dimension vd2 is less than the first vertical dimension vd1. In one embodiment, the horizontal plane including the bottom surface of the pad cavity portion may be located within the first silicon oxide layer 971.

The pad cavity portion may be formed, for example, by applying and patterning a first photoresist layer to form an array of openings therein, and by transferring the pattern of the openings in the first photoresist layer through the second silicon oxide layer 973 and through the silicon nitride layer 972 by performing a first anisotropic etch process. In one embodiment, the chemistry of the terminal etch step of the first anisotropic etch process may etch the silicon nitride material of the silicon nitride layer 972 selective to the silicon oxide material of the first silicon oxide layer 971. In this case, the bottom surface of the pad cavity portion can be formed in an upper portion of the first silicon oxide layer 971.

According to an aspect of the present disclosure, the etch chemistry of the first anisotropic etch process can be selected such that the tapered sidewalls are formed through the second silicon oxide layer 973 and the silicon nitride layer 972. In one embodiment, the tapered sidewalls of pad cavity portion may comprise a first subset of tapered sidewalls that are laterally spaced apart along a first horizontal direction hd1 and laterally extending along a second horizontal direction hd2 that is perpendicular to the first horizontal direction hd1, and may comprise a second subset of tapered sidewalls that are laterally spaced apart along the second horizontal direction hd2 and laterally extending along the first horizontal direction hd1. The first subset of tapered sidewalls are herein referred to as first tapered sidewalls 21. The second subset of tapered sidewalls are herein referred to third tapered sidewalls 23. The taper angle of the first tapered sidewalls 21 and the third tapered sidewalls 23 may be the same, and is herein referred to as a first taper angle α1 (i.e., the angle between a vertical line and the tapered sidewall 21 or 23). According to an aspect of the present disclosure, the chemistry of the first anisotropic etch process can be selected such that the value of the first taper angle α1 is in a range from 0.1 degree to 10 degrees, such as from 0.5 degrees to 5 degrees. The vertical extent of the first tapered sidewalls 21 and the third tapered sidewalls 23 is the first vertical dimension vd1. The first photoresist layer can be subsequently removed, for example, by ashing.

The via cavity portion may be formed, for example, by applying and patterning a second photoresist layer to form an array of openings therein. Each opening in the second photoresist layer may be formed entirely within the bottom periphery of sidewalls of a respective pad cavity portion. In one embodiment, the periphery of each opening in the second photoresist layer may be laterally offset inward from the bottom periphery of sidewalls of a respective pad cavity portion by a lateral offset distance. The pattern of the openings in the second photoresist layer may be transferred through the first silicon oxide layer 971 and through the first interconnect-capping dielectric diffusion barrier layer (e.g., silicon carbide nitride layer) 962 by performing a second anisotropic etch process. In one embodiment, the chemistry of the terminal step of the second anisotropic etch process that etches the interconnect-capping dielectric diffusion barrier layer 962 may be selective to the material of the topmost first metal interconnect structures 980. The bottom surface of the via cavity portion can be formed entirely within the area of a respective one of the topmost first metal interconnect structures 980.

According to an aspect of the present disclosure, the etch chemistry of the second anisotropic etch process can be selected such that the tapered sidewalls are formed through the first silicon oxide layer 971 and the interconnect-capping dielectric diffusion barrier layer 962. In one embodiment, the tapered sidewalls of via cavity portion may comprise a first subset of tapered sidewalls that are laterally spaced apart along the first horizontal direction hd1 and laterally extending along the second horizontal direction hd2, and may comprise a second subset of tapered sidewalls that are laterally spaced apart along the second horizontal direction hd2 and laterally extending along the first horizontal direction hd1. The first subset of tapered sidewalls are herein referred to as second tapered sidewalls 22. The second subset of tapered sidewalls are herein referred to fourth tapered sidewalls 24. The taper angle of the second tapered sidewalls 22 and the fourth tapered sidewalls 24 may be the same, and is herein referred to as a second taper angle α2 (i.e., the angle between a vertical line and the tapered sidewall 22 or 24) According to an aspect of the present disclosure, the chemistry of the second anisotropic etch process can be selected such that the value of the second taper angle α2 is in a range from 25 to 55 degrees, such as 26 to 52 degrees, for example 45 to 50 degrees. The complementary second taper angle α2C (i.e., the angle between a horizontal plane and the tapered sidewall 22 or 24) equals to 90−α2, and may be range from to 35 to 65 degrees, such as 38 to 64 degrees, for example from 40 to 45 degrees. Generally, an etch chemistry that generates a significant amount of polymer etch residue can be employed to increase the taper angle during the second anisotropic etch process. In one embodiment, the second anisotropic etch process may have an etch chemistry including fluorocarbon gases (such as CF₄, C₄F₈, or CF₂Br₂) as an etchant gas. The vertical extent of the second tapered sidewalls 22 and the fourth tapered sidewalls 24 is the second vertical dimension vd2. The second photoresist layer can be subsequently removed, for example, by ashing.

In an alternative embodiment, the order of the first and second anisotropic etching steps may be reversed. In the alternative embodiment, the second photoresist layer is formed first, followed by the second anisotropic etch process which forms the via cavity portion through the entire first bonding-level dielectric layer 970 and the interconnect-capping dielectric diffusion barrier layer 962. After removing the second photoresist layer, the first photoresist layer is formed, followed by the first anisotropic etch process which forms the pad cavity portion by expanding the upper portion of the via cavity portion in the first bonding-level dielectric layer 970.

An optional metallic barrier liner 928A can be subsequently deposited in the stepped cavity. The metallic barrier liner 928A includes a conductive metallic barrier material, such as Ti, Ta, TiN, TaN, WN, MoN, TiC, TaC, WC, or a combination thereof. The metallic barrier liner 928A may be deposited by physical vapor deposition and/or chemical vapor deposition. The thickness of the metallic barrier liner 928A can be in a range from 3 nm to 30 nm, although lesser and greater thicknesses may also be employed. Alternatively, the metallic barrier liner 928A may be omitted.

A metallic fill material, such as a copper, can be deposited in remaining volumes of the stepped cavity. For example, a copper seed layer may be deposited by physical vapor deposition, and an electroplated copper layer may be formed by performing an electroplating process. Excess portions of the metallic fill material and the metallic barrier liner 928A (if present) can be removed from above the horizontal plane including the top surface of the first bonding-level dielectric layer 970 by a planarization process such as a chemical mechanical polishing (CMP) process. Top surfaces of the remaining portions of the metallic barrier liner 928A and the metallic fill material 928B may be recessed below the horizontal plane including the top surface of the first bonding-level dielectric layer 970 due to overpolishing (e.g., dishing). The recess depth may be in a range from 2 nm to 20 nm, such as from 4 nm to 10 nm, although lesser and greater recess depths may also be employed. Each remaining portion of the metallic fill material is herein referred to as a metallic fill material portion 928B, which may be a copper portion in some embodiments. Each first metallic bonding structure 928 includes the metallic fill material portion 928B and optionally the metallic barrier liner 928A.

The first metallic bonding structure 928 includes a pad portion 928P located above the horizontal plane including the bottom edges of the first tapered sidewalls 21 and the third tapered sidewalls 23, and a via portion 928V located below the horizontal plane including the bottom edges of the first tapered sidewalls 21 and the third tapered sidewalls 23. The lateral dimension of the top periphery of the opening (i.e., the pad cavity portion) including the first metallic bonding structure 928 along the first horizontal direction hd1 is herein referred to as a first lateral dimension LD1, and the lateral dimension of the top periphery of the via portion 928V of the first metallic bonding structure 928 along the first horizontal direction hd1 is herein referred to as a second lateral direction LD2. The lateral dimension of the top periphery of the opening including the first metallic bonding structure 928 along the second horizontal direction hd2 is herein referred to as a third lateral dimension LD3, and the lateral dimension of the top periphery of the via portion of the first metallic bonding structure 928 along the second horizontal direction hd2 is herein referred to as a fourth lateral direction LD4.

In one embodiment, the top periphery of the opening including the first metallic bonding structure 928 may have a shape of a rectangle or a rounded rectangle. The first lateral dimension LD1 can be the distance between two sides of the top periphery of the opening that laterally extend along the second horizontal direction hd2, and the third lateral dimension LD3 can be the distance between two sides of the top periphery of the opening that laterally extend along the first horizontal direction hd1. The first tapered sidewalls 21 are adjoined to the third tapered sidewalls 23 directly (in case the top periphery has a rectangular shape) or indirectly through curved and tapered sidewall segments (in case the top periphery has a shape of a rounded rectangle).

In one embodiment, the top periphery of the via portion of the first metallic bonding structure 928 may have a shape of a rectangle or a rounded rectangle. The second lateral dimension LD2 can be the distance between two sides of the top periphery of the via portion of the first metallic bonding structure 928 that laterally extend along the second horizontal direction hd2, and the fourth lateral dimension LD4 can be the distance between two sides of the top periphery of the via portion of the first metallic bonding structure 928 that laterally extend along the first horizontal direction hd1. The second tapered sidewalls 22 are adjoined to the fourth tapered sidewalls 24 directly (in case the top periphery has a rectangular shape) or indirectly through curved and tapered sidewall segments (in case the top periphery has a shape of a rounded rectangle).

According to an aspect of the present disclosure, the ratio of the second lateral dimension LD2 to the first lateral dimension LD1 is at least 0.5, and may be in a range from 0.5 to 0.999, such as from 0.6 to 0.99 and/or from 0.67 to 0.90. According to an aspect of the present disclosure, the ratio of the fourth lateral dimension LD4 to the third lateral dimension LD3 is at least 0.5, and may be in a range from 0.5 to 0.95, such as from 0.6 to 0.9 and/or from 0.67 to 0.80. Each of the first lateral dimension LD1 and the third lateral dimension LD3 may be in a range from 100 nm to 1,000 nm, such as 400 nm to 600 nm, although lesser and greater lateral dimensions may also be employed. The ratio of the third lateral dimension LD3 to the first lateral dimension LD1 may be in a range from 0.5 to 2.0, such as from 0.8 to 1.25. In one embodiment, the ratio of the third lateral dimension LD3 to the first lateral dimension LD1 may be 1 or about 1 (i.e., to form the pad portion having a square horizontal cross sectional shape).

In the first configuration illustrated in FIGS. 36A-36C, the first taper angle cd, the first vertical dimension vd1, the difference between the first lateral dimension LD1 and the second lateral dimension LD2, and the difference between the third lateral dimension LD3 and the fourth lateral dimension LD4 are selected such that a horizontal frame-shaped surface connects the bottom periphery of the sidewalls of the pad portion of the first metallic bonding structure 928 to the top periphery of the sidewalls of the via portion of the first metallic bonding structures 928. As such, the horizontal frame-shaped surface connects bottom edges of the first tapered sidewalls 21 and the third tapered sidewalls 23 to the top edges of the second tapered sidewalls 22 and the fourth tapered sidewalls 24. In this case, the following relationships hold: (LD1−LD2)−2×vd1×tan α1>0; and (LD3−LD4)−2×vd1×tan α1>0.

Referring to FIGS. 36D and 36E, vertical cross-sectional profiles are illustrated for a hypothetical structure that would be obtained by annealing the first configuration of the first metallic bonding structure 928 at an elevated temperature that is sufficient to induce metal-to-metal bonding (such as 400 degrees Celsius). The vertical cross-sectional profile illustrated in FIG. 36D is along a vertical cut plane that corresponds to the vertical plane A-A′ in FIG. 36C. The vertical cross-sectional profile illustrated in FIG. 36E is along a vertical cut plane that corresponds to the vertical plane B-B′ of FIG. 36C. Generally, the vertical extent of the volume expansion of the first metallic bonding structure 928 is dependent on the thickness of the metallic fill material in the metallic fill material portion 928B. Thus, a segment of the top surface of the first metallic bonding structure 928 that has an areal overlap with the via portion of the first metallic bonding structure 928 protrudes upward more than a segment of the top surface of the first metallic bonding structure 928 that does not have an areal overlap with the via portion of the first metallic bonding structure 928.

In one embodiment, the top surface of the first metallic bonding structure 928 can have a double convex profile having a central convex segment having a greater curvature (and thus, having a smaller radius of curvature) and a frame-shaped peripheral convex segment having a lesser curvature (and thus, having a larger radius of curvature). The maximum protrusion height of the central convex segment is herein referred to as a first height h1. The maximum protrusion height of the frame-shaped peripheral convex segment within a vertical cross-sectional profile along the first horizontal direction hd1 is herein referred to as a second height h2. The maximum protrusion height of the frame-shaped peripheral convex segment within a vertical cross-sectional profile along the second horizontal direction hd2 is herein referred to as a third height h3.

Without wishing to be bound by a particular theory, it is believed that copper expansion during the bonding anneal can be expressed by the following equation: expansion=(CTE_(Cu)−CTE_(BDL)) (T_(b)−T_(r)) (h), where CTE_(Cu) is the coefficient of thermal extension of copper, CTE_(BDL) is the coefficient of thermal expansion of the first bonding-level dielectric layer 970, T_(b) is the bonding anneal temperature, T_(r) is room temperature and h is the height of copper. This formula shows that copper expansion depends on original copper height. Thus, the copper central convex segment overlying the via contact structure can expand higher than the copper frame-shaped peripheral convex segment which does not overly the via contact structure to form the double convex profile. Furthermore, by forming the via contact portion with tapered sidewalls, the area of the pad contact portion which overlies the via contact portion is increased, which increases the size of the copper central convex segment.

In one embodiment, the ratio of the first height h1 to the second height h2 may be in a range from 1.2 to 20, such as from 1.2 to 4, including from 1.5 to 3 or from 2 to 20, including from 4 to 10. The ratio of the first height h1 to the third height h3 may be in a range from 1.2 to 20, such as from 1.2 to 4, including from 1.5 to 3 or from 2 to 20, including from 4 to 10. The ratio of the second lateral direction LD2 to the first lateral dimension LD1 may be in a range from 0.5 to 0.999, such as from 0.6 to 0.99 and/or from 0.67 to 0.90. The ratio of the fourth lateral direction LD4 to the third lateral dimension LD3 may be in a range from 0.5 to 0.999, such as from 0.6 to 0.99 and/or from 0.67 to 0.90.

In the second configuration illustrated in FIGS. 37A-37C, the first taper angle μ1, the first vertical dimension vd1, the difference between the first lateral dimension LD1 and the second lateral dimension LD2, and the difference between the third lateral dimension LD3 and the fourth lateral dimension LD4 are selected such a top edge of each fourth tapered sidewall 24 is directly adjoined to a bottom edge of a respective one of the third tapered sidewalls 23, and two horizontal surfaces connect each bottom periphery of the first tapered sidewalls 21 to a top periphery of a respective one of the second tapered sidewalls 22. In this case, the following relationships hold: (LD1−LD2)−2× vd1× tan α1>0; and (LD3−LD4)=2×vd1×tan α1.

Referring to FIGS. 37D and 37E, vertical cross-sectional profiles are illustrated for a hypothetical structure that would be obtained by annealing the second configuration of the first metallic bonding structure 928 at an elevated temperature that is sufficient to induce metal-to-metal bonding (such as 400 degrees Celsius). The vertical cross-sectional profile illustrated in FIG. 37D is along a vertical cut plane that corresponds to the vertical plane A-A′ in FIG. 37C. The vertical cross-sectional profile illustrated in FIG. 37E is along a vertical cut plane that corresponds to the vertical plane B-B′ of FIG. 37C. Generally, the vertical extent of the volume expansion of the first metallic bonding structure 928 is dependent on the thickness of the metallic fill material in the metallic fill material portion 928B. Thus, a segment of the top surface of the first metallic bonding structure 928 that has an areal overlap with the via portion of the first metallic bonding structure 928 protrudes upward more than a segment of the top surface of the first metallic bonding structure 928 that does not have an areal overlap with the via portion of the first metallic bonding structure 928.

In one embodiment, the ratio of the second lateral direction LD2 to the first lateral dimension LD1 may be in a range from 0.5 to 0.999, such as from 0.6 to 0.99 and/or from 0.67 to 0.90. The ratio of the fourth lateral direction LD4 to the third lateral dimension LD3 may be in a range from 0.8 to 0.999, such as from 0.9 to 0.99.

In the third configuration illustrated in FIGS. 38A-38C, the first taper angle cd, the first vertical dimension vd1, the difference between the first lateral dimension LD1 and the second lateral dimension LD2, and the difference between the third lateral dimension LD3 and the fourth lateral dimension LD4 are selected such a top edge of each second tapered sidewall 22 is directly adjoined to a bottom edge of a respective one of the first tapered sidewalls 21, and a top edge of each fourth tapered sidewall 24 is directly adjoined to a bottom edge of a respective one of the third tapered sidewalls 23. In this case, the following relationships hold: (LD1−LD2)=2×vd1×tan α1; and (LD3−LD4)=2×vd1×tan α1. In one embodiment, top edges of the second tapered sidewalls 22 coincide with bottom edges of the first tapered sidewalls 21.

Referring to FIGS. 38D and 38E, vertical cross-sectional profiles are illustrated for a hypothetical structure that would be obtained by annealing the third configuration of the first metallic bonding structure 928 at an elevated temperature that is sufficient to induce metal-to-metal bonding (such as 400 degrees Celsius). The vertical cross-sectional profile illustrated in FIG. 38D is along a vertical cut plane that corresponds to the vertical plane A-A′ in FIG. 38C. The vertical cross-sectional profile illustrated in FIG. 38E is along a vertical cut plane that corresponds to the vertical plane B-B′ of FIG. 38C. Generally, the vertical extent of the volume expansion of the first metallic bonding structure 928 is dependent on the thickness of the metallic fill material in the metallic fill material portion 928B. Thus, a segment of the top surface of the first metallic bonding structure 928 that has an areal overlap with the via portion of the first metallic bonding structure 928 protrudes upward more than a segment of the top surface of the first metallic bonding structure 928 that does not have an areal overlap with the via portion of the first metallic bonding structure 928.

The ratio of the second lateral direction LD2 to the first lateral dimension LD1 may be in a range from 0.8 to 0.999, such as from 0.9 to 0.99. The ratio of the fourth lateral direction LD4 to the third lateral dimension LD3 may be in a range from 0.8 to 0.999, such as from 0.9 to 0.99.

Referring collectively to FIGS. 36A-36C, 37A-37C, and 38A-38C, each first metallic bonding structure 928 can have first tapered sidewalls 21 that are laterally spaced apart along a first horizontal direction hd1, laterally extending along a second horizontal direction hd2, and having a first taper angle α1 with respective to a vertical direction. Each first metallic bonding structure 928 can have second tapered sidewalls 22 that are laterally spaced apart along the first horizontal direction hd1, laterally extending along the second horizontal direction hd2, having top edges located within a horizontal plane including bottom edges of the first tapered sidewalls (21 or 81), and having a second taper angle α2 within respect to the vertical direction. The second taper angle α2 is greater than the first taper angle α1 at least by a factor of 3, and/or at least by a factor of 5, and is in a range from 25 degrees to 55 degrees.

In one embodiment, the first taper angle α1 is in a range from 0.1 degree to 10 degrees, such as from 0.5 degrees to 5 degrees; and the second taper angle α2 is in a range from 25 degrees to 55 degrees.

In one embodiment, the top edges of the second tapered sidewalls 22 of one, a plurality, or each, of the first metallic bonding structures 928 are connected to bottom edges of the first tapered sidewalls 21 by horizontally-extending surface segments of a respective one of the first metallic bonding structures 928, for example, as in the first configuration and the second configuration.

In one embodiment, one, a plurality, or each, of the first metallic bonding structures 928 comprises: third tapered sidewalls 23 that are laterally spaced apart along the second horizontal direction hd2, laterally extending along the first horizontal direction hd1, adjoined to non-horizontal edges of the first tapered sidewalls 21, and having the first taper angle α1 with respective to a vertical direction; and fourth tapered sidewalls 24 that are laterally spaced apart along the second horizontal direction hd2, laterally extending along the first horizontal direction hd1, having top edges that are adjoined to bottom edges of the third tapered sidewalls 23, and having the second taper angle α2 within respect to the vertical direction.

In one embodiment, one, plurality, or each, of the first metallic bonding structures 928 comprises a bottom surface having a periphery that is adjoined to bottom edges of the second tapered sidewalls 22 and adjoined to bottom edges of the fourth tapered sidewalls 24. In one embodiment, the bottom surface of one, plurality, or each, of the first metallic bonding structures 928 is in contact with a top surface of a respective one of the first metal interconnect structures 980.

In one embodiment, the memory die 900 comprises a first interconnect-capping dielectric diffusion barrier layer 962 located between the first interconnect-level dielectric material layers 960 and the first bonding-level dielectric layer 970; the second tapered sidewalls 22 are in contact with the first interconnect-capping dielectric diffusion barrier layer 962; and the second tapered sidewalls 22 are vertically offset from the first interconnect-capping dielectric diffusion barrier layer 962.

In one embodiment, one, a plurality, or each, of the first metallic bonding structures 928 comprises: a first metallic barrier liner 928A comprising a conductive metallic nitride material, wherein a predominant fraction of the first tapered sidewalls 21 and an entirety of the second tapered sidewalls 22 are surfaces of the first metallic barrier liner 928A; and a first metal fill material portion 928B that is laterally surrounded by the first metallic barrier liner 928A.

In one embodiment, each of the first tapered sidewalls 21 has a first vertical distance vd1 between a respective top edge and a respective bottom edge; each of the second tapered sidewalls 22 has a second vertical distance vd2 between a respective top edge and a respective bottom edge; and a ratio of the first vertical distance vd1 to the second vertical distance vd2 is in a range from 1.25 to 4.

In one embodiment, the horizontal plane including the bottom edges of the first tapered sidewalls 21 is located between a top surface of the second silicon oxide layer 973 and a bottom surface of the second silicon oxide layer 973.

Referring to FIG. 39 a logic die 700 for forming the ninth exemplary structure according to an embodiment of the present disclosure is illustrated. The logic die 700 illustrated in FIG. 39 can be derived from the logic die 700 illustrated in FIG. 8A by forming a second bonding-level dielectric layer 770 in lieu of a second pad-connection-level dielectric layer 764 and an optional second pad-level diffusion barrier layer 772, and by forming second metallic bonding structures 728 in lieu of second pad-connection via structures 768. The second pad-connection via structure 768, the second pad-level diffusion barrier layer 772, the second pad-level dielectric layer 784, and the second bonding pads (778, 788) are omitted in the logic die 700 illustrated in FIG. 39.

In one embodiment, the second bonding-level dielectric layer 770 may comprise a layer stack including, from a side that is proximal to the first semiconductor devices 720 to a side that is distal from the first semiconductor devices 720, a first silicon oxide layer 771, a silicon nitride layer 772, and a second silicon oxide layer 773. In one embodiment, the second silicon oxide layer 773 may have a thickness that is greater than a sum of a thickness of the first silicon oxide layer 771 and a thickness of the silicon nitride layer 772. In an illustrative example, the first silicon oxide layer 771 may have a thickness in a range from 50 nm to 200 nm, such as 60 nm to 100 nm, the silicon nitride layer 772 may have a thickness in a range from 50 nm to 200 nm, such as 65 nm to 110 nm, and the second silicon oxide layer 773 may have a thickness in a range from 200 nm to 1,000 nm, such as from 250 nm to 400 nm, although lesser and greater thicknesses may also be employed.

According to an aspect of the present disclosure, the second metallic bonding structures 728 may be formed in any of the configurations illustrated in FIGS. 40A-40C, 41A-41C, or 42A-42C.

Referring to FIGS. 40A-40C, a first configuration of a second metallic bonding structure in the logic die 700 of FIG. 39 is illustrated. The second metallic bonding structure 728 may be provided by forming a stepped cavity in the second bonding-level dielectric layer 770, and by filling the stepped cavity with an optional metallic barrier liner described above and a metallic fill material such as a copper. The stepped cavity comprises a pad cavity portion formed within a first vertical dimension vd1′ from the topmost surface of the second bonding-level dielectric layer 770, and a via cavity portion formed underneath the pad cavity portion. The via cavity portion may vertically extend from the horizontal plane including the top surface of topmost second metal interconnect structures 780 to the horizontal plane including the bottom surface of the pad cavity portion. The vertical extent of the via cavity portion is herein referred to as a second vertical dimension vd2′. According to an embodiment of the present disclosure, the second vertical dimension vd2′ is less than the first vertical dimension vd1′. In one embodiment, the horizontal plane including the bottom surface of the pad cavity portion may be located within the first silicon oxide layer 771.

The pad cavity portion may be formed, for example, by applying and patterning a first photoresist layer to form an array of openings therein, and by transferring the pattern of the openings in the first photoresist layer through the second silicon oxide layer 773 and through the silicon nitride layer 772 by performing a first anisotropic etch process. In one embodiment, the chemistry of the terminal etch step of the first anisotropic etch process may etch the silicon nitride material of the silicon nitride layer 772 selective to the silicon oxide material of the first silicon oxide layer 771. In this case, the bottom surface of the pad cavity portion can be formed in an upper portion of the first silicon oxide layer 771.

According to an aspect of the present disclosure, the etch chemistry of the first anisotropic etch process can be selected such that the tapered sidewalls are formed through the second silicon oxide layer 773 and the silicon nitride layer 772. In one embodiment, the tapered sidewalls of pad cavity portion may comprise a first subset of tapered sidewalls that are laterally spaced apart along a first horizontal direction hd1 and laterally extending along a second horizontal direction hd2 that is perpendicular to the first horizontal direction hd1, and may comprise a second subset of tapered sidewalls that are laterally spaced apart along the second horizontal direction hd2 and laterally extending along the first horizontal direction hd1. The first subset of tapered sidewalls are herein referred to as first tapered sidewalls 81. The second subset of tapered sidewalls are herein referred to third tapered sidewalls 83. The taper angle of the first tapered sidewalls 81 and the third tapered sidewalls 83 may be the same, and is herein referred to as a first taper angle β1 (i.e., the angle between a vertical line and the tapered sidewall 81 or 83). According to an aspect of the present disclosure, the chemistry of the first anisotropic etch process can be selected such that the value of the first taper angle β1 is in a range from 0.1 degree to 10 degrees, such as from 0.5 degrees to 5 degrees. The vertical extent of the first tapered sidewalls 81 and the third tapered sidewalls 83 is the first vertical dimension vd1′. The first photoresist layer can be subsequently removed, for example, by ashing. Generally, the value of the first taper angle β1 in the logic die 700 may be the same as, or may be different from, the value of the first taper angle α1 in the memory die 900.

The via cavity portion may be formed, for example, by applying and patterning a second photoresist layer to form an array of openings therein. Each opening in the second photoresist layer may be formed entirely within the bottom periphery of sidewalls of a respective pad cavity portion. In one embodiment, the periphery of each opening in the second photoresist layer may be laterally offset inward from the bottom periphery of sidewalls of a respective pad cavity portion by a lateral offset distance. The pattern of the openings in the second photoresist layer may be transferred through the first silicon oxide layer 771 and through the second interconnect-capping dielectric diffusion barrier layer 762 by performing a second anisotropic etch process. In one embodiment, the chemistry of the terminal step of the second anisotropic etch process that etches the interconnect-capping dielectric diffusion barrier layer 762 may be selective to the material of the topmost second metal interconnect structures 780. The bottom surface of the via cavity portion can be formed entirely within the area of a respective one of the topmost second metal interconnect structures 780.

According to an aspect of the present disclosure, the etch chemistry of the second anisotropic etch process can be selected such that the tapered sidewalls are formed through the first silicon oxide layer 771 and the interconnect-capping dielectric diffusion barrier layer 762. In one embodiment, the tapered sidewalls of via cavity portion may comprise a first subset of tapered sidewalls that are laterally spaced apart along the first horizontal direction hd1 and laterally extending along the second horizontal direction hd2, and may comprise a second subset of tapered sidewalls that are laterally spaced apart along the second horizontal direction hd2 and laterally extending along the first horizontal direction hd1. The first subset of tapered sidewalls are herein referred to as second tapered sidewalls 82. The second subset of tapered sidewalls are herein referred to fourth tapered sidewalls 84. The taper angle of the second tapered sidewalls 82 and the fourth tapered sidewalls 84 may be the same, and is herein referred to as a second taper angle β2 (i.e., the angle between a vertical line and the tapered sidewall 82 or 84) According to an aspect of the present disclosure, the chemistry of the second anisotropic etch process can be selected such that the value of the first taper angle β1 is in a range from 25 degree to 55 degrees, such as 26 to 52 degrees, for example 45 to 50 degrees. The complementary second taper angle β2C (i.e., the angle between a horizontal plane and the tapered sidewall 82 or 84) equals to 90−β2, and may be range from to 35 to 65 degrees, such as 38 to 64 degrees, for example from 40 to 45 degrees. Generally, an etch chemistry that generates a significant amount of polymer etch residue can be employed to increase the taper angle during the second anisotropic etch process. In one embodiment, the second anisotropic etch process may have an etch chemistry including fluorocarbon gases (such as CF₄, C₄F₈, or CF₂Br₂) as an etchant gas. The vertical extent of the second tapered sidewalls 82 and the fourth tapered sidewalls 84 is the second vertical dimension vd2′. The second photoresist layer can be subsequently removed, for example, by ashing. Generally, the value of the second taper angle β2 in the logic die 700 may be the same as, or may be different from, the value of the second taper angle α2 in the memory die 900.

In an alternative embodiment, the order of the first and second anisotropic etching steps may be reversed. In the alternative embodiment, the second photoresist layer is formed first, followed by the second anisotropic etch process which forms the via cavity portion through the entire first bonding-level dielectric layer 770 and the interconnect-capping dielectric diffusion barrier layer 762. After removing the second photoresist layer, the first photoresist layer is formed, followed by the first anisotropic etch process which forms the pad cavity portion by expanding the upper portion of the via cavity portion in the first bonding-level dielectric layer 770.

An optional metallic barrier liner 728A can be subsequently deposited in the stepped cavity. The metallic barrier liner 728A includes a conductive metallic barrier material such as Ti, Ta, TiN, TaN, WN, MoN, TiC, TaC, WC, or a combination thereof. The metallic barrier liner 728A may be deposited by physical vapor deposition and/or chemical vapor deposition. The thickness of the metallic barrier liner 728A can be in a range from 3 nm to 30 nm, although lesser and greater thicknesses may also be employed. Alternatively, the metallic barrier liner 728A may be omitted.

A metallic fill material such as a copper can be deposited in remaining volumes of the stepped cavity. For example, a copper seed layer may be deposited by physical vapor deposition, and an electroplated copper layer may be formed by performing an electroplating process. Excess portions of the metallic fill material and the metallic barrier liner 728A can be removed from above the horizontal plane including the top surface of the second bonding-level dielectric layer 770 by a planarization process such as a chemical mechanical polishing (CMP) process. Top surfaces of the remaining portions of the metallic barrier liner 728A and the metallic fill material 728B may be recessed below the horizontal plane including the top surface of the second bonding-level dielectric layer 770 due to overpolishing (e.g., dishing). The recess depth may be in a range from 2 nm to 20 nm, such as from 4 nm to 10 nm, although lesser and greater recess depths may also be employed. Each remaining portion of the metallic fill material is herein referred to as a metallic fill material portion 728B, which may be a copper portion in some embodiments. Each second metallic bonding structure 728 includes the metallic fill material portion 728B and optionally the metallic barrier liner 728A.

The second metallic bonding structure 728 includes a pad portion 728P located above the horizontal plane including the bottom edges of the first tapered sidewalls 81 and the third tapered sidewalls 83, and a via portion 728V located below the horizontal plane including the bottom edges of the first tapered sidewalls 81 and the third tapered sidewalls 83. The lateral dimension of the top periphery of the opening including the second metallic bonding structure 728 along the first horizontal direction hd1 is herein referred to as a first lateral dimension LD1, and the lateral dimension of the top periphery of the via portion of the second metallic bonding structure 728 along the first horizontal direction hd1 is herein referred to as a second lateral direction LD2. The lateral dimension of the top periphery of the opening (i.e., pad cavity portion) including the second metallic bonding structure 728 along the second horizontal direction hd2 is herein referred to as a third lateral dimension LD3, and the lateral dimension of the top periphery of the via portion of the second metallic bonding structure 728 along the second horizontal direction hd2 is herein referred to as a fourth lateral direction LD4.

Generally, the lateral dimensions LD1, LD2, LD3 and LD4 of the logic die 700 may be the same as the respective lateral dimensions LD1, LD2, LD3 and LD4 of the memory die 900.

In one embodiment, the top periphery of the opening including the second metallic bonding structure 728 may have a shape of a rectangle or a rounded rectangle. The first lateral dimension LD1 can be the distance between two sides of the top periphery of the opening that laterally extend along the second horizontal direction hd2, and the third lateral dimension LD3 can be the distance between two sides of the top periphery of the opening that laterally extend along the first horizontal direction hd1. The first tapered sidewalls 81 are adjoined to the third tapered sidewalls 83 directly (in case the top periphery has a rectangular shape) or indirectly through curved and tapered sidewall segments (in case the top periphery has a shape of a rounded rectangle).

In one embodiment, the top periphery of the via portion 728V of the second metallic bonding structure 728 may have a shape of a rectangle or a rounded rectangle. The second lateral dimension LD2 can be the distance between two sides of the top periphery of the via portion of the second metallic bonding structure 728 that laterally extend along the second horizontal direction hd2, and the fourth lateral dimension LD4 can be the distance between two sides of the top periphery of the via portion of the second metallic bonding structure 728 that laterally extend along the first horizontal direction hd1. The second tapered sidewalls 82 are adjoined to the fourth tapered sidewalls 84 directly (in case the top periphery has a rectangular shape) or indirectly through curved and tapered sidewall segments (in case the top periphery has a shape of a rounded rectangle).

According to an aspect of the present disclosure, the ratio of the second lateral dimension LD2 to the first lateral dimension LD1 is at least 0.5, and may be in a range from 0.5 to 0.999, such as from 0.6 to 0.99 and/or from 0.67 to 0.90. According to an aspect of the present disclosure, the ratio of the fourth lateral dimension LD4 to the third lateral dimension LD3 is at least 0.5, and may be in a range from 0.5 to 0.95, such as from 0.6 to 0.9 and/or from 0.67 to 0.80. Each of the first lateral dimension LD1 and the third lateral dimension LD3 may be in a range from 100 nm to 1,000 nm, such as 400 nm to 600 nm, although lesser and greater lateral dimensions may also be employed. The ratio of the third lateral dimension LD3 to the first lateral dimension LD1 may be in a range from 0.5 to 2.0, such as from 0.8 to 1.25. In one embodiment, the ratio of the third lateral dimension LD3 to the first lateral dimension LD1 may be 1 or about 1.

In the first configuration illustrated in FIGS. 40A-40C, the first taper angle β1, the first vertical dimension vd1′, the difference between the first lateral dimension LD1 and the second lateral dimension LD2, and the difference between the third lateral dimension LD3 and the fourth lateral dimension LD4 are selected such that a horizontal frame-shaped surface connects the bottom periphery of the sidewalls of the pad portion of the second metallic bonding structure 728 to the top periphery of the sidewalls of the via portion of the second metallic bonding structures 728. As such, the horizontal frame-shaped surface connects bottom edges of the first tapered sidewalls 81 and the third tapered sidewalls 83 to the top edges of the second tapered sidewalls 82 and the fourth tapered sidewalls 84. In this case, the following relationships hold: (LD1−LD2)−2× vd1′×tan β1>0; and (LD3−LD4)−2× vd1′× tan β1>0.

Referring to FIGS. 40D and 40E, vertical cross-sectional profiles are illustrated for a hypothetical structure that would be obtained by annealing the first configuration of the second metallic bonding structure 728 at an elevated temperature that is sufficient to induce metal-to-metal bonding (such as 400 degrees Celsius). The vertical cross-sectional profile illustrated in FIG. 40D is along a vertical cut plane that corresponds to the vertical plane A-A′ in FIG. 40C. The vertical cross-sectional profile illustrated in FIG. 40E is along a vertical cut plane that corresponds to the vertical plane B-B′ of FIG. 40C. Generally, the vertical extent of the volume expansion of the second metallic bonding structure 728 is dependent on the thickness of the metallic fill material in the metallic fill material portion 728B. Thus, a segment of the top surface of the second metallic bonding structure 728 that has an areal overlap with the via portion of the second metallic bonding structure 728 protrudes upward more than a segment of the top surface of the second metallic bonding structure 728 that does not have an areal overlap with the via portion of the second metallic bonding structure 728.

In one embodiment, the top surface of the second metallic bonding structure 728 can have a double convex profile having a central convex segment having a greater curvature (and thus, having a smaller radius of curvature) and a frame-shaped peripheral convex segment having a lesser curvature (and thus, having a larger radius of curvature). The maximum protrusion height of the central convex segment is herein referred to as a first height h1. The maximum protrusion height of the frame-shaped peripheral convex segment within a vertical cross-sectional profile along the first horizontal direction hd1 is herein referred to as a second height h2. The maximum protrusion height of the frame-shaped peripheral convex segment within a vertical cross-sectional profile along the second horizontal direction hd2 is herein referred to as a third height h3.

In one embodiment, the ratio of the first height h1 to the second height h2 may be in a range from 1.2 to 20, such as from 1.2 to 4, including from 1.5 to 3 or from 2 to 20, including from 4 to 10. The ratio of the first height h1 to the third height h3 may be in a range from 1.2 to 20, such as from 1.2 to 4, including from 1.5 to 3 or from 2 to 20, including from 4 to 10. The ratio of the second lateral direction LD2 to the first lateral dimension LD1 may be in a range from 0.5 to 0.999, such as from 0.6 to 0.99 and/or from 0.67 to 0.90. The ratio of the fourth lateral direction LD4 to the third lateral dimension LD3 may be in a range from 0.5 to 0.999, such as from 0.6 to 0.99 and/or from 0.67 to 0.90.

In the second configuration illustrated in FIGS. 41A-41C, the first taper angle β1, the first vertical dimension vd1′, the difference between the first lateral dimension LD1 and the second lateral dimension LD2, and the difference between the third lateral dimension LD3 and the fourth lateral dimension LD4 are selected such a top edge of each fourth tapered sidewall 84 is directly adjoined to a bottom edge of a respective one of the third tapered sidewalls 83, and two horizontal surfaces connect each bottom periphery of the first tapered sidewalls 81 to a top periphery of a respective one of the second tapered sidewalls 82. In this case, the following relationships hold: (LD1−LD2)−2× vd1′×tan β1>0; and (LD3−LD4)=2×vd1′×tan β1.

Referring to FIGS. 41D and 41E, vertical cross-sectional profiles are illustrated for a hypothetical structure that would be obtained by annealing the second configuration of the second metallic bonding structure 728 at an elevated temperature that is sufficient to induce metal-to-metal bonding (such as 400 degrees Celsius). The vertical cross-sectional profile illustrated in FIG. 41D is along a vertical cut plane that corresponds to the vertical plane A-A′ in FIG. 41C. The vertical cross-sectional profile illustrated in FIG. 41E is along a vertical cut plane that corresponds to the vertical plane B-B′ of FIG. 41C. Generally, the vertical extent of the volume expansion of the second metallic bonding structure 728 is dependent on the thickness of the metallic fill material in the metallic fill material portion 728B. Thus, a segment of the top surface of the second metallic bonding structure 728 that has an areal overlap with the via portion of the second metallic bonding structure 728 protrudes upward more than a segment of the top surface of the second metallic bonding structure 728 that does not have an areal overlap with the via portion of the second metallic bonding structure 728.

The ratio of the second lateral direction LD2 to the first lateral dimension LD1 may be in a range from 0.5 to 0.999, such as from 0.6 to 0.99 and/or from 0.67 to 0.90. The ratio of the fourth lateral direction LD4 to the third lateral dimension LD3 may be in a range from 0.8 to 0.999, such as from 0.9 to 0.99.

In the third configuration illustrated in FIGS. 42A-42C, the first taper angle β1, the first vertical dimension vd1′, the difference between the first lateral dimension LD1 and the second lateral dimension LD2, and the difference between the third lateral dimension LD3 and the fourth lateral dimension LD4 are selected such a top edge of each second tapered sidewall 82 is directly adjoined to a bottom edge of a respective one of the first tapered sidewalls 81, and a top edge of each fourth tapered sidewall 84 is directly adjoined to a bottom edge of a respective one of the third tapered sidewalls 83. In this case, the following relationships hold: (LD1−LD2)=2×vd1′×tan β1; and (LD3−LD4)=2×vd1′×tan β1. In one embodiment, top edges of the second tapered sidewalls 82 coincide with bottom edges of the first tapered sidewalls 81.

Referring to FIGS. 42D and 42E, vertical cross-sectional profiles are illustrated for a hypothetical structure that would be obtained by annealing the third configuration of the second metallic bonding structure 728 at an elevated temperature that is sufficient to induce metal-to-metal bonding (such as 400 degrees Celsius). The vertical cross-sectional profile illustrated in FIG. 42D is along a vertical cut plane that corresponds to the vertical plane A-A′ in FIG. 42C. The vertical cross-sectional profile illustrated in FIG. 42E is along a vertical cut plane that corresponds to the vertical plane B-B′ of FIG. 42C. Generally, the vertical extent of the volume expansion of the second metallic bonding structure 728 is dependent on the thickness of the metallic fill material in the metallic fill material portion 728B. Thus, a segment of the top surface of the second metallic bonding structure 728 that has an areal overlap with the via portion of the second metallic bonding structure 728 protrudes upward more than a segment of the top surface of the second metallic bonding structure 728 that does not have an areal overlap with the via portion of the second metallic bonding structure 728.

The ratio of the second lateral direction LD2 to the first lateral dimension LD1 may be in a range from 0.8 to 0.999, such as from 0.9 to 0.99. The ratio of the fourth lateral direction LD4 to the third lateral dimension LD3 may be in a range from 0.8 to 0.999, such as from 0.9 to 0.99.

Referring collectively to FIGS. 36A-36C, 37A-37C, and 38A-38C, each second metallic bonding structure 728 can have first tapered sidewalls 81 that are laterally spaced apart along a first horizontal direction hd1, laterally extending along a second horizontal direction hd2, and having a first taper angle β1 with respective to a vertical direction. Each second metallic bonding structure 728 can have second tapered sidewalls 82 that are laterally spaced apart along the first horizontal direction hd1, laterally extending along the second horizontal direction hd2, having top edges located within a horizontal plane including bottom edges of the first tapered sidewalls (21 or 81), and having a second taper angle β2 within respect to the vertical direction. The second taper angle β2 is greater than the first taper angle β1 at least by a factor of 3, and/or at least by a factor of 5, and is in a range from 25 degrees to 55 degrees.

In one embodiment, the first taper angle β1 is in a range from 0.1 degree to 10 degrees, such as from 0.5 degrees to 5 degrees; and the second taper angle β2 is in a range from 25 degrees to 55 degrees.

In one embodiment, the top edges of the second tapered sidewalls 82 of one, a plurality, or each, of the second metallic bonding structures 728 are connected to bottom edges of the first tapered sidewalls 81 by horizontally-extending surface segments of a respective one of the second metallic bonding structures 728, for example, as in the first configuration and the second configuration.

In one embodiment, one, a plurality, or each, of the second metallic bonding structures 728 comprises: third tapered sidewalls 83 that are laterally spaced apart along the second horizontal direction hd2, laterally extending along the first horizontal direction hd1, adjoined to non-horizontal edges of the first tapered sidewalls 81, and having the first taper angle β1 with respective to a vertical direction; and fourth tapered sidewalls 84 that are laterally spaced apart along the second horizontal direction hd2, laterally extending along the first horizontal direction hd1, having top edges that are adjoined to bottom edges of the third tapered sidewalls 83, and having the second taper angle β2 within respect to the vertical direction.

In one embodiment, one, plurality, or each, of the second metallic bonding structures 728 comprises a bottom surface having a periphery that is adjoined to bottom edges of the second tapered sidewalls 82 and adjoined to bottom edges of the fourth tapered sidewalls 84. In one embodiment, the bottom surface of one, plurality, or each, of the second metallic bonding structures 728 is in contact with a top surface of a respective one of the second metal interconnect structures 780.

In one embodiment, the logic die 700 comprises a second interconnect-capping dielectric diffusion barrier layer 762 located between the first interconnect-level dielectric material layers 760 and the second bonding-level dielectric layer 770; the second tapered sidewalls 82 are in contact with the second interconnect-capping dielectric diffusion barrier layer 762; and the second tapered sidewalls 82 are vertically offset from the second interconnect-capping dielectric diffusion barrier layer 762.

In one embodiment, one, a plurality, or each, of the second metallic bonding structures 728 comprises: a second metallic barrier liner 728A comprising a conductive metallic nitride material, wherein a predominant fraction of the first tapered sidewalls 81 and an entirety of the second tapered sidewalls 82 are surfaces of the second metallic barrier liner 728A; and a second metal fill material portion 728B that is laterally surrounded by the second metallic barrier liner 728A.

In one embodiment, each of the first tapered sidewalls 81 has a first vertical distance vd1′ between a respective top edge and a respective bottom edge; each of the second tapered sidewalls 82 has a second vertical distance vd2′ between a respective top edge and a respective bottom edge; and a ratio of the first vertical distance vd1′ to the second vertical distance vd2′ is in a range from 1.25 to 4.

In one embodiment, the horizontal plane including the bottom edges of the first tapered sidewalls 81 is located between a top surface of the first silicon oxide layer 771 and a bottom surface of the first silicon oxide layer 771.

Referring to FIG. 43, a ninth exemplary structure can be provided by aligning a first wafer including a plurality of the memory dies 900 and a second wafer including a plurality of logic dies 700 for bonding. Generally, the pattern of the bonding surfaces of the first metallic bonding structures 928 in each memory die 900 can be a mirror image pattern of the bonding surfaces of the second metallic bonding structures 728 of each logic die 700.

Generally, a first semiconductor die (900 or 700) and a second semiconductor die (700 or 900) can be aligned to each other for metal-to-metal bonding. In one embodiment, the first semiconductor die (900 or 700) comprises first semiconductor devices (920 or 720), first interconnect-level dielectric material layers (960 or 760) embedding first metal interconnect structures (980 or 780) and first metallic bonding structures (928 or 728), and first metallic bonding structures (928 or 728) embedded within a first bonding-level dielectric layer (970 or 770). The second semiconductor die (700 or 900) comprises second semiconductor devices (720 or 920), second interconnect-level dielectric material layers (760 or 960) embedding second metal interconnect structures (780 or 980), and second metallic bonding structures (728 or 928) embedded within a second bonding-level dielectric layer (770 or 970).

Referring to FIG. 44, each mating pair of a memory die 900 and a logic die 700 can be bonded to each other by metal-to-metal bonding, such as copper-to-copper bonding. FIG. 44 illustrates a case in which the overlay error for bonding between the memory die 900 and the logic die 700 is zero. Optionally, oxide-to-oxide bonding can be induced between the second silicon oxide layer 973 within the first bonding-level dielectric layer 970 in the memory die 900 and the second silicon oxide layer 773 within the second bonding-level dielectric layer 770 in the logic die 700 at a first elevated temperature in a range from 150 degrees Celsius to 300 degrees Celsius. Subsequently, metal-to-metal bonding (such as copper-to-copper bonding) can be induced between each mating pair of a first metallic bonding structure 928 in the memory die 900 and a second metallic bonding structure 728 in the logic die 700 at a second elevated temperature in a range from 250 degrees Celsius to 400 degrees Celsius. Each of the first metallic bonding structures 928 and the second metallic bonding structures 728 is subjected to a volume expansion.

As discussed with reference to FIGS. 36D, 36E, 37D, 37E, 38D, 38E, 40D, 40E, 41D, 41E, 42D, and 42E, the height change in the top surfaces of the first metallic bonding structures 928 and the second metallic bonding structures 728 is greater at portions having an areal overlap with a respective via portion within a respective one of the first metallic bonding structures 928 and the second metallic bonding structures 728. Within the ninth exemplary structure illustrated in FIG. 44, the limited volume of a cavity between each mating pair of a first metallic bonding structure 928 and a second metallic bonding structure 728 limits the volume expansion of each of the first metallic bonding structure 928 and the second metallic bonding structure 728. Since the vertical displacement of the center segments of the top surfaces of the first metallic bonding structure 928 and the second metallic bonding structure 728 is greater than the vertical displacement of the peripheral segments of the top surfaces of the first metallic bonding structure 928 and the second metallic bonding structure 728 during an initial phase of the volume expansion of the first metallic bonding structure 928 and the second metallic bonding structure 728, the center segments of the top surfaces of the first metallic bonding structure 928 and the second metallic bonding structure 728 contact each other first prior to contact between peripheral portions of the top surfaces of the first metallic bonding structure 928 and the second metallic bonding structure 728. As such, each bonding interface is formed at a center area of a respective mating pair of a first metallic bonding structure 928 and a second metallic bonding structure 728, and grows toward the periphery of each cavity between the mating pair of the first metallic bonding structure 928 and the second metallic bonding structure 728 until the entire volume of the respective cavity is filled with the first metallic bonding structure 928 and the second metallic bonding structure 728.

In one embodiment, a first bonding-level dielectric layer (970 or 770) and a second bonding-level dielectric layer (770 or 970) may optionally be bonded to each other through oxide-to-oxide bonding in which a silicon oxide material within the first bonding-level dielectric layer (970 or 770) is bonded to a silicon oxide material within the second bonding-level dielectric layer (770 or 970). In one embodiment, one of the first semiconductor die (900 or 700) and the second semiconductor die (700 or 900) comprises a memory die 900 including a three-dimensional array of memory elements located within an alternating stack of insulating layers 32 and electrically conductive layers 46; and another of the first semiconductor die (900 or 700) and the second semiconductor die (700 or 900) comprises a logic die 700 including a peripheral circuit that is configured to control operation of the three-dimensional array of memory elements. In one embodiment, bonded pairs of the first metallic bonding structures (928 or 728) and the second metallic bonding structures (728 or 928) provide electrically conductive paths for electrical signals between the peripheral circuit and the three-dimensional array of memory elements.

Referring to FIG. 45, the ninth exemplary structure is illustrated after bonding the memory die 900 to the logic die 700 in case the overlay error for bonding between the memory die 900 and the logic die 700 is about 60% of the lateral dimension (such as the first lateral dimension LD1 or the third lateral dimension LD3) of one the memory dies 900 and the logic dies 700. One of the advantages of embodiments of the present disclosure is that the metal-to-metal bonding between the metallic bonding structures (928, 728) can proceed even if the overlay error between the memory die 900 and the logic die 700 is large because significant vertical protrusions of the top surfaces of the metallic bonding structures (928, 728) occur over a large central area of each of the metallic bonding structures (928, 728). Thus, enhanced metal-to-metal bonding characteristics can be provided even if the overlay error between the mating pair of semiconductor dies (900, 700) is relatively large.

Referring to FIG. 46, the first substrate 908 may optionally be thinned from the backside by grinding, polishing, an anisotropic etch, or an isotropic etch. The thinning process can continue until horizontal portions of the through-substrate liners 386 are removed, and horizontal surfaces of the through-substrate via structures 388 are physically exposed. Generally, end surfaces of the through-substrate via structures 388 can be physically exposed by thinning the backside of the first substrate 908, which may be the substrate of a memory die. The thickness of the first substrate 908 after thinning may be in a range from 1 micron to 30 microns, such as from 2 microns to 15 microns, although lesser and greater thicknesses can also be employed.

A backside insulating layer 930 may be formed on the backside of the first substrate 908. The backside insulating layer 930 includes an insulating material such as silicon oxide. The thickness of the backside insulating layer 930 can be in a range from 50 nm to 500 nm, although lesser and greater thicknesses can also be employed. A photoresist layer (not shown) may be applied over the backside insulating layer 930, and may be lithographically patterned to form opening over areas of the through-substrate via structures 388. An etch process can be performed to form via cavities through the backside insulating layer 930 underneath each opening in the photoresist layer. A top surface of a through-substrate via structure 388 can be physically exposed at the bottom of each via cavity through the backside insulating layer 930.

At least one metallic material can be deposited into the openings through the backside insulating layer 930 and over the planar surface of the backside insulating layer 930 to form a metallic material layer. The at least one metallic material can include copper, aluminum, ruthenium, cobalt, molybdenum, and/or any other metallic material that may be deposited by physical vapor deposition, chemical vapor deposition, electroplating, vacuum evaporation, or other deposition methods. For example, a metal or metallic nitride liner material (such as Ti, Ta, TiN, TaN, WN or combination thereof) may be deposited directly on the physically exposed surfaces of the through-substrate via structures 388, on sidewalls of the openings through the backside insulating layer 930, and over the physically exposed planar surface of the backside insulating layer 930. The thickness of the metallic nitride liner material can be in a range from 10 nm to 100 nm, although lesser and greater thicknesses can also be employed. At least one metallic fill material such as copper or aluminum can be deposited over the metallic nitride liner material. In one embodiment, the at least one metallic fill material can include a stack of a high-electrical-conductivity metal layer (such as a copper layer or an aluminum layer) and an underbump metallurgy (UBM) layer stack for bonding a solder ball thereupon. Exemplary UBM layer stacks include, but are not limited to, an Al/Ni/Au stack, an Al/Ni/Cu stack, a Cu/Ni/Au stack, a Cu/Ni/Pd stack, a Ti/Ni/Au stack, a Ti/Cu/Ni/Au stack, a Ti—W/Cu stack, a Cr/Cu stack, and a Cr/Cu/Ni stack. The thickness of the metallic material layer over the planar horizontal surface of the backside insulating layer 930 can be in a range from 0.5 microns to 10 microns, such as from 1 micron to 5 microns, although lesser and greater thicknesses can also be employed.

The at least one metallic fill material and the metallic material layer can be subsequently patterned to form discrete backside bonding pads 936 contacting a respective one of the through-substrate via structures 388. The backside bonding pads 936 can function as external bonding pads that can be employed to electrically connect various nodes of within the first semiconductor die 900 and the second semiconductor die 700 to external nodes, such as bonding pads on a packaging substrate or C4 bonding pads of another semiconductor die. For example, solder material portions 938 can be formed on the backside bonding pads 936, and a C4 bonding process or a wire bonding process can be performed to electrically connect the backside bonding pads 936 to external electrically active nodes.

Referring to FIG. 47, a memory die 900 for forming a tenth exemplary structure according to an embodiment of the present disclosure is illustrated. The memory die 900 illustrated in FIG. 47 can be derived from the memory die 900 illustrated in FIG. 35 by omitting the first pad-level diffusion barrier layer 972 and thus forming the first bonding-level dielectric layer 970 as a homogeneous dielectric material layer having a homogeneous material composition throughout. In one embodiment, the first bonding-level dielectric layer 970 may be a first silicon oxide layer consisting essentially of a silicon oxide material. According to an aspect of the present disclosure, the first metallic bonding structures 928 may be formed in any of the configurations illustrated in FIGS. 48A-48C, 49A-49C, or 50A-50C.

Referring to FIGS. 48A-48C, a first configuration of a first metallic bonding structure 928 in the memory die 900 of FIG. 47 is illustrated. The first configuration of the first metallic bonding structure 928 illustrated in FIGS. 48A-48C may be the same as the first configuration of the first metallic bonding structure illustrated in FIGS. 36A-36C except for formation of the first bonding-level dielectric layer 970 as a homogeneous dielectric material layer having a homogeneous material composition throughout. Generally, the vertical cross-sectional profiles of the first metallic bonding structure 928 of FIGS. 48A-48C in an anneal without limitations on volume expansion can be the same as the vertical cross-sectional profiles of the first metallic bonding structure 928 as illustrated in FIGS. 36D and 36E.

Referring to FIGS. 49A-49C, a second configuration of a first metallic bonding structure 928 in the memory die 900 of FIG. 47 is illustrated. The second configuration of the first metallic bonding structure 928 illustrated in FIGS. 49A-49C may be the same as the second configuration of the first metallic bonding structure illustrated in FIGS. 37A-37C except for formation of the first bonding-level dielectric layer 970 as a homogeneous dielectric material layer having a homogeneous material composition throughout. Generally, the vertical cross-sectional profiles of the first metallic bonding structure 928 of FIGS. 49A-49C in an anneal without limitations on volume expansion can be the same as the vertical cross-sectional profiles of the first metallic bonding structure 928 as illustrated in FIGS. 37D and 37E.

Referring to FIGS. 50A-50C, a third configuration of a first metallic bonding structure 928 in the memory die 900 of FIG. 47 is illustrated. The third configuration of the first metallic bonding structure 928 illustrated in FIGS. 50A-50C may be the same as the third configuration of the first metallic bonding structure illustrated in FIGS. 38A-38C except for formation of the first bonding-level dielectric layer 970 as a homogeneous dielectric material layer having a homogeneous material composition throughout. Generally, the vertical cross-sectional profiles of the first metallic bonding structure 928 of FIGS. 50A-50C in an anneal without limitations on volume expansion can be the same as the vertical cross-sectional profiles of the first metallic bonding structure 928 as illustrated in FIGS. 38D and 38E.

Referring collectively to FIGS. 48A-48C, 49A-49C, and 50A-50C, as discussed above and without wishing to be bound by a particular theory, it is believed that copper expansion during the bonding anneal can be expressed by the following equation: expansion=(CTE_(Cu)−CTE_(BDL)) (T_(b)−T_(r)) (h), where CTE_(Cu) is the coefficient of thermal extension of copper, CTE_(BDL) is the coefficient of thermal expansion of the first bonding-level dielectric layer 970, T_(b) is the bonding anneal temperature, T_(r) is room temperature and h is the height of copper. For example, the coefficient of thermal expansion of copper, silicon dioxide and silicon nitride is 16.4, 0.65 and 2.8, respectively. By omitting the relatively high CTE silicon nitride layer 972 while retaining the relatively low CTE silicon dioxide, the total value of CTE_(BDL) is reduced. Thus, the omission of the silicon nitride layer 972 is believed to further increase the copper expansion.

Referring to FIG. 51, a logic die 700 for forming a tenth exemplary structure according to an embodiment of the present disclosure is illustrated. The logic die 700 illustrated in FIG. 51 can be derived from the logic die 700 illustrated in FIG. 39 by omitting the silicon nitride layer 772 and forming the second bonding-level dielectric layer 770 as a homogeneous dielectric material layer having a homogeneous material composition throughout. In one embodiment, the second bonding-level dielectric layer 770 may be a first silicon oxide layer consisting essentially of a silicon oxide material. According to an aspect of the present disclosure, the first metallic bonding structures 728 may be formed in any of the configurations illustrated in FIGS. 52A-52C, 53A-53C, or 54A-54C.

Referring to FIGS. 52A-52C, a first configuration of a first metallic bonding structure 728 in the logic die 700 of FIG. 51 is illustrated. The first configuration of the first metallic bonding structure 728 illustrated in FIGS. 52A-52C may be the same as the first configuration of the first metallic bonding structure illustrated in FIGS. 40A-40C except for formation of the second bonding-level dielectric layer 770 as a homogeneous dielectric material layer having a homogeneous material composition throughout. Generally, the vertical cross-sectional profiles of the first metallic bonding structure 728 of FIGS. 52A-52C in an anneal without limitations on volume expansion can be the same as the vertical cross-sectional profiles of the first metallic bonding structure 728 as illustrated in FIGS. 40D and 40E.

Referring to FIGS. 53A-53C, a second configuration of a first metallic bonding structure 728 in the logic die 700 of FIG. 51 is illustrated. The second configuration of the first metallic bonding structure 728 illustrated in FIGS. 53A-53C may be the same as the second configuration of the first metallic bonding structure illustrated in FIGS. 41A-41C except for formation of the second bonding-level dielectric layer 770 as a homogeneous dielectric material layer having a homogeneous material composition throughout. Generally, the vertical cross-sectional profiles of the first metallic bonding structure 728 of FIGS. 53A-53C in an anneal without limitations on volume expansion can be the same as the vertical cross-sectional profiles of the first metallic bonding structure 728 as illustrated in FIGS. 41D and 41E.

Referring to FIGS. 54A-54C, a third configuration of a first metallic bonding structure 728 in the logic die 700 of FIG. 51 is illustrated. The third configuration of the first metallic bonding structure 728 illustrated in FIGS. 52A-52C may be the same as the third configuration of the first metallic bonding structure illustrated in FIGS. 42A-42C except for formation of the second bonding-level dielectric layer 770 as a homogeneous dielectric material layer having a homogeneous material composition throughout. Generally, the vertical cross-sectional profiles of the first metallic bonding structure 728 of FIGS. 54A-54C in an anneal without limitations on volume expansion can be the same as the vertical cross-sectional profiles of the first metallic bonding structure 728 as illustrated in FIGS. 42D and 42E.

Referring to FIG. 55, a tenth exemplary structure can be provided by aligning a first wafer including a plurality of the memory dies 900 and a second wafer including a plurality of logic dies 700 for bonding, as described above with respect to FIG. 43.

Referring to FIG. 56, each mating pair of a memory die 900 and a logic die 700 can be bonded to each other by metal-to-metal bonding such as copper-to-copper bonding, as described above with respect to FIG. 44. FIG. 56 illustrates a case in which the overlay error for bonding between the memory die 900 and the logic die 700 is zero.

Referring to FIG. 57, the tenth exemplary structure is illustrated after bonding the memory die 900 to the logic die 700 in case the overlay error for bonding between the memory die 900 and the logic die 700 is about 60% of the lateral dimension (such as the first lateral dimension LD1 or the third lateral dimension LD3) of one the memory dies 900 and the logic dies 700, as discussed above with respect to FIG. 45.

Referring to FIG. 58, the steps described above with respect to FIG. 46 may be performed.

FIGS. 59A-59C are various views of a comparative exemplary metallic bonding structure 928 that may be employed in the memory die 900 of FIG. 35. The comparative exemplary metallic bonding structure 928 can be derived from the first configuration of the exemplary metallic bonding structure 928 illustrated in FIGS. 36A-36C by forming the via portion of the comparative exemplary bonding structure 928 with sidewalls having the first taper angle cd. In this case, the via cavity portion may be etched employing the same etch chemistry as the pad cavity portion so that the all sidewalls of the pad cavity portion and the via cavity portion have the same taper angle, i.e., the first taper angle cd. In this case, the first taper angle α1 may be 10 degrees or less, such as in a range from 0.1 degree to 10 degrees, such as from 0.5 degrees to 5 degrees.

Further, the ratio of the second lateral dimension LD2 to the first lateral dimension LD1 is less than 0.3, and may be in a range from 0.1 to 0.3, such as from 0.15 to 0.25. In addition, the ratio of the fourth lateral dimension LD4 to the third lateral dimension LD3 is less than 0.3, and may be in a range from 0.1 to 0.3, such as from 0.15 to 0.25. Each of the first lateral dimension LD1 and the third lateral dimension LD3 may be in a range from 100 nm to 1,000 nm, although lesser and greater lateral dimensions may also be employed. The ratio of the third lateral dimension LD3 to the first lateral dimension LD1 may be in a range from 0.5 to 2.0, such as from 0.8 to 1.25. In one embodiment, the ratio of the third lateral dimension LD3 to the first lateral dimension LD1 may be 1 or about 1.

Referring to FIGS. 59D and 59E, vertical cross-sectional profiles are illustrated for a hypothetical structure that would be obtained by annealing the comparative exemplary configuration of the first metallic bonding structure 928 at an elevated temperature that is sufficient to induce metal-to-metal bonding (such as 400 degrees Celsius). The vertical cross-sectional profile illustrated in FIG. 59D is along a vertical cut plane that corresponds to the vertical plane A-A′ in FIG. 59C. The vertical cross-sectional profile illustrated in FIG. 59E is along a vertical cut plane that corresponds to the vertical plane B-B′ of FIG. 59C. Generally, the vertical extent of the volume expansion of the first metallic bonding structure 928 is dependent on the thickness of the metallic fill material in the metallic fill material portion 928B. Thus, a segment of the top surface of the first metallic bonding structure 928 that has an areal overlap with the via portion of the first metallic bonding structure 928 protrudes upward more than a segment of the top surface of the first metallic bonding structure 928 that does not have an areal overlap with the via portion of the first metallic bonding structure 928.

In one embodiment, the top surface of the first metallic bonding structure 928 can have a double convex profile having a central convex segment having a greater curvature (and thus, having a smaller radius of curvature) and a frame-shaped peripheral convex segment having a lesser curvature (and thus, having a larger radius of curvature). The maximum protrusion height of the central convex segment is herein referred to as a first height h1′. The maximum protrusion height of the frame-shaped peripheral convex segment within a vertical cross-sectional profile along the first horizontal direction hd1 is herein referred to as a second height h2′. The maximum protrusion height of the frame-shaped peripheral convex segment within a vertical cross-sectional profile along the second horizontal direction hd2 is herein referred to as a third height h3′.

Height h1′ of the comparative example may be less than height h1 of the embodiment of the present disclosure shown in FIG. 36D due to the smaller taper of the via contact portion sidewalls and the smaller distances LD2 and LD4. Thus, the length and width of the central convex segment of the comparative example are smaller than those of the embodiment of the present disclosure. Therefore, the expansion of copper in the embodiment of the present disclosure is greater than in the comparative example.

Generally, the ratio of the first height h1′ to the second height h2′ increases with an increase in the ratio of the first vertical dimension to the second vertical dimension. The ratio of the first height h1′ to the third height h3′ increases with an increase in the ratio of the first vertical dimension to the second vertical dimension. In one embodiment, the ratio of the first height h1′ to the second height h2′ may be in a range from 1.05 to 1.8, such as from 1.1 to 1.4. The ratio of the first height h1′ to the third height h3′ may be in a range from 1.05 to 1.8, such as from 1.1 to 1.4. Generally, the ratio of the first height h1′ to the second height h2′ and the ratio of the first height h1′ to the third height h3′ in the comparative exemplary configuration of first metallic bonding structure 928 is significantly less than the ratio of the first height h1 to the second height h2 and the ratio of the first height h1 to the third height h′ in the various configuration of first metallic bonding structure 928 described above. The same feature is present if a comparative exemplary configuration of a metallic bonding structure is formed in the memory die 900 illustrated in FIG. 47, or in the logic die 700 illustrated in FIG. 39 or in FIG. 51. The ratio of the second lateral direction LD2 to the first lateral dimension LD1 may be in a range from 0.1 to 0.3. The ratio of the fourth lateral direction LD4 to the third lateral dimension LD3 may be in a range from 0.1 to 0.3.

The configurations of the metallic bonding structures (928, 728) of embodiments of the present disclosure provide improved copper extension and thus an advantageous bonding profiles especially when two semiconductor dies (900, 700) are bonded to each other with a significant overlay error during bonding.

FIG. 60A is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of comparative metallic bonding structures having the configuration of FIGS. 59A-59C during an anneal process in case the overlay error is zero. FIG. 60B is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of comparative metallic bonding structures having the configuration of FIGS. 59A-59C during an anneal process in case the overlay error is 154 nm and the lateral dimension of each comparative exemplary metallic bonding structures is 165 nm. Comparison of FIGS. 60A and 60B shows that the comparative configurations for the metallic bonding structures (928, 728) provide suitable metal-to-metal bonding when the overlay error is zero, but does not provide metal-to-metal bonding when the overlay error is significant.

FIG. 60C is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of exemplary metallic bonding structures in the ninth exemplary structure illustrated in FIG. 44 during an anneal process in case the overlay error is zero. FIG. 60D is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of exemplary metallic bonding structures in the ninth exemplary structure illustrated in FIG. 45 during an anneal process in case the overlay error is 150 nm. Comparison of FIGS. 60C and 60D shows that the configurations for the metallic bonding structures (928, 728) of the embodiment of the present disclosure employed in the ninth exemplary structure provide suitable metal-to-metal bonding when the overlay error is zero, and provides adequate metal-to-metal bonding even when the overlay error is significant.

FIG. 60E is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of exemplary metallic bonding structures in the tenth exemplary structure illustrated in FIG. 56 during an anneal process in case the overlay error is zero. FIG. 60F is a diagram illustrating simulated vertical displacement profiles of copper surfaces of mating pairs of exemplary metallic bonding structures in the tenth exemplary structure illustrated in FIG. 57 during an anneal process in case the overlay error is 150 nm. Comparison of FIGS. 60E and 60F shows that the configurations for the metallic bonding structures (928, 728) of the embodiments of the present disclosure employed in the tenth exemplary structure provide suitable metal-to-metal bonding when the overlay error is zero, and provides adequate metal-to-metal bonding even when the overlay error is significant.

Referring collectively to FIGS. 35-60F and all related drawings and according to various embodiments of the present disclosure, a bonded assembly is provided, which comprises: a first semiconductor die (900 or 700) that comprises first semiconductor devices (920 or 720), first interconnect-level dielectric material layers (960 or 760) embedding first metal interconnect structures (980 or 780), and first metallic bonding structures (928 or 728) embedded within a first bonding-level dielectric layer (970 or 770); and a second semiconductor die (700 or 900) that comprises second semiconductor devices (720 or 920), second interconnect-level dielectric material layers (760 or 960) embedding second metal interconnect structures (780 or 980), and second metallic bonding structures (728 or 928) embedded within a second bonding-level dielectric layer (770 or 970) and bonded to the first metallic bonding structures (928 or 728) by metal-to-metal bonding. One of the first metallic bonding structures (928 or 728) comprises a pad portion (928P or 728P), and a via portion (928V or 728V) located between the pad portion and the first semiconductor devices, the via portion having second tapered sidewalls (22 or 82).

In one embodiment, the pad portion (928P or 728P) has first tapered sidewalls (21 or 81) that are laterally spaced apart along a first horizontal direction hd1, laterally extending along a second horizontal direction hd2, and having a first taper angle (α1 oρ β1) with respective to a vertical direction; and second tapered sidewalls (22 or 82) that are laterally spaced apart along the first horizontal direction hd1, laterally extending along the second horizontal direction hd2, having top edges located within a horizontal plane including bottom edges of the first tapered sidewalls (21 or 81), and having a second taper angle (α2 oρ β2) within respect to the vertical direction, and wherein the second taper angle (α2 oρ β2) is greater than the first taper angle (α1 oρ β1) by at least a factor of 3, and is in a range from 25 degrees to 55 degrees.

In one embodiment, top edges of the second tapered sidewalls (22 or 82) coincide with bottom edges of the first tapered sidewalls (21 or 81).

In one embodiment, the top edges of the second tapered sidewalls (22 or 82) are connected to bottom edges of the first tapered sidewalls (21 or 81) by horizontally-extending surface segments of the one of the first metallic bonding structures (928 or 728).

In one embodiment, the pad portion (928P or 728P) comprises third tapered sidewalls (23 or 83) that are laterally spaced apart along the second horizontal direction hd2, laterally extending along the first horizontal direction hd1, adjoined to non-horizontal edges of the first tapered sidewalls (21 or 81), and having the first taper angle (α1 oρ β1) with respective to a vertical direction. The via portion (928V or 728V) comprises fourth tapered sidewalls (24 or 84) that are laterally spaced apart along the second horizontal direction hd2, laterally extending along the first horizontal direction hd1, having top edges that are adjoined to bottom edges of the third tapered sidewalls (23 or 83), and having the second taper angle (α2 oρ β2) within respect to the vertical direction.

In one embodiment, the one of the first metallic bonding structures (928 or 728) comprises a bottom surface having a periphery that is adjoined to bottom edges of the second tapered sidewalls (22 or 82). In one embodiment, the bottom surface of the one of the first metallic bonding structures (928 or 728) is in contact with a top surface of one of the first metal interconnect structures (980 or 780).

In one embodiment, the first semiconductor die (900 or 700) comprises a first silicon carbide nitride interconnect-capping dielectric diffusion barrier layer (962 or 762) located between the first interconnect-level dielectric material layers (960 or 760) and the first bonding-level dielectric layer (970 or 770); the second tapered sidewalls (22 or 82) are in contact with the first interconnect-capping dielectric diffusion barrier layer (962 or 762); and the second tapered sidewalls (22 or 82) are vertically offset from the first interconnect-capping dielectric diffusion barrier layer (962 or 762).

In one embodiment, the pad portion (982P or 928V) has a length LD1 which extends along the first horizontal direction hd1 which is longer than a width LD3 which extends along the second horizontal direction hd2. Thus, the pad portion is a non-square rectangle in top view.

In one embodiment, each of the first tapered sidewalls (21 or 81) has a first vertical distance (vd1 or vd1′) between a respective top edge and a respective bottom edge; each of the second tapered sidewalls (22 or 82) has a second vertical distance (vd2 or vd2′) between a respective top edge and a respective bottom edge; and a ratio of the first vertical distance (vd1 or vd1′) to the second vertical distance (vd2 or vd2′) is in a range from 1.25 to 4.

In one embodiment, the first bonding-level dielectric layer (970 or 770) comprises a layer stack including, from a side that is proximal to the first semiconductor devices (920 or 720) to a side that is distal from the first semiconductor devices (920 or 720): a first silicon oxide layer (971 or 771); a silicon nitride layer (972 or 772); and a second silicon oxide layer (973 or 773) having a thickness that is greater than a sum of a thickness of the first silicon oxide layer (971 or 771) and a thickness of the silicon nitride layer (972 or 772).

In one embodiment, the horizontal plane including the bottom edges of the first tapered sidewalls (21 or 81) is located between a top surface of the first silicon oxide layer (971 or 771) and a bottom surface of the first silicon oxide layer (971 or 771).

In one embodiment, the first bonding-level dielectric layer (970 or 770) and the second bonding-level dielectric layer (770 or 970) are bonded to each other through oxide-to-oxide bonding in which a silicon oxide material within the first bonding-level dielectric layer (970 or 770) is bonded to a silicon oxide material within the second bonding-level dielectric layer (770 or 970).

In one embodiment, the first taper angle (α1 oρ β1) is in a range from 0.1 degree to 10 degrees; and the second taper angle (α2 oρ β2) is in a range from 26 degrees to 52 degrees.

In one embodiment, one of the first semiconductor die (900 or 700) and the second semiconductor die (700 or 900) comprises a memory die 900 including a three-dimensional array of memory elements located within an alternating stack of insulating layers 32 and electrically conductive layers 46; and another one of the first semiconductor die (900 or 700) and the second semiconductor die (700 or 900) comprises a logic die 700 including a peripheral circuit that is configured to control operation of the three-dimensional array of memory elements, wherein bonded pairs of the first metallic bonding structures (928 or 728) and the second metallic bonding structures (728 or 928) provide electrically conductive paths for electrical signals between the peripheral circuit and the three-dimensional array of memory elements.

The various embodiments of the present disclosure may be employed to increase the bonding strength between mating pairs of metallic bonding structures (928, 728). According to an aspect of the present disclosure, the metallic bonding structures (928, 728) provide a vertical protrusion of bonding surfaces over a wider area than comparative exemplary structures, and enable adequate bonding between mating pairs of metallic bonding structures (928, 728) even when an overlay error, i.e., lateral shift of one metallic bonding structure relative to another, is significant, and the mating pairs of metallic bonding structures are misaligned.

Although the foregoing refers to particular embodiments, it will be understood that the disclosure is not so limited. It will occur to those of ordinary skill in the art that various modifications may be made to the disclosed embodiments and that such modifications are intended to be within the scope of the disclosure. Compatibility is presumed among all embodiments that are not alternatives of one another. The word “comprise” or “include” contemplates all embodiments in which the word “consist essentially of” or the word “consists of” replaces the word “comprise” or “include,” unless explicitly stated otherwise. Where an embodiment using a particular structure and/or configuration is illustrated in the present disclosure, it is understood that the present disclosure may be practiced with any other compatible structures and/or configurations that are functionally equivalent provided that such substitutions are not explicitly forbidden or otherwise known to be impossible to one of ordinary skill in the art. All of the publications, patent applications and patents cited herein are incorporated herein by reference in their entirety. 

1. A bonded assembly, comprising: a first semiconductor die that comprises first semiconductor devices, first interconnect-level dielectric material layers embedding first metal interconnect structures, and first metallic bonding structures embedded within a first bonding-level dielectric layer; and a second semiconductor die that comprises second semiconductor devices, second interconnect-level dielectric material layers embedding second metal interconnect structures, and second metallic bonding structures embedded within a second bonding-level dielectric layer and bonded to the first metallic bonding structures by metal-to-metal bonding, wherein one of the first metallic bonding structures comprises: a pad portion; and a via portion located between the pad portion and the first semiconductor device, the via portion having second tapered sidewalls.
 2. The bonded assembly of claim 1, wherein: the pad portion has first tapered sidewalls that are laterally spaced apart along a first horizontal direction, laterally extending along a second horizontal direction, and having a first taper angle with respective to a vertical direction; and the via portion has the second tapered sidewalls that are laterally spaced apart along the first horizontal direction, laterally extending along the second horizontal direction, having top edges located within a horizontal plane including bottom edges of the first tapered sidewalls, and having a second taper angle within respect to the vertical direction; and the second taper angle is greater than the first taper angle by at least a factor of 3, and is in a range from 25 degrees to 55 degrees.
 3. The bonded assembly of claim 2, wherein the top edges of the second tapered sidewalls are connected to bottom edges of the first tapered sidewalls by horizontally-extending surface segments of the one of the first metallic bonding structures.
 4. The bonded assembly of claim 3, wherein: the pad portion further comprises third tapered sidewalls that are laterally spaced apart along the second horizontal direction, laterally extending along the first horizontal direction, adjoined to non-horizontal edges of the first tapered sidewalls, and having the first taper angle with respective to a vertical direction; and the via portion further comprises fourth tapered sidewalls that are laterally spaced apart along the second horizontal direction, laterally extending along the first horizontal direction, having top edges that are adjoined to bottom edges of the third tapered sidewalls, and having the second taper angle within respect to the vertical direction.
 5. The bonded assembly of claim 2, wherein top edges of the second tapered sidewalls coincide with bottom edges of the first tapered sidewalls.
 6. The bonded assembly of claim 2, wherein the one of the first metallic bonding structures comprises a bottom surface having a periphery that is adjoined to bottom edges of the second tapered sidewalls.
 7. The bonded assembly of claim 6, wherein the bottom surface of the one of the first metallic bonding structures is in contact with a top surface of one of the first metal interconnect structures.
 8. The bonded assembly of claim 2, wherein: the first semiconductor die comprises a first silicon carbide nitride interconnect-capping dielectric diffusion barrier layer located between the first interconnect-level dielectric material layers and the first bonding-level dielectric layer; the second tapered sidewalls are in contact with the first interconnect-capping dielectric diffusion barrier layer; and the second tapered sidewalls are vertically offset from the first interconnect-capping dielectric diffusion barrier layer.
 9. The bonded assembly of claim 2, wherein the pad portion has a length which extends along the first horizontal direction which is longer than a width which extends along the second horizontal direction.
 10. The bonded assembly of claim 2, wherein: each of the first tapered sidewalls has a first vertical distance between a respective top edge and a respective bottom edge; each of the second tapered sidewalls has a second vertical distance between a respective top edge and a respective bottom edge; and a ratio of the first vertical distance to the second vertical distance is in a range from 1.25 to
 4. 11. The bonded assembly of claim 2, wherein the first bonding-level dielectric layer comprises a layer stack including, from a side that is proximal to the first semiconductor devices to a side that is distal from the first semiconductor devices: a first silicon oxide layer; a silicon nitride layer; and a second silicon oxide layer having a thickness that is greater than a sum of a thickness of the first silicon oxide layer and a thickness of the silicon nitride layer.
 12. The bonded assembly of claim 11, wherein the horizontal plane including the bottom edges of the first tapered sidewalls is located between a top surface of the first silicon oxide layer and a bottom surface of the first silicon oxide layer.
 13. The bonded assembly of claim 2, wherein: the first taper angle is in a range from 0.1 degree to 10 degrees; and the second taper angle is in a range from 26 degrees to 52 degrees.
 14. The bonded assembly of claim 1, wherein: one of the first semiconductor die and the second semiconductor die comprises a memory die including a three-dimensional array of memory elements located within an alternating stack of insulating layers and electrically conductive layers; and another one of the first semiconductor die and the second semiconductor die comprises a logic die including a peripheral circuit that is configured to control operation of the three-dimensional array of memory elements, wherein bonded pairs of the first metallic bonding structures and the second metallic bonding structures provide electrically conductive paths for electrical signals between the peripheral circuit and the three-dimensional array of memory elements.
 15. A method of forming a bonded assembly, comprising: forming a first semiconductor die, wherein the first semiconductor die comprises first semiconductor devices, first interconnect-level dielectric material layers embedding first metal interconnect structures, and first metallic bonding structures embedded within a first bonding-level dielectric layer, wherein one of the first metallic bonding structures comprises: first tapered sidewalls that are laterally spaced apart along a first horizontal direction, laterally extending along a second horizontal direction, and having a first taper angle with respective to a vertical direction; and second tapered sidewalls that are laterally spaced apart along the first horizontal direction, laterally extending along the second horizontal direction, having top edges located within a horizontal plane including bottom edges of the first tapered sidewalls, and having a second taper angle within respect to the vertical direction, and wherein the second taper angle is greater than the first taper angle at by least a factor of 3, and is in a range from 25 degrees to 55 degrees; providing a second semiconductor die, the second semiconductor die comprising second semiconductor devices, second interconnect-level dielectric material layers embedding second metal interconnect structures, and second metallic bonding structures embedded within a second; and bonding the second metallic bonding structures to the first metallic bonding structures.
 16. The method of claim 15, wherein top edges of the second tapered sidewalls coincide with bottom edges of the first tapered sidewalls.
 17. The method of claim 15, wherein the top edges of the second tapered sidewalls are connected to bottom edges of the first tapered sidewalls by horizontally-extending surface segments of the one of the first metallic bonding structures.
 18. The method of claim 17, wherein the one of the first metallic bonding structures comprises: third tapered sidewalls that are laterally spaced apart along the second horizontal direction, laterally extending along the first horizontal direction, adjoined to non-horizontal edges of the first tapered sidewalls, and having the first taper angle with respective to a vertical direction; and fourth tapered sidewalls that are laterally spaced apart along the second horizontal direction, laterally extending along the first horizontal direction, having top edges that are adjoined to bottom edges of the third tapered sidewalls, and having the second taper angle within respect to the vertical direction.
 19. The method of claim 15, wherein the one of the first metallic bonding structures is formed with a bottom surface having a periphery that is adjoined to bottom edges of the second tapered sidewalls.
 20. The method of claim 19, wherein the bottom surface of the one of the first metallic bonding structures is formed directly on a top surface of one of the first metal interconnect structures. 